Embed Size (px)
Citation preview
E220/E500 LX Productivity UPGRADE MANUAL
ME82284760/1/2/3, REV. A
Reorder information
ME82284761 - Cleanroom paper, E220/E500 LX Productivity Upgrade ManualME82284762 - Bond paper, E220/E500 LX ProductivityUpgrade Manual
ME82284763 - CD, E220/E500 LX Productivity Upgrade Manual
©2008
Varian Semiconductor Equipment
ii Revision A
E220/E500 LX Productivity Upgrade Manual
Revision A iii
Revision Control
Revision Tracking
REVISIONS
REV. DESCRIPTION APPROVAL/DATE
A ECO 40511 A. Calafut
APPROVALS DATE
Electrical Engineer:
Mechanical Engineer:
Project Engineer: Steven Green 4/9/08
Manufacturing Engineer:
Safety: Mark D’Agostino 4/10/2008
Technical Publications Manager: Paul Simmons
Section Revision Block(Refer to the Manual Revision History page at the end of this section for full details)
Section TOC 1 2 3 4 5 A B C D ERevision A A A A A A A A A A A
Varian Semiconductor Equipment
iv Revision A
FCC Compliance Information
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
CHANGES OR MODIFICATIONS NOT EXPRESSLY APPROVED BY THE PARTY RESPONSIBLE FOR COMPLIANCE COULD VOID THE USER'S AUTHORITY TO OPERATE THE EQUIPMENT.
E220/E500 LX Productivity Upgrade Manual
Revision A v
General Implanter Hazards
It is the responsibility of the user to maintain correct and safe operating conditions for this equipment at all times. Varian Semiconductor Equipment Associates assumes no liability for damages caused by improper or unsafe operation. Service of equipment must be performed by trained and authorized personnel only.
High Voltage HazardIon implanters employ voltages that are dangerous and may be fatal to personnel. Do not attempt to defeat the protective interlock systems. Keep unauthorized personnel away from the implanter area during high voltage servicing.
Cardiac Pacemaker HazardStrong magnetic fields can cause cardiac pacemakers to fail. The analyzer, source and corrector magnets produce strong magnetic fields.People with cardiac pacemakers must never work near strong magnetic fields.
Poisonous Gas HazardIon Implanters typically operate with gaseous sources containing Arsine, Phosphine, and Boron Trifluoride. Each element is highly toxic to humans even in minute concentrations. Evacuate the area immediately if the presence of any of these gases is suspected. Toxic residues and substances can be present on beamline, vacuum system and wafer handling components. Personnel must be protected by appropriate clothing when working on these components. A restricted area must be set aside for cleaning contaminated components. Residues and cleaning materials must be disposed of under procedures mandated for hazardous materials.
Radiation HazardThis equipment can produce dangerous levels of radiation when improperly operated. Do not exceed the maximum rated operating specifications. Do not remove or alter the position of X-ray shielding installed in any part of the implanter.
DANGER
DANGER
DANGER
WARNING
Varian Semiconductor Equipment
vi Revision A
Phosphorus Residue Fire HazardParts exposed to phosphorus-based dopants are coated with phosphorus residue. Striking a surface at an angle with a piece of metal generates a spark. The possibility of spontaneous ignition exists. The possibility of spontaneous high temperature oxidation, with exposure to air exists. Using flammable solvents or hydrogen peroxide to clean phosphorus residue is a fire hazard.Have a fire extinguisher available while parts are removed and during maintenance procedures. Eliminate sparking, arcing, open flames, and practices that strike or abrade the part. Do not use flammable solvents for cleaning. Thoroughly wash contaminated surfaces with DI water.
Mechanical HazardDrive assemblies have sufficient power to cause injury. Keep hands, fingers, clothing, and tools clear of moving parts. Disconnect air lines to pneumatic valves and install a stop when moving fingers, hands, or tools through these assemblies. Do not touch heated pump surfaces.
Incompatible Chemical Mixture Fire HazardMixing waste from cleaning processes (wipes, abrasive pads, and toxic residue) contaminated with flammable solvents, oxidizers, and phosphoric residue is a fire hazard. The possibility of spontaneous combustion, ignition, or spontaneous high temperature oxidation exists.Segregate materials contaminated with flammable solvents from materials contaminated with oxidizers. Segregate materials contaminated with phosphoric residue from materials contaminated with flammable solvents or oxidizers. Air-dry and dispose of these materials in separate self-extinguishing containers.
Chemical Acid Cleaner Reaction HazardChemical acid cleaners are very corrosive. Chemical acid cleaners react with source and beamline residues and can produce dangerous secondary effects.
WARNING
WARNING
WARNING
WARNING
Revision A xiii
Table of Contents
Manual Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i–xiiSection 1, Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–1
About the Upgrade Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–1E220/E500 LX Productivity Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–2
Benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–2Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–2Pre-Upgrade Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–3Upgrade Time Estimates. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1–3
Section 2, Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–1Overview of Safety Hazards and Hazard Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–1
Government Certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–1Hazard Labels (DANGER, WARNING, and CAUTION) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–2Safety Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–5Administrative Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–25Two Worker Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–27
Identification of Functional Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–28Electrical Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–28Third Party Electrical Hazards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–32Mechanical Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–33Third Party Mechanical Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–34Radiation Hazards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–35Toxic Gas Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–39Vacuum System Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–42Location of Hazardous Material Contact Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–43
Physical Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–45Burn Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–45Frostbite Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–46Ergonomic Hazards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–47Ergo Lift Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–49Working from Elevated Surfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–60
Chemical Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–61Material Safety Data Sheets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–61Common Chemicals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–61Toxic Pump Fluids/Contaminated Fluid Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–62Chemical Acid Cleaner Reaction Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–62Incompatible Chemical Mixture Fire Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–63Toxic Material Residue Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–63Toxic Residue Fire Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–64Source and Vaporizer Fire and Explosion Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–64
Environmental Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–65Environmentally Hazardous Waste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–65Regulated Solid Waste at Machine End of Life Cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–65Treatment of Toxic or Environmentally Hazardous Waste . . . . . . . . . . . . . . . . . . . . . . . . . . .2–66
Common Toxic Gases and Solids . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–68Environmental Regulatory Restriction Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–68Gases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–68Gas Warnings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–69Safety Precautions for BF3, PH3, and AsH3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–69Solids . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–71Solids Warnings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–72
Varian Semiconductor Equipment
xiv Revision A
Toxic Gas Reference Materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–72First Aid for Toxic Gas Exposures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–73Toxic Gas Incompatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–73
Spill Prevention Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–74Terminal Spill Prevention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–74End Station Spill Prevention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–74Terminal Leak Detection Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–74End Station Leak Detection Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–74
Earthquake Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–74Audio Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–74Industrial Hygiene Survey . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–75Lockout/Tagout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–76
OSHA Lockout/Tagout Standard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–76Lockout Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–78Tagout Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–80Sample Circuit Breaker Lockout/Tagout Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–81Energy Source Component Lockout/Tagout Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–83
Interlock Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–88EMO Interlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–88High Voltage Enclosure, High Voltage Interlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–98High Voltage Enclosure Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–98High Voltage Enclosure, Mechanical Drop Bars . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–107Toxic Exhaust Interlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–110Exhaust Current Leakage Interlock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–115Exhaust Current Leakage Interlock Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–116Target Door, Closure Interlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–121Smoke Detector Interlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–123
Shutdown and Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–127Emergency Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–127Shutdown and Start-Up Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2–128
Section 3, Theory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–1Fine Resolution Control of Q1 and Q2 Magnet Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . .3–1Gas Box Actuator Valves with Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–2New algorithms for beam tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–2Benefits of new algorithms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3–3
Section 4, Hardware Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–1Software required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–1Tools needed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–1
Shutdown the system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–2Safe Shutdown and Entry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–3Evacuating Gas Box Vacuum Lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–4Shut Off Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–5Replace valve actuators V1, V2, V3, V4, and V5 in the gas box . . . . . . . . . . . . . . . . . . . . . . .4–6Route harness to actuators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–8Test actuator switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–9Replace gas box side panel and top panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–9
Replace Q1/Q2 Magnet Control PCB’s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–10Potential Electric Shock Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–10Potential Electric Shock Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–12
Changing the Sense Wire Holder on Travelling Faraday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–14Sensor Bracket and Sensor Amplifier Adjustments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–16
Turn On Power supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–20Machine Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–20
Gas Flow Verification Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–21
Table of Contents
Revision A xv
Calibration Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–23Generic Magnet Power Supply Calibration Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–23Extraction Manipulator Alignment Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–25Setting Manipulator Limits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–42Magnet Constants Setup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–48Perform the TVL—DIAG test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4–53
Section 5, Software Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–1Machine configuration—ECO’s and Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–1Best Known Methods (BKM’s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–5Software screen changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–7
Changes to Beamline Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–7Changes to Gas Box Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–9Changes to Beam Tuning Configuration Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–10Changes to Source View and Beamline View Screens. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–11Changes to Chrono Log Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–11
Host Interface Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–13Changes to Beam Setup Sequence of Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–13Host Recipe Download . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–13Host Recipe Validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5–14
Appendix A, Bills Of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–1E11402320, UPG KIT, LX PROD, E220/E500 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–1E15010880, PCB ASSY, POWER SUPPLY CONTROLLER . . . . . . . . . . . . . . . . . . . . . . . . . A–1E16370350, HARNESS ASSY, GAS VALVE POSITION . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–4E11402290, KIT, UPG, E220/E500 RELEASE 13.50 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–4E11370400, ACTUATOR ASSY, W/LIMIT SWITCH, GAS BOX . . . . . . . . . . . . . . . . . . . . . . A–4
Appendix B, LX Upgrade Pre-Qualification Test Worksheet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–1Appendix C, LX Productivity Upgrade Acceptance Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–1
Pre Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–1Low Energy Test (Optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–2Acceptance Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–2
Appendix D, Gas Box Calibration Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–1Potential Electric Shock Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–1Evacuating Gas Box Vacuum Lines (Type 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–1Gas Bottle Pressure Gauge Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–2Gas Flow Control PCB Adjustments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–3
Appendix E, Drawings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E–1
Varian Semiconductor Equipment
xvi Revision A
Introduction
Revision A 1-1
Section 1, Introduction
About the Upgrade Manual
Welcome to the E220/E500 LX Productivity Upgrade Manual. This manual provides the information to understand the benefits and theory behind the upgrade and the procedures to safely install the upgrade.
Audience
This manual explains the full scope of the upgrade, including the benefits and the impact of installing the hardware. The manual is intended as a procedural installation guide to assist qualified installation technicians. Qualified installation technicians are trained and experienced with this model implanter. Qualified installation technicians have read and fully understand the Equipment Reference or Maintenance Manual’s descriptions of the hazards inherent on this implanter.
Manual Organization
See this section... For information about...
Section 1, Introduction A general description of the upgrade including features and benefits.
Section 2, Safety General safety information and safety information that is specific to this upgrade.
Section 3, Theory of Operation Description of new features.
Section 4, Installation Hardware installation.
Section 5, Software interface Software and screen changes.
Appendix A, Bill of Materials Bills of materials for this upgrade.
Appendix B, LX Upgrade Pre-Qualification Qualifying your machine for the upgrade
Appendix C, Acceptance Tests Acceptance tests for this upgrade.
Appendix D, Gas Box Calibration Procedure Gas box calibration.
Appendix E, Drawings Drawings and schematics for this upgrade.
Varian Semiconductor Equipment
1-2 Revision A
E220/E500 LX Productivity Upgrade
Benefits
This upgrade provides reduced recipe setup times up to 50% with success rates in the mid nineties. New algorithms have been written for Source, Beamline and Beam Scan routines and the recipe learn feature has been improved. This upgrade also provides usable beam currents with stable beams for 15keV and 10keV drift operation.
Features
• Reduces the number of full setups required for similar recipes
• Tuning always stays within recipe limits
• Monitors and corrects for parameter drift during implant
• Immediate error detection and correction
• No longer waits until implant to fail setup
• Recipe setup based on tuning rules
• Provides platform for future improvements in success rate
• Automatic recipe learn with increased accuracy
• Improved drift operation and setup
• Diagnostic tools to aid in identifying tuning failures
• New gas valve actuators report to software when the valve is closed for faster throughput
• Add fine control to Q1, Q2 lenses—doubles the resolution for low energy jobs
Prerequisites
• 1 GHz or 400 MHz computer
• EHP machine configuration
• End station sensors
• Solid state scan amp
• HP/EHP gas box
• TVL or VSEA traveling Faraday
Introduction
Revision A 1-3
Prior to the installation of this upgrade, review the recommended list of PMs from the system's Equipment Reference Manual and confirm that all PMs have been performed in accordance with VSEA recommendations.
Particular attention should be given to those PMs affecting:
Vacuum integrityHigh-voltage stabilityMagnet calibrationsUniformity/repeatabilitySource lifetime
The impact of PMs not performed in accordance with VSEA recommendations must be evaluated prior to commencing with this upgrade. Note that additional testing and components, beyond the normal scope of this upgrade, may be required to assure successful completion of the upgrade and expected performance.
Pre-Upgrade Requirements
LX Productivity Upgrade Pre-qualification Test
You must pre-qualify your machine before installing the LX Productivity software and hardware. A pre-qualification test worksheet is provided in Appendix B. The pre-qualification needs to be performed to detail and evaluate a candidate machine for the LX Productivity upgrade. Varian technical staff can then assess whether any adjustments are needed before the installation begins.
Acceptance Tests
Acceptance tests must be run before and after installation. Before starting the install you must collect pretest data from your machine for later verification to evaluate the success of the upgrade. These files may be sent to VSEA for analysis. See “Appendix C, LX Productivity Upgrade Acceptance Tests” for a description of the acceptance tests you must run.
Upgrade Time Estimates
• Upgrade install time: 4-6 Hours
Varian Semiconductor Equipment
1-4 Revision A
Theory of Operation
Revision A 3-1
Section 3, Theory
The LX Productivity Upgrade includes these enhancements:
• Fine resolution control of the Q1 and Q2 Magnet Power Supplies.
• New gas box valve actuators with a switch that signals when the valve is closed for faster throughput. Gas box hardware change allows faster gas flow processing and species changeover.
• Semiautomatic KLENS upgrade
• New Software Release V13.50 which adds many new features.
Fine Resolution Control of Q1 and Q2 Magnet Power Supplies
New PCB Controller boards installed at the back of the Q1 and Q2 magnet power supplies allow fine control of the magnet supply for tuning of low energy beams. The fine tuning for Q1 & Q2 is now similar in function to the AMU fine controls.
The new control PCBs provide new programming voltage so each DAC step for 0 – 23 amp outputs (Fine) results in a 6mA change in supply output. For the range of 20 amps to 50 amps the programming voltage of each DAC step results in an output change of 12mA. Before this new feature, noise in the programming voltage for low energy beams would cause a significant defocusing of the beam resulting in the recipe falling outside limits. With each DAC step only resulting in 6mA of output change, the effect of noise has been eliminated
Varian Semiconductor Equipment
3-2 Revision A
Gas Box Actuator Valves with Switch
The new gas bottle valve actuators and manifold valve actuator have a switch that signals the software when the valve is closed. This bottle valve feedback feature added to the gas box reduces a gas change to less than 20 seconds. Previously, without positive confirmation that the valves were closed, the manifold had to be pumped down below 1.00 Torr before opening the next valve. This could take a very long time, especially with B11.
New algorithms for beam tuning
Software version 13.50 is the major part of the upgrade with new features that allow faster throughput and automatic tuning algorithms that will greatly decrease the need for operator intervention. New iterative been tuning techniques allow the machine to complete automatic setup where before the recipe would fail. Auto recovery techniques when parameters are out of limits now allow the machine to continue where before it would stop for operator assistance. These features increase recipe reliability and throughput.
See the Software Release Notes for V13.50 for more detailed information on the new algorithms, ECO’s, and Options. The release notes contain the instructions for installing the software.
Section 5, Software Interface, also contains information on the new ECO’s, Options, and screen changes.
New GASES screen with new icons for gas bottle valves and manifold valve (5 new icons)
Manifold valve
Theory of Operation
Revision A 3-3
Benefits of new algorithms
The new algorithms in V13.50 provide these features and benefits:
Reduce time for gas change using VIISta technique
• Bottle valve feedback added to gas box
• Reduce gas change to less than 20 Seconds
Source Magnet, Manipulator X, Y, Z, and Suppression tune
• Completely new code for all source parameter setups
• Consistent sampling design routine to achieve parameter goal
• Beam Centroid determined instead of highest value to find true peak. Centroid is only applied to the points within 3% of the peak value --- avoids tail contribution errors.
AMU Tune
• Reduced sample time and count
• Reduced AMU tune errors and auto recovery
• Beam Centroid determined instead of highest value to find true peak. Centroid is only applied to the points within 3% of the peak value --- avoids tail contribution errors.
Enhanced Beam Tuning Flow
• Iterative setup tunes to specific source parameters
• Eliminate unneeded wait states and hardware updates
• Peak sampling uses variable step size to give enough sampled points to give more accurate peak location information
Improved Routine for Y-axis tuning in the focus cup
• Algorithms similar to source tuning
Improved Quad tuning routines using up to 50 sample data points
• Data Samples are being saved at sample time
• Help identify root cause on failures
New coarse and fine Quad magnet control to enhance low energy drift performance
Setup uses saved parameters to improve success rate
• Precision tunable parameters use floating point math instead of integer values
• Maintained compatibility of recipe structure with EHP software
Integrated BIA deflector tune routine with coarse medium and fine adjust
Varian Semiconductor Equipment
3-4 Revision A
Historical beam scan data used in Beam-Scan Setup
• Pertinent beam scan data is saved on successful setups
- Data history for 200 recipe setups
• Uses historical beam scan setup data that provides fast successful subsequent setups
- Less than 30 seconds in most cases
Ability to restart Source or Beamline tuning if parameters fall outside recipe goals
Recovery rules for failed beam scan that improve success rate
Q1/Q2 fine mode
• Switches to fine mode for operation below 20 amps of magnet current
• Increases control and beam stability at maximum beam current for low energy Drift Mode recipes
Increase beam current and stability for low energy Drift Mode
• Stable beams with 50uA to 100uA of beam current at 10keV Boron (Drift Mode)
• Stable beams with 100uA to 200uA of beam current at 15keV Boron (Drift Mode)
Save and run Drift Mode recipes with Accel and Accel Suppression off
• Minimize space charge blow up in accel tube. Blowup reduces the transmission of the beam and makes the spatial beam size too large. Better space charge control gives tighter, better shaped beams for more reliable tuning and higher throughput
Installation
Revision A 4-1
Section 4, Hardware Installation
The following instructions are for installing the E220/E500 gas box valve actuators, actuator harness and Q1/Q2 magnet control PCB’s, and sensor wire holder assembly.
The five actuators, two PCB’s, harness and actuator removal tool are shown below at left. The sensor wire holder assembly is shown at right.
After installation, you also need to perform calibration procedures:
• Calibrate Q1 and Q2 boards
• Verify gas flow
• Verify proper operation of the analyzer magnet, lens magnet, and source magnet supplies
• Align manipulator
• Set Manipulator Limits
• Perform Magnet Constants setup
• Perform TVL-Diag test for Travelling Faraday
Software required
Software version V13.50 must be installed, and Options 147 and 148 enabled, to access the new hardware (gas valve sensors and Q1/Q2 fine controls). See the release notes for V13.50 to install the software. See “Section 5, Software Interface” on page 5-1 for more information about these options and the new features in V13.50.
Please note that V13.50 must be licensed within 30 days of installation or it will no longer process wafers.
Tools needed
Torque wrench with 1” 8-point socketAdjustable wrench or 1” wrench or socketFlatblade screwdrivers (one with a short handle to remove board covers)1/4” wrench or socket5/16” and 7/64” Allen wrenches
Varian Semiconductor Equipment
4-2 Revision A
Shutdown the system
Refer to the following documentation for installing this upgrade:
• EHPi-220/EHPi-500 Maintenance Manual (ME82008443) Section 3, “Scheduled Maintenance.”
• “Energy Source Component Lockout/Tagout Tables” on page 2-81 of Section 2, “Safety” in this manual.
Lockout/Tagout according to VSEA, OSHA, and customer specific lockout/tagout procedures.
Note: Remove all wafers and cassettes from the implanter.
Note: Create system backup disks including Implant and Chrono logs.
On the Manual Mode Screen touch [SYSTEM SHUT DOWN].
Selecting [SYSTEM SHUT DOWN] shuts down the beam and all high voltage power supplies.
Vacuum System Contamination
Early Version of Screen
Installation
Revision A 4-3
Safe Shutdown and Entry
Follow safe shutdown procedures for proper grounding and safe entry as described in the “Safe System Shutdown and Entry” section for your implanter. See the EHPi-220/EHPi-500 Maintenance Manual (ME82008443) Section 3, “Scheduled Maintenance.” Refer to Section 3.3, “Safe System Shutdown.”
DANGER - POTENTIAL ELECTRIC SHOCK HAZARDOnly persons trained in the operation and maintenance of Varian ion implanters should attempt to perform these procedures.
Ensure all power is off and follow proper OSHA, VSEA and Fab specific instructions for LO/TO.
Failure to comply could result in severe injury or death
DANGER - POTENTIAL TOXIC GAS INHALATION HAZARDMandatory monitoring and use of supplemental exhaust or SCBA or supplied air is required prior to maintenance being performed on toxic gas connections.
Wear PPE (personnel protective equipment, eye glasses and gloves) when doing this work.
Invoke two-man worker rule.Close gas bottle valves and LO/TO bottle valves according to VSEA, Fab, and OSHA.
