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Lecture 14Lecture 14
Logic Families III
Professor Sunil BhaveCU School of Electrical and Computer p
Engineering
March 19, 2010
Complementary Pass Transistor Logicp y g
P T i tA
FPass-Transistor
NetworkABB
A Inverse
(a)
FPass-TransistorNetwork
ABB
Inverse
A
B B B B
A
B B
A
B
A
B
B
A
B
F=AB
F=AB
F=A+B
F=A+B
A
A
A
F=A⊕ΒÝ
F=A⊕ΒÝ
(b)
OR/NOR EXOR/NEXORAND/NAND
Solution 3: Transmission Gate
CC
A B A B
CC
BA = 2.5 V
C = 2.5 V
CL
C = 0 V
Resistance of Transmission Gate
2.5 VR
30
R
Vout2.5 V
Rn
R
20 ce
, ohm
s
Rn
Rp
0 V
Rp
10
Res
ista
nc
Rn || Rp
0.0 1.0 2.00
V VVout, V
Pass-Transistor Based Multiplexerp
S S
SVDD
VDD
S S
AM2
F
M1
B
S F
S
GND
In1 In2S S
Transmission Gate XOR
B
BM2
AF
A
M1 M3/M4
B
BM3/M4
Delay in Transmission Gate Networksy
V1 Vi-1
2.5 2.5Vi Vi+1
2.5Vn-1 Vn
2.5
In
C0 0 CC 0 CC 0
In
(a)
V1 Vi Vi+1
C
Vn-1 Vn
CC
InReqReq Req Req
CC
(b)m
C
Req Req
C C
Req
C C
Req Req
C C
Req
CIn
(c)
Delay Optimizationy p
Transmission Gate Full Adder
VDDP
A
PA A
VDD
C
DDCi
SP Sum Generation
B
P
VDDA
Ci
P
AB VDDP
Ci
DD
A
P
Ci
CoCi
P Carry Generation
APSetup
Similar delays for sum and carrySimilar delays for sum and carry
Dynamic Logic
D i CMOSDynamic CMOSIn static circuits at every point in time (except whenIn static circuits at every point in time (except when switching) the output is connected to either GND or VDD via a low resistance path.
f f ( )fan-in of n requires 2n (n N-type + n P-type) devices
Dynamic circuits rely on the temporary storage ofDynamic circuits rely on the temporary storage of signal values on the capacitance of high impedance nodes.
i 2 ( 1 N 1 P ) irequires on n + 2 (n+1 N-type + 1 P-type) transistors
D i G tDynamic Gate
I
MpClkOut
C
Out
Clk Mp
In1
In2 PDNIn3
CL A
BC
3
MeClkClk
B
Me
Two phase operationPrecharge (CLK = 0)Evaluate (CLK = 1)Evaluate (CLK = 1)
D i G tDynamic Gateoff
I
MpClkOut
C
Out
Clk Mp on 1off
((AB)+C)In1
In2 PDNIn3
CL A
BC
((AB)+C)
3
MeClkClk
B
Me
offon
Two phase operationPrecharge (Clk = 0)Evaluate (Clk = 1)Evaluate (Clk = 1)
C diti O t tConditions on OutputOnce the output of a dynamic gate is discharged itOnce the output of a dynamic gate is discharged, it cannot be charged again until the next precharge operation.Inputs to the gate can make at most one transition during evaluation.
Output can be in the high impedance state during and after evaluation (PDN off), state is stored on CL
P ti f D i G tProperties of Dynamic GatesLogic function is implemented by the PDN onlyg y y
number of transistors is N + 2 (versus 2N for static complementary CMOS)
Full swing outputs (V = GND and V = V )Full swing outputs (VOL = GND and VOH = VDD)Non-ratioed - sizing of the devices does not affect the logic levelsgFaster switching speeds
reduced load capacitance due to lower input capacitance (Cin)reduced load capacitance due to smaller output loading (Cout)no Isc, so all the current provided by PDN goes into discharging CL
Properties of Dynamic Gatesp y
Overall power dissipation usually higher than static CMOS
no static current path ever exists between VDD and GND (including Psc)( g sc)no glitchinghigher transition probabilitiesextra load on Clkextra load on Clk
PDN starts to work as soon as the input signals exceed VTn, so VM, VIH and VIL equal to VTnTn, M, IH IL q Tn
low noise margin (NML)Needs a precharge/evaluate clock
Issues in Dynamic Design 1: Charge LeakageCharge Leakage
CLK
ClkOut
Mp
CLK
CL
Out
A
VO tEvaluate
Clk Me
VOut
Precharge
Leakage sources
Dominant component is subthreshold currentDominant component is subthreshold current
S l ti t Ch L kSolution to Charge LeakageKeeper
Clk Mp
A O t
Mkp
CLA
B
Out
Clk Me
Same approach as level restorer for pass-transistor logic
Issues in Dynamic Design 2: Charge SharingCharge Sharing
ClkO t
Mp
Charge stored originally on CL is redistributed (shared)
CLA
Out over CL and CA leading to reduced robustness
Clk
CA
CB
B=0
Me
Ch Sh i E lCharge Sharing Example
C 50fF
Clk
A AOut
CL=50fFA A
B B B !BCa=15fF C =15fFB !B
CC
a
Cc=15fF
Cb=15fF
Cd=10fF
Clk
Ch Sh iCharge Sharingcase 1) if ΔVout < VTn
VDD
CLVDD CLVout t( ) Ca VDD VTn VX( )–( )+=
or
Clk
Out
Mp
or
ΔVout Vout t( ) VDD–CaCL-------- VDD VTn VX( )–( )–= =
X
CLA Ma
C
case 2) if ΔVout > VTnB = 0CaMb
ΔVout VDDCa
Ca CL+----------------------⎝ ⎠⎜ ⎟⎛ ⎞
–=CbClk Me
Solution to Charge R di t ib tiRedistribution
Clk Mp
AOut
MkpClk
A
B
Clk Me
Precharge internal nodes using a clock-driven transistor (at the cost of increased area and power)
Issues in Dynamic Design 4: Cl k F dth hClock Feedthrough
ClkO t
Mp
Coupling between Out and Clk input of the precharge
CLA
Out device due to the gate to drain capacitance. So voltage of Out can rise
Clk
B
Me
voltage of Out can rise above VDD. The fast rising (and falling edges) of the clock couple to Outclock couple to Out.
Cl k F dth hClock FeedthroughClock feedthrough
2.5Clk
In1
Out
Clock feedthrough
1.5
1
In2
In3 In &0.5
Clk
In3
In4
In &Clk
Out
-0.50 0.5 1
Clk
Time, ns
Clock feedthroughClock feedthrough
Oth Eff tOther Effects
Capacitive couplingCapacitive couplingSubstrate couplingMinority charge injectionSupply noise (ground bounce)
C di D i G tCascading Dynamic GatesV
Clk
Out1
Mp MpClk
Out2Clk
I
Clk
In
Me MeClk
In
Out1 VTne e Out1
Out2 ΔV
t
Only 0 → 1 transitions allowed at inputs!Only 0 → 1 transitions allowed at inputs!