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L-Cell’ L-Cell’ A Novel Device for A Novel Device for Plating Process Plating Process Diagnostics Diagnostics L-Chem, Inc. Shaker Heights, OH 44120 www.L-Chem.com

L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

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Page 1: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

‘‘L-Cell’L-Cell’

A Novel Device for Plating A Novel Device for Plating Process DiagnosticsProcess Diagnostics

L-Chem, Inc.Shaker Heights, OH 44120

www.L-Chem.com 

Page 2: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

Introducing a novel, multi-purpose Introducing a novel, multi-purpose device that provides:device that provides:

• Process parametersProcess parameters

• Process diagnosticsProcess diagnostics

• Fully automatedFully automated

• No expertise required

• Fast (2 min./test)

Page 3: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

OUTLINEOUTLINE• Rationalle and needRationalle and need• Current tecnology and its Current tecnology and its defficienciesdefficiencies• The L-Cell - principles and The L-Cell - principles and descriptiondescription• ExamplesExamples• ConclusionsConclusions

Page 4: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

Issues in PlatingIssues in Plating

Predictive DesignPredictive Design

Meeting Specs., OptimizationMeeting Specs., Optimization

Process Control and Process Control and MaintenanceMaintenance

Environmental and Health

New Materials

Page 5: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

L-L-CellCell

FUTURE:FUTURE:

Available ToolsAvailable Tools Predictive DesignPredictive Design

OptimizationOptimization

Process ControlProcess Control

}} Computer Aided Design Computer Aided Design Software -Software - ‘Cell-Design’‘Cell-Design’

o Hull-CellHull-Cell

o Electroanalytical Electroanalytical Techniques-Techniques-

Polarization studiesPolarization studies

Conductivity Conductivity

Titration (reactant Titration (reactant conc.)conc.)

PAST:PAST:

Page 6: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

Limitations of CAD SoftwareLimitations of CAD Software

OUTPUT

INPUT

Numerical‘Solver’

Cell configuration• Cell• Anodes• Racks and Shields

Operating Conditions• current or voltage

(DC or Periodic)• temperature• flow

Process Properties• Electrode polarization• Electrolyte conductivity• Diffusivity

• Current distribution• Deposit thickness distribution• Potential distribution• Overpotential (polarization)• Parasitic reaction rates• Alloy composition• Part’s evolving shape• Deposit texture

Often Often MissingMissing

Page 7: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

• Strong dependence on trace additivesStrong dependence on trace additives• Proprietary formulationsProprietary formulations• Lack of fundamental mechanistic understandingLack of fundamental mechanistic understanding• Laboratory experiments often do not duplicate process Laboratory experiments often do not duplicate process conditionsconditions• Flow dependenceFlow dependence• Cost:Cost:

• Potentiostat ~ $ 20,000 - 40,000Potentiostat ~ $ 20,000 - 40,000• Rotating disk electrode ~ $ 10,000Rotating disk electrode ~ $ 10,000• PhD investigator ~ $ 100K/yrPhD investigator ~ $ 100K/yr

Issues with Obtaining Process Data Issues with Obtaining Process Data using Conventional Approachusing Conventional Approach

i

V

Page 8: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

Limitations of the Hull-CellLimitations of the Hull-Cell

• Qualitative

• Current distribution is inherently inaccurate – varies with material

• No quantitative data

++-

Page 9: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

The L-Cell Provides:The L-Cell Provides: Comprehensive electrochemical process parameters

• Polarization curves

• Kinetics parameters

• Conductivity

Process diagnostics:

• Indication of process variation due to

additives consumption

contamination

Tool for process adjustment using a small (50 ml) volume

Sample plated at a number of different and precisely known current densities for visual and analytical off-line testing

• Composition of alloy – partial currents

• Thickness measurements – current efficiency as f(i)

Fully automated, fast (2 min.) experiment designed for non-experts

Equipment is relatively inexpensive

Page 10: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

THE L-Cell – Principle of Operation THE L-Cell – Principle of Operation • Multi-electrode cartridge and a cell that allows a separate current feed to each segment

• Electronics to provide a different and precisely measured current density to each segment

• Automated data acquisition and analysis

Plated cartridge with segmented electrodes Cross-section

Page 11: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

The L-Cell: Table-top design The L-Cell: Table-top design

Page 12: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

The multi-pin connector The multi-pin connector

Page 13: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

The L-Cell: Table-top designThe L-Cell: Table-top design

Page 14: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

The L-Cell: Table-top designThe L-Cell: Table-top design

Watts Nickel Testing

Page 15: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

Design of the L-CellDesign of the L-Cell ‘Cell-Design’ Modeling

Current distribution – different between segments but uniform on each segment

Potential distribution:

Reference electrode

Top View (cross-section): Anode: oxygen evolution

Segmented cathode (plated cartridge)

Page 16: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

THE L-Cell – Analytical Approach THE L-Cell – Analytical Approach Unknowns:

Voltage balancesVoltage balances

Cathodic polarization curve: iK =f (A)

Cathodic overpotentials (i0, C, A)

Conductivity

Measure:Segmental current densities

Voltages (including reference electrodes)

Conductivity

Across the cell Overpotentials

Data analysisData analysisButler-Volmer fit kinetics parameters (i0, C, A)

Page 17: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

0

FF CA

a aRT RTKi i e e

DATA ANALYSISDATA ANALYSIS

0

FF CA

ERT RT

B

Ci i e e

C

a C

Butler-Volmer:

(pure kinetics, No transport limitations)

Mass transport included:

Here, i0 is measured at CB and:

CB

CE

= CBCE

Page 18: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

DATA ANALYSISDATA ANALYSIS

0

FC

E RT

B

Ci i e

C

1E

B L

C i

C i

Tafel approximation:

Equivalent mass transport boundary layer thickness

BL

C

nFDCi

0 1

FC

RT

L

ii i e

i

Page 19: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

DATA ANALYSISDATA ANALYSIS

0

1

FC

RTK

L

ii i e

il

ik = Equivalent pure ‘kinetics‘ current derived from the measured current density, i

0 1

FC

RT

L

ii i e

i

Page 20: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

The L-Cell System The L-Cell System

Page 21: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

DATA AQUISITION DATA AQUISITION

0.18

1.25 1.0929.018.114.28.35.0

22. 6

3.02

Page 22: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

Cu deposition

Copper sulfate

0.5 M

pH=2

Polarization curve

Kinetics Parameters

Page 23: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

Cu deposition

Copper sulfate

0.5 M

pH=2

100 ppm PEG

Page 24: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

Cu deposition

Copper sulfate

0.5 M

pH=2

Compare with:

100 ppm PEG

Pure Cu

w/PEG

Comparing two tests

Page 25: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

w/PEG

Specification of acceptable deviation

Page 26: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

0

20

40

60

80

100

-0.21-0.16-0.11-0.06

Overpotential, [V]

Curr

ent de

nsi

ty [m

A/c

m2]

Copper deposition from copper sulfate Copper deposition from copper sulfate No additives; pH=2No additives; pH=2

Page 27: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

0.0

0.5

1.0

1.5

2.0

2.5

-0.4-0.3-0.2-0.10

Overpotential, [V]

No PEG

100 ppm PEG

Lo

g i

[m

A/c

m2 ]

Copper deposition from copper sulfate Copper deposition from copper sulfate pH=2pH=2

Page 28: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

0

20

40

60

-1-0.9-0.8-0.7-0.6-0.5-0.4

Overpotential, η [V]

C

urr

en

t d

en

sit

y [m

A/c

m2 ]

Nickel Deposition from a standard Nickel Deposition from a standard Nickel Watts ElectrolyteNickel Watts Electrolyte

Page 29: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

0

0.4

0.8

1.2

1.6

2

-1-0.9-0.8-0.7-0.6-0.5-0.4

Overpotential, η [V]

L

og

{ i K

[mA

/cm

2] }

Nickel Deposition from a standard Nickel Deposition from a standard Nickel Watts ElectrolyteNickel Watts Electrolyte

Page 30: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

Wagner Number Wagner Number

Page 31: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

Throwing Power Throwing Power

Page 32: L-Cell A Novel Device for Plating Process Diagnostics L-Chem, Inc. Shaker Heights, OH 44120

The L-Cell Provides:The L-Cell Provides:

• Process properties: Polarization, Kinetics, Conductivity– Use ‘regular production’ solution– By-pass specialized testing – no special expertise needed– No need to scan v-i, or apply transients – use steady-state data– Fast (2 min.), completely automated

• Produces deposit samples plated at different current densities

• Process diagnostics tool

Summary -Summary -