Varian Semiconductor Equipment
4-4 Revision A
Evacuating Gas Box Vacuum Lines
Read all WARNINGS, CAUTIONS and NOTES
1. Ensure the source cabinet bypass switch is ON (Green).2. Locate the gas box door at the top of the source cabinet, release the two latches and open the
door. Ensure that the gas box has a positive exhaust flow into the gas box. This can be tested by opening the front cover slightly and then closing to within approximately one eighth of an inch while holding the handles in the open position. From this position the door should pull itself closed.
3. Go to the Manual Menu Screen and select [GASES]. On the Gases Screen select [CHANGE] and follow the Gas Bottle Change Procedure until the gas line is evacuated. When the procedure instructs you to install the new gas bottle select [CANCEL]. Select [CHANGE] again and follow the Gas Bottle Change Procedure for the next bottle to the same step and cancel. Repeat until all of the toxic gas lines have been evacuated. Touch [MANUAL MENU] and select [MAINTENANCE] to return to this procedure.
NOTE: The high voltage system must be “armed” or the source bypass must be on if the vaporizer option is installed and selected on the ECO’s & Options Screen.
Installation
Revision A 4-5
Shut Off Power Supplies
Turn off front switches and turn off the circuit breakers for the power supplies listed below at the Terminal Power Distribution Panel (3A10) or End Station Power Distribution panel. LO/TO circuit breakers according to OSHA, VSEA, and Fab specific LO/TO procedures.
Analyzer Magnet CB5 Terminal Power DistributionLens Magnet Supply CB6 Terminal Power DistributionQ1 Power Supply CB8 Terminal Power DistributionQ2 Power Supply CB9 Terminal Power DistributionSource Magnet Power Supply CB7 Terminal Power DistributionExtraction Supply CB17, EHPi-220; CB26 EHPi 500 Terminal Power DistributionAccel Supply CB9 End Station Power Distribution
Source Magnet Power Supply
Q1, Q2, and Analyzer Magnet supplies
Varian Semiconductor Equipment
4-6 Revision A
Replace valve actuators V1, V2, V3, V4, and V5 in the gas box
1. Be sure you have evacuated the gas box vacuum lines as described above under “Evacuating Gas Box Vacuum Lines” on page 4-4. Also refer to Section 3—Scheduled Maintenance, in your E220/500 Maintenance Manual.
2. Slide out the gas box so you have room to remove the side and top panels.
3. Twist loose 1/4 turn black fasteners for top and side panels with a flat blade screwdriver. One screw on lower left side is a screw with hex head and requires a 5/16” allen wrench.
4. Pull back top panel enough to gain access to actuators (V1, V2, V3, V4, V5). Put side panel aside to gain access to PCB board E15001650 for harness connections.
Black plastic fasteners (3) and 1 socket head screw onside panel.
Side panel and top panel removed V1 V2
V3
V4V5
Installation
Revision A 4-7
5. Because the designations on the actuators (V1, V2, etc.) do not appear on the [GASES} screen, study the picture below to match the physical actuator to the screen icons. The designations V1, V2, V3, V4, V5 are shown next to the valve icons they represent.
6. Before removing any actuator, make sure the valve jungle is securely bolted into the gas box.7. Remove actuator for valve V1 first using Removal Tool E18005391 as follows.
a. If the right angle barbed air line fitting is not at a right angle to the spanner holes on the actuator body, rotate the air fitting as such so the replacement tool can be properly inserted.
b. Insert the pins of the valve removal tool into the holes on the actuator body.
c. Turn on air for V1 from the GASES screen.
NOTE: Air must be supplied to the valve actuator being removed or installed, or the two halves of the actuator body will start to separate.
d. Using an adjustable wrench or 1 inch open wrench to turn the removal tool, apply approximately 25 foot pounds of torque counterclockwise and rotate the actuator a few turns.
e. Turn off the air to V1 from the GASES screen.f. Remove the air line and completely remove the
actuator from the valve body.
V1 V2 V3 V4 V5
Removal tool placed on actuator
Remove actuator
Varian Semiconductor Equipment
4-8 Revision A
8. Install the new V1 actuator E11370400 as follows:a. Move the label from the old V1 actuator to the new
actuator. All new actuators are the same. b. Remove the air fitting from the old actuator and install it
on the new actuator if necessary. (Some air lines may have different diameters from the fitting supplied).
c. Thread the new actuator on the valve body until resistance is felt.
d. Check air line for damage and trim back 1/4 inch if necessary. e. Connect the air line and turn air on for V1 from the [GASES] screen.f. Continue to hand tighten after air is applied. Then torque actuator to approximately 25 foot
pounds using the Removal Tool, a torque wrench and 1 inch 8-point socket.g. Turn off air to V1.
9. Replace actuators V2, V3, V4, and V5 in the same way.
Route harness to actuators
1. Find harness E16370350 in your kit. It has a 16-pin connector on one end and five Molex connectors that connect to each new actuator on the other end.
2. Route harness from A3J2 on board E15001650 at the side of the gas box to actuators at top of gas box as shown below. Tuck harness around the side of the enclosure as shown by the yellow arrow in photo below. Route the harness through one of the holes in the gas box frame to actuators.
Put label from old actuator on new actuator here
Installation
Revision A 4-9
3. Attach Molex connectors on the harness to the mating connector on each actuator cable. Harness wires are marked (V1, V2, etc.)
Test actuator switch
To test actuators:
1. Make sure Option 147 is on (turn on from the Options screen) so the new [GASES] screen with slightly different icons for the gas bottle shutoff valves and the manifold shutoff valve is displayed. The software will now be able to read the signal from the actuator switch when the valve closes.
