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  • Intel® Pentium® 4 Processor-M for Applied Computing Thermal Design Guide

    October 2002

    Order Number: 273729-003

  • 2 Thermal Design Guide

    Intel® Pentium ® 4 Processor-M for Applied Computing

    Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications.

    Intel may make changes to specifications and product descriptions at any time, without notice.

    Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

    The Intel® Pentium® 4 Processor-M may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

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    Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

    Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com.

    AlertVIEW, i960, AnyPoint, AppChoice, BoardWatch, BunnyPeople, CablePort, Celeron, Chips, Commerce Cart, CT Connect, CT Media, Dialogic, DM3, EtherExpress, ETOX, FlashFile, GatherRound, i386, i486, iCat, iCOMP, Insight960, InstantIP, Intel, Intel logo, Intel386, Intel486, Intel740, IntelDX2, IntelDX4, IntelSX2, Intel ChatPad, Intel Create&Share, Intel Dot.Station, Intel GigaBlade, Intel InBusiness, Intel Inside, Intel Inside logo, Intel NetBurst, Intel NetