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Lecture 4: DC and Transient Analysis
• DC Analysis • Skewed Gates • Logic Levels and Noise Margins • Transient Response • Delay Estimation
• Reading: Ch. 2
Load Line Analysis • For a given Vin:
– Plot Idsn, Idsp vs. Vout
– Vout must be where |currents| are equal in
Region nMOS pMOS A B C D E Idsn
Idsp Vout
VDD
VinI dsn , | I dsp | NMOS PMOS
V in5
V in4 V in3 V in2 V in1
V in0
V in1 V in2 V in3 V in4
V out V DD
CVout
0
VinVDD
VDDA B
DE
Vtn VDD/2 VDD+Vtp
2
Beta Ratio • If βp / βn ≠ 1, switching point will move from VDD/2 • Called skewed gate
– HI-skew – LO-skew
• Other gates: collapse into equivalent inverter • VTC depends on how inputs are applied
V DD
A out
W
2W A
B
out 2W
2W 2W
2W
V DD
EX: 2-Nand sized for similar WC delay as INV
V out
0
V in V DD
V DD
VTC of complex gates • Case 1: one input held HI while other input is switched from Lo-to-HI
– Assume PMOS device is removed from circuit (Open circuit since it is CUTOFF) – Assume NMOS is short circuit (Since LIN with small ON resistance)
• Equivalent to inverter with 2W Pull-up and 2W Pull-down – VTC shifts to the LEFT (stronger Pull-down)
A=VDD
B=0→VDD out
2W
2W 2W
2W
V DD
V out
0
V in V DD
V DD
βn / βp = 1
3
VTC of complex gates • Case 2: both inputs are switched from Lo-to-HI • Equivalent to inverter with 4W Pull-up and W Pull-down
– VTC shifts to the RIGHT (stronger Pull-up)
B=0→VDD
out 2W
2W 2W
2W
V DD
V out
0
V in V DD
V DD
βn / βp = 1 A=0→VDD
VTC of complex gates • Case 1: Assume A=0 and B=0→VDD
– PMOS short circuit (small RON) – NMOS open circuit
• Equivalent to inverter with 4W Pull-up and W Pull-down – VTC shifts to the RIGHT (stronger Pull-up)
B=0→VDD
V out
0
V in V DD
V DD
βn / βp = 1 A=0
Y
4W
4W
W W
4
VTC of complex gates • Case 2: Assume A=0→VDD and B=0→VDD • Equivalent to inverter with 2W Pull-up and 2W Pull-down
– VTC shifts to the LEFT (stronger Pull-down)
B=0→VDD V out
0
V in V DD
V DD
βn / βp = 1
Y
4W
4W
W W
A=0→VDD
Duty Cycle Distortion
• How do Skewed gates effect duty-cycle? • Where is this relevant?
V out
0
V in V DD
V DD
βn / βp = 1
V TRIP1 V TRIP2
V in V out
50% duty cycle
Duty cycle increases
50% duty cycle clock is preferred for increased timing margin
5
Noise Margins
• How much noise can a gate input see before it does not recognize the input? – NMH=VOHmin-VIHmin
– NML=VIHmax-VOLmax
The image cannot be displayed. Your computer
The image cannot be displayed. Your computer
The image cannot be displayed. Your computer may not have enough memory to open
The image cannot be displayed. Your computer may not have enough memory to open the image, or the
Indeterminate Region
Input Characteristics Output Characteristics
V OH
V DD
V OL
GND
V IH V IL
Logical High Input Range
Logical Low Input Range
Logical High Output Range
Logical Low Output Range
Logic Levels
• To maximize noise margins, select logic levels at – unity gain point of DC transfer characteristic
VDD
Vin
Vout
VOH
VDD
VOL
VIL VIHVtn
Unity Gain PointsSlope = -1
VDD-|Vtp|
βp/βn > 1
Vin Vout
0
6
Tradeoff between NMH and NML
• Increasing NMH decreases NML
VOH1
VOL1
VIL1 VIH1
VIL2
VIH2
VOL2 VOH2
VOUT1
VIN1
VIN2
VOUT2
Delay Definitions • tpdr (tpLH): rising propagation delay
– From input 50% to rising output 50% crossing • tpdf (tpHL): falling propagation delay (tpHL)
– From input 50% to falling output 50% crossing • tpd: average propagation delay
– tpd = (tpdr + tpdf)/2
• tcdr: rising contamination delay – Minimum time from input 50% crossing to rising output crossing VDD/2
• tcdf: falling contamination delay – Minimum time from input 50% crossing to falling output crossing VDD/2
• tcd: average contamination delay – tpd = (tcdr + tcdf)/2
• tr: rise time (From output crossing 0.2 VDD to 0.8 VDD • tf: fall time (From output crossing 0.8 VDD to 0.2 VDD) tmin
tmax
t pHL t pLH t
t
V in
V out
50%
50%
t r 20%
80%
t f
7
Delay Estimation • SPICE simulator solves the equations
numerically – Solving differential equations by hand is too hard – We would like to be able to easily estimate delay
• Use RC delay models to estimate delay – C = total capacitance on output node – Use effective resistance R – So that tpd = RC
• Characterize transistors by finding their effective R – Depends on average current as gate switches
(V)
0.0
0.5
1.0
1.5
2.0
t(s)0.0 200p 400p 600p 800p 1n
tpdf = 66ps tpdr = 83psVin Vout
• The step response usually looks like a 1st order RC response with a decaying exponential.
RC Delay Approximation
• Use equivalent circuits for MOS transistors – Ideal switch + capacitance and ON resistance – Unit nMOS has resistance R, capacitance C – Unit pMOS has resistance 2R, capacitance C
• Capacitance proportional to width • Resistance inversely proportional to width
kgs
dg
s
d
kCkC
kCR/k
kgs
dg
s
d
kC
kC
kC
2R/k
8
Capacitance
• Cg = (εox/tox)WLmin
• tox and Lmin are both scaled
• Cg~2fF/um across technologies
• Assume C~Cg~Cs ~Cd~2fF/um
n+ n+ p-type body
W
L t ox
SiO 2 gate oxide ε ox = 3.9 ε 0
polysilicon gate
The image
On Resistance
• 250nm process – Rn~4kΩµm – Rp~8.9kΩµm – Rp>Rn since µn>
µp
Reqn= Rn Wn
Reqp= Rp Wp
9
Inverter Delay Estimation • Estimate delay of FO1 inverter
C
CR
2C
2C
R
2
1A
Y
C
2C
C
2C
C
2C
RY
2
1
Example: 3-input NAND
• Sketch a 3-input NAND with transistor widths chosen to achieve effective rise and fall resistances equal to a unit inverter (R). Assume Rp=2Rn.
10
3-input NAND Caps • Annotate the 3-input NAND gate with gate and diffusion
capacitance.
2 2 2
3
3
33C
3C
3C
3C
2C
2C
2C
2C
2C
2C
3C
3C
3C
2C 2C 2C
Elmore Delay • ON transistors look like
resistors • Pullup or pulldown network
modeled as RC ladder • Elmore delay of RC ladder
R1 R2 R3 RN
C1 C2 C3 CN
11
Example: 2-input NAND
• Estimate rising and falling propagation delays of a 2-input NAND driving h identical gates.
h copies
2
2
2 2
B
A x
Y
Example: 2-input NAND
• Estimate rising and falling propagation delays of a 2-input NAND driving h identical gates.
h copies
2
2
2 2
B
A x
Y
12
Delay Components
• Delay has two parts – Parasitic delay
– Effort delay
Contamination Delay
• Best-case (contamination) delay can be substantially less than propagation delay.
• Ex: If both inputs fall simultaneously
6C
2C2
2
224hC
B
Ax
Y
13
Pin Reordering • A and B transition High
– If A arrives earlier than B
6C
2C2
2
224hC
B
Ax
Y
Diffusion Capacitance • We assumed contacted diffusion on every s / d. • Good layout minimizes diffusion area • Ex: NAND3 layout shares one diffusion contact
3C
2C 2C
3C 3C
Isolated Contacted Diffusion Merged
Uncontacted Diffusion
Shared Contacted Diffusion
3
3
3
2 2 2
AVDD
GND
B
Y
AVDD
GND
B
Y
Which Layout is better?