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Memory and CPU Sockets © 2009 Tyco Electronics Corporation. All Rights Reserved. TE logo and Tyco Electronics are trademarks. Other products, logos, and company names herein may be trademarks of their respective owners.

Memory and CPU Sockets - Farnell element14Market Environment CPU/Logic Sockets. • Standards driven by Intel and AMD • Markets include server, desktop and notebook • Primarily

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  • Memory and CPU Sockets

    © 2009 Tyco Electronics Corporation. All Rights Reserved.TE logo and Tyco Electronics are trademarks. Other products, logos, and company names herein may be trademarks of their respective owners.

  • Market Environment CPU/Logic Sockets• Standards driven by Intel and AMD• Markets include server, desktop and notebook• Primarily designed in the US• Consumed in Asia/Pacific• Multiple competitors and commodity pricing• Custom ASICs drive lower volume and

    higher mix

    AMD is a trademark of Advanced Micro Devices, Inc.Intel is a trademark of Intel Corporation.

  • TE Products for Intel Socket B – LGA 1366

    System of LGA1366 socket

    • Server socket (replaces Socket J – LGA 771)• Tyco Electronics’ provides three components for LGA1366socket system– Socket: 1981837-1(15au), 1981837-2(30au)– ILM: 1939738-1(U Lever), 1-1939738-2 (Straight Lever)– Stiffener plate: 1939739-1(DT); 1981467-1(SVR)

    Intel is a trademark of Intel Corporation.

  • CPU Socket Roadmap for (Intel & AMD)2008 2009

    Server

    Socket TW (1248)

    Socket J (771)

    Socket 700

    Socket G34

    Socket H1 (1156)Socket 775

    DesktopAM2 940

    μPGA 479 rPGA989, rPGA988A

    Notebook

    μPGA 638 Socket FS1 (722)

    AM3 941

    2010 2011 2013

    Socket 1207

    Socket R (2011)

    New AMD FM1 934

    Socket LS (1567)

    Socket 604

    rPGA988B

    Socket H2 (1155)

    Micro Contact Socket

    2012

    Socket B1/B2 (1356)

    rPGA988C rPGA II

    Socket B (1366)

    AMD is a trademark of Advanced Micro Devices, Inc.Intel is a trademark of Intel Corporation.

  • TE Products for Intel Socket H – LGA 1160

    • Next generation Intel desktop CPU• Replaces Socket T LGA 775• Tyco Electronics’ provides three components for LGA1366

    socket system– Socket: 2040540-1

    – ILM: 2013882-1

    – Stiffener Plate: 2013883-1

    Intel is a trademark of Intel Corporation.

  • TE Products for Socket G – rPGA 989

    • Mobile socket (replaces mPGA 479)• Part number 2013620-1

  • TE Products for AMD Socket G34 – LGA 1944

    • Next generation AMD server CPU• Replaces Socket F LGA 1207• Tyco Electronics’ provides two components for LGA 1944 socket

    system– Socket: 2069189-1 – ILM: 2069190-1

    AMD is a trademark of Advanced Micro Devices, Inc.

  • Memory Sockets

  • Market Environment Main Memory Sockets• Main Memory module designs are

    driven by JEDEC standards body.

    • Major memory module makers and computer OEMs are key participants insetting module designs.

    • Tyco Electronic’s product focus resides in DDR3

  • DDR3 DIMM LLCR Vertical Through Hole

    • 240 position• Retention barb aids during soldering• Low level contact resistance• Three solder tail lengths available• Accepts memory module per JEDEC MO-269• Used in servers and communications equipment

    Part NumberContact Plating

    Housing Color

    Extractor Color

    Tail Length Packaging

    1932031-1 Gold Flash Natural Natural 2.67 mm Tray1932031-2 Gold Flash Natural Natural 3.18 mm Tray1932031-3 Gold Flash Natural Natural 4.00 mm Tray1932031-4 Gold (15) Natural Natural 2.67 mm Tray1932031-5 Gold (15) Natural Natural 3.18 mm Tray1932031-6 Gold (15) Natural Natural 4.00 mm Tray1932031-7 Gold Flash Black Natural 2.67 mm Tray1932031-8 1932031-9

    Gold Flash Gold Flash

    Black Black

    Natural Natural

    3.18 mm 4.00 mm

    Tray Tray

    1-1932031-0 Gold (15) Black Natural 2.67 mm Tray1-1932031-1 Gold (15) Black Natural 3.18 mm Tray1-1932031-2 Gold (15) Black Natural 4.00 mm Tray1-1932031-3 Gold Flash Black Black 2.67 mm Tray1-1932031-4 Gold Flash Black Black 3.18 mm Tray1-1932031-5 Gold Flash Black Black 4.00 mm Tray1-1932031-6 Gold (15) Black Black 2.67 mm Tray1-1932031-7 Gold (15) Black Black 3.18 mm Tray1-1932031-8 Gold (15) Black Black 4.00 mm Tray1-1932031-9 Gold Flash Orange Natural 2.67 mm Tray2-1932031-0 Gold Flash Orange Natural 3.18 mm Tray

  • DDR3 DIMM Vertical Surface Mount• 240 position• Retention barb aids during soldering• Accepts memory module per JEDEC MO-269•Used in servers and communications equipment

    Part NumberContact Plating

    Housing Color

    Extractor Color Packaging

    2040727-1 Gold Flash Black Natural Tray2040727-4 Gold (15) Black Natural Tray2040727-5 Gold (30) Natural Natural Tray2040727-6 Gold (30) Black Black Tray2040727-7 Gold (30) Black Natural Tray

  • DDR3 SODIMM Right Angle Surface Mount• 204 position• Reverse and Standard module orientation options • Available in 4.0 mm and 5.2 mm heights• Accepts memory module per JEDEC MO-268• Small form factor enables development of

    smaller, lighter notebook PCs

    Part Number Std Keying

    Part Number Rvs Keying

    Contact Plating

    Housing Color Boss Packaging

    2013022-1 2013287-1 Gold flash Black With Tray2013022-2 2013287-2 Gold (6) Black With Tray2013022-3 2013287-3 Gold (30) Black With Tray1-2013022-4 1-2013287-4 Gold flash Gray Without Tray1-2013022-5 1-2013287-5 Gold (6) Gray Without Tray1-2013022-6 1-2013287-6 Gold (30) Gray Without Tray2-2013022-1 2-2013287-1 Gold flash Black With Reel2-2013022-2 2-2013287-2 Gold (6) Black With Reel2-2013022-3 2-2013287-3 Gold (30) Black With Reel3-2013022-4 3-2013287-4 Gold flash Gray Without Reel3-2013022-5 3-2013287-5 Gold (6) Gray Without Reel3-2013022-6 3-2013287-6 Gold (30) Gray Without Reel

    4.0 mm Height

    Part Number Std Keying

    Part Number Rvs Keying

    Contact Plating

    Housing Color Boss Packaging

    2013289-1 2013290-1 Gold flash Black With Tray2013289-2 2013290-2 Gold (6) Black With Tray2013289-3 2013290-3 Gold (30) Black With Tray1-2013289-4 1-2013290-4 Gold flash Gray Without Tray1-2013289-5 1-2013290-5 Gold (6) Gray Without Tray1-2013289-6 1-2013290-6 Gold (30) Gray Without Tray2-2013289-1 2-2013290-1 Gold flash Black With Reel2-2013289-2 2-2013290-2 Gold (6) Black With Reel2-2013289-3 2-2013290-3 Gold (30) Black With Reel3-2013289-4 3-2013290-4 Gold flash Gray Without Reel3-2013289-5 3-2013290-5 Gold (6) Gray Without Reel3-2013289-6 3-2013290-6 Gold (30) Gray Without Reel

    5.2 mm Height

  • Mini DIMM Right Angle Surface Mount

    • 244 position• Reverse and Standard module orientation options• Accepts 1.0 mm thick memory module per JEDEC

    MO-244 • Used in servers and communications equipment

    that require multiple small modules

    Part Number KeyingContact Plating Height

    Housing Color Packaging

    1735438-2 Reverse Gold (30) 9.79 mm Black Tray1735438-4 Standard Gold (30) 9.79 mm Black Tray1-1735438-2 Reverse Gold (15) 9.79 mm Black Tray1-1735438-4 Standard Gold (15) 9.79 mm Black Tray

    Memory and CPU SocketsMarket Environment �CPU/Logic SocketsTE Products for Intel Socket B – LGA 1366CPU Socket Roadmap for (Intel & AMD)Slide Number 5TE Products for Socket G – rPGA 989TE Products for AMD Socket G34 – LGA 1944Memory SocketsMarket Environment�Main Memory SocketsDDR3 DIMM LLCR Vertical Through HoleDDR3 DIMM Vertical Surface MountDDR3 SODIMM Right Angle Surface Mount�Mini DIMM Right Angle Surface Mount