2. Open the valve by pressing the valve icon indicator on the [GASES] screen. The indicator goes from red to green.
3. Close the valve—go from green to red.4. Test each actuator and verify that valve closure is sensed by software. You should not get any
error messages.5. If valve closure was not properly sensed, an error message will be displayed on the [GASES]
screen. If you get an error message, adjust as follows:a. Remove the actuator (follow the removal procedure
above).b. Make sure the switch mounting screws are tight. c. Turn the small adjusting screw on the side of the
switch 1/8 turn clockwise with a 0.50 mm hex wrench.
6. Replace the actuator and test again.
Replace gas box side panel and top panel
1. When finished testing the actuator switches, replace the side panel and top panel of the gas box.2. Slide the gas box back into the machine.
V1 V2 V3
New actuator icons
Adjusting screw on side of switch
Varian Semiconductor Equipment
4-10 Revision A
Replace Q1/Q2 Magnet Control PCB’s
Remove old boards
1. Make sure the proper power supplies are turned off as noted in “Shut Off Power Supplies” on page 4-5
2. To gain access to the back of the Q1 and Q2 power supplies where you need to work, you may need to unbolt the Source Magnet Power Supply from the machine (4 bolts) and slide it out of the way so you have access to the Q1 and Q2 PCB controller boards behind it.
NOTE: The Source Magnet Power Supply will block access to the back of the other supplies only if Edwards-Seiko turbo pumps are used. If it is installed in its normal position, it does not have to be removed.
Potential Electric Shock Hazard
Only persons trained in the operation and maintenance of Varian ion implanters should attempt to perform these procedures. Follow proper OSHA, VSEA and Fab specific instructions for LO/TO. Failure to comply could result in severe injury or death.
Source Magnet Power Supply
Q1, Q2, and Analyzer Magnet supplies
Installation
Revision A 4-11
3. Remove the light links from the Q1 and Q2 Controller board connectors, making note of how they will be reattached, and remove covers (use a small screwdriver to loosen the two cover screws).
4. Remove the J1 and J2 8-pin and 16-pin cable connectors from each board.5. Unscrew the four standoffs for each board and remove the boards from the tool. Use a 1/4”
wrench or socket on standoffs.
Install new boards E15010880
1. Set addresses for the new boards as shown:
Cover being removed for Q2 board. Light link cables need to be removed first
Unscrew standoffs to remove boards
Light link connectors
Varian Semiconductor Equipment
4-12 Revision A
2. Installation of the new boards is the reverse of removal. Use a 1/4” wrench or socket to tighten the standoffs. Install J2 and J3 connectors, install light links with covers off and go to the verification procedure below. Light link connectors are color coded, blue and grey.
Calibrate new boards
To calibrate the Q1 and Q2 power supplies after installing the new boards, follow these steps:
1. Turn on circuit breakers CB8 and CB9 for Q1 and Q2 that you turned off earlier. Also turn on the Analyzer Magnet circuit breaker (CB5) and Lens Supply (CB6) so you can establish communications with the Q1 and Q2 supplies.
2. Attach a clamp-on current meter to the power output cable of Q1 for accurate reading of the power supply output.
Boards shown with light links attached but covers are off
from 9D extraction manipulator
to analyzer 16U
Q1
Q2
14U
14D
15D
15U
Potential Electric Shock Hazard
Only persons trained in the operation and maintenance of Varian ion implanters should attempt to perform these procedures. 208VAC, three phase power is present during testing. Ensure safety cones, chains, and placards are used to define unsafe area.
Installation
Revision A 4-13
3. From the Options screen, turn on Option 148: Hi/Low Q1/Q2 Control.4. At the Beamline screen, set Q1 and Q2 for 0 amps.5. Turn on the front switch of the power supply. Verify the supply stays near 0 amps.6. Turn on Q1 on the screen.7. Dial the Q1 magnet supply on the Beamline screen to 25 amps. The front panel of the supply
should be around 25 amps.
NOTE: The front panel will not necessarily be accurate until calibration is done.
8. Dial in 40 amps on the Beamline screen.9. Adjust R14 until the clamp-on current meter reads 40.0 amps.
10. Adjust R12 until the Beamline screen reads 40A.11. Adjust R7 until the Beamline screen matches the voltage on the front panel of the supply.12. Dial in 25 amps. The screen should read 25A. 13. Dial in 20 amps. The button on the screen should change from red to orange to indicate low
resolution mode. The output should be 20 amps on both the screen and current meter.14. You are done calibrating Q1. Calibrate Q2 in the same way.
Shut off Q1 and Q2 supplies and re-install covers
DANGER - POTENTIAL ELECTRIC SHOCK HAZARDOnly persons trained in the operation and maintenance of Varian ion implanters should attempt to perform these procedures.Ensure all power is off and follow proper OSHA, VSEA and Fab specific instructions for LO/TO.Failure to comply could result in severe injury or death
1. Turn off the front panel switches for the Q1 and Q2 supplies.Turn off circuit breakers CB8 and CB9 for the two power supplies and for the analyzer magnet circuit breaker (CB5) and lens Supply (CB6). LO/TO the circuit breakers according to OSHA, VSEA, and Fab specific LO/TO procedure.
2. Remove the light links from the Q1 and Q2 Controller boards so you can replace the covers.3. Replace covers and replace light links through the slots in the covers4. Reconnect the source magnet power supply to the tool as required.
Software Interface
Revision A 5-1
Section 5, Software Interface
Software version V13.50 must be installed to get the benefits of the LX Productivity Plus Upgrade. See the release notes for V13.50 for detailed descriptions of the new features and for licensing information.
Follow the instructions in the V13.50 Release Notes to install the software.
This chapter covers machine configuration for best performance when running the new software. It also shows the new software screens for V13.50.
Machine configuration—ECO’s and Options
Below is a list of suggested settings to take maximum advantage of the new LX Productivity improvements in V13.50. Please note that it is not a yes/no listing of all ECO’s and Options.
Also note that the field “Maximum number of Setup Attempts” must be set to define the number of iterations the software will go through in its setup routines before an error is finally generated and the automatic setup is aborted. The default value is 5. See “Beam Tuning Configuration Screen” on page 5-10.
Turn on? DescriptionNO ECO 26: When the ECO is enabled, automatic setup will be required to achieve the target
scan count in the recipe +/-10%, with a minimum window of +/- 2 scans, whichever is more generous. For lower scan numbers. the +/- 2 scans window is more generous than the 10% calculation, so an 8 scan target must achieve 6-10 scans. When the scans target is 30 scans or more, the 10% window is the more generous, so a target of 30 scans will pass with 27-33 scans. Setup will attempt to adjust beam current if necessary to achieve the target window, both in Analytic Setup mode, and in Parametric Setup mode. If the scans window cannot be achieved, a fatal error will occur at the end of setup. When enabled, the LX behavior of auto-matic adjustment to achieve target scans within the user configured scans target percent-age, is disabled.
When the ECO is disabled, the user configured Target Scans Tuning% setting in the Tuning Config section of the Interlocks Edit screen is applied during setup, and setup will make adjustments to achieve the target within that percentage until all retries are exhausted. The percentage is rounded to the nearest whole scan, so with a 10% Target Scans Tuning % set-ting, and a target of 8 scans, setup will work to achieve a calculated scans result in the range of 7-9. If the target scans is 4 or less, setup will try to match it exactly. If setup is unable to achieve the scans target within the configured percentage by the end of setup, no error will occur, unless recipe limits or other mandatory requirements are not achieved.
In both configurations the recipe upper and lower limits can be used for implant scan interlocking and instead of setup scan interlocking.
Varian Semiconductor Equipment
5-2 Revision A
YES ECO 73: Enhanced Monitoring—V13.50 uses the recipe limits throughout setup and implant. This ECO must be selected to take full advantage of the LX tuning improvements.
NO ECO 87: No Accel Volts in Drift ModeNO ECO 108: Parametric Full/X and Y Learn (was Auto Learn)—This functionality: “Learn a
recipe if not already learned/update X and Y if already learned” is superseded by the new ECO 148.
NO ECO 114: Same PPID Goes to Beamscan—This ECO forces the setup to beamscam if the recipe name hasn’t changed. This functionality is replaced by the new setup path determination that is part of LX Productivity beam tuning.
YES ECO 122: Ignore MIN Scans for Top-Off–Top-off recipes are not going to have the same number of scans as the production recipe had. This ECO removes the check for minimum number of scans.
YES ECO 148: High Precision Learn – At the end of every successful beam setup, recipe values are relearned to new high precision floating point values in the recipe. These values will be restored and used as the starting point for the next setup of that recipe.
YES ECO 150: Historical Beamscan Setup – At the end of every successful beam setup, the beamscan data (the “scan Map” and many other variables) is saved in a separate file on the hard disk. When the recipe is used again, this data is used as a starting point for beamscan corrections. This normally eliminates the need for a complete scanner setup, saving setup time. If disabled, a complete setup of the scanner will be forced after every recipe change, as has been the behavior before this capability was introduced. A maximum of 200 recipes can be saved. After that, the oldest recipe is overwritten.
YES ECO 151: Recipe Interlock Auto-Correct – Allows for automatic correction of recipe interlock violations during implant. If the ECO is enabled, a critical or warning level recipe interlock violation that occurs during implant will trigger an automatic setup correction and implant resumption without user intervention. If the ECO is disabled, recipe interlock violations will be reported and the implant placed on hold as appropriate.
NO ECO 152: Use Recipe Lens I for Setup—Normally, lens current is calculated from analyzer current using the appropriate KLENS value. This ECO forces beam setup to use the learned lens value from the recipe. Although this ECO does work, its use is not recommended because the system would no longer track any changes to the KLENS values.
NO ECO 153: No Learn of Critical Items–Created in response to a customer request. If a recipe field has an interlock of ‘Critical’, the field will not be learned.Generally, the items marked ‘critical’ in the recipe are the items that should be updated.
YES ECO 154: Tune Within Recipe Limits– Forces beam tuning to stay within recipe limits throughout the setup. If enabled, parametric setup will respect all interlocked recipe limits during tuning and verify that they are achieved, if possible, when setup is complete. If not enabled, interlocked recipe limits will be ignored during beam setup, and tuning optimization may leave parameters at levels that will trigger a pre-implant interlock.
Turn on? Description
Software Interface
Revision A 5-3
YES ECO 155: Permit Beam Setup While Loading – If enabled, beam setup is allowed to start as soon as GO is pressed or a remote start is received from the host computer. Setup will begin even if loading and mapping are in progress. If not enabled, setup start will be inhibited until mapping has completed.
YES ECO 159: Learn Drift with Accel Off – Prior to V13.50, all drift recipes were learned with Accel on but programmed to zero. This forced the Accel Suppression to also be on (for safety reasons) and the suppression voltage can have adverse affects, especially at very low energies. This ECO allows drift recipes to be learned with Accel and its suppression supply off.
When selected, ACCEL and ACCEL-SUPPRESSION can be learned with a value of zero. This allows for a setup that has both supplies turned off. This is needed for low energy drift<20K extraction. When ECO 159 is selected, the field Low Energy ECO 159 Threshold in kV must be set in the Beam Tuning Configuration screen to define the Threshold at which the software will apply ECO 159 behavior.
User’s discretion
ECO 161: Use 3 Cup Focus Faraday—For tools with the BIA upgrade, this ECO controls use of the side cups during the BEA check. If this ECO is selected, the BEA check will do extra sampling and include data on the side cups in the Beamscan Supplemental log entry. No interlocking is done on the side cup data. (See also Option 145 in “Options” on page 5-4.
Turn on? Description
Varian Semiconductor Equipment
5-4 Revision A
Options
These options should be on.
*Options 147 and 148 must be on or you will not have access to the new features on the GASES screen and BEAMLINE screen. You will not be able to gain the performance enhancements and run in the new modes available after installing the new gasbox actuators and Q1/Q2 PCB controller boards.
YES Option 145: 3 Cup Focus Faraday—If the 3-cup Faraday is installed, this option must be selected. Previously the option could b deselected if the side cup functions were not desired. Use of the side cups is now controlled by ECO 161 (See “ECO 161” under “Machine configuration—ECO’s and Options” on page 5-1). Applies to tools with BIA upgrade only.
YES* Option 147: HP-Gasbox Valve Sensors – Selects the new valve position sensors installed as part of the LX Productivity Upgrade. Avoids the need to have a time-consuming vacuum pumpdown verify valve closure.
YES* Option 148: Hi/Low Q1/Q2 Control – When selected, it enables control of Q1 and Q2 power supplies that can either have coarse resolution control (with range of 25 to 50 amps) or fine resolution control (with range of 0 to 25 amps). At lower magnet currents, a finer resolution is automatically used. See “Section 3—Installation for information on installing the new PCB controller boards that allow fine resolution control.
Software Interface
Revision A 5-5
Best Known Methods (BKM’s)
Here are some tips and techniques for dealing with machine issues and increasing performance.
‘Peak not found’ error during X axis tune:
v13.50 software requires a 3% drop on either side of the highest value to qualify that value as the peak. If this error is persistent, try the following:
• Reverse magnet polarity
• Reduce Z gap (sharpens peak)
• Source PM
• Replace Extraction Electrode
Hump on right side of scanner waveform just gets bigger:
Sometimes the Beamscan setup won’t pass because the display shows a hump on the right side of the plot that just gets bigger as more corrections are made.
If this is a drift recipe, try learning with Accel OFF (instead of programmed to zero).If this is a multiple-charged recipe, try reducing gas.Retune Q2 for best return current.
Fast Scan errors:
Sometimes the Beamscan setup won’t pass because the Fast Scan uniformity is out of spec.
Try tuning Q2 for best accel/decel return current.A problem with the TREK amplifier may be a cause for fast-scan errors.For low-dose Phos and AS recipes, use the mirrror supply to fix, but there is a cost in a reduced final beam-I.
Gas Tune performed too often:
v13.50 software will perform a gas tune if the setup cup response to an arc current change is not adequate. If this is being done too often, the gas tune can be defeated:
Change the recipe limits for Gas Flow so that there is less than 0.5T between them (the easiest method is to set the lower at 0.2T below target and the upper at 0.2T above).Set the interlock level to either Warning or Critical.
This method can also be used when maintaining proper gas flow is critical, as with multiple-charged and low energy recipes.
Varian Semiconductor Equipment
5-6 Revision A
Setup issue with As75+ Low Energy:
Sometimes the setup won’t pass for As75+ at low energy. The use of the mirror can greatly improve beam shape, resulting in a narrower and sharper integrated plot. Unfortunately, beam current might drop by a large amount (>40%). Also, note that the mirror should not exceed 70% of the EXTR.
Arc current recipe limits:
It is highly recommended that all recipes have an upper limit on arc current. A limit that is 110-125% of the target value is usually sufficient. The interlock level must be set to Warning or Critical.
Issues with installs:
Target too close to upper limit causes overlap with tuning margin:
Error “Z axis has exceeded recipe limits…” (for instance).Recipe (low/target/high): 0/995/999Tuning Margin: 1.2% (default)The Tuning Margin narrows the upper limit to 987.The target value (995) now causes an error.
If the recipe target cannot be changed, the Tuning Margin (on the Tuning Config screen) must be set to zero (or at least something less than 0.8%).
Tight limits on recipe parameters cause overlap with tuning margin:
Error “Target bias has exceeded recipe limits…” (for instance).
Recipe (low/target/high): 119/120/121
Tuning Margin: 0.6%
The Tuning Margin narrows the limits to 119.74 & 120.27.
The readback was 120.33 and caused error.
If the recipe limits cannot be changed, the Tuning Margin (on the Tuning Config screen) might need to be set to zero (or at least something less than 0.6%).
Gas box Baratron gauge flickering +/- 0.03T causes long wait for gas to stabilize:
Symptom: The software waits a long time for gas to stabilize as shown on the tuning announcement message, or “the Gas readback stability is above x% after x seconds” error is generated specially for low gas settings.Check the gas screen. If baratron reading flickers by +/- 0.03Torr this could cause the symptom above. Increase GAS-SETTLE-TOL in system.ini. It should not be changed to more than 3 (in percent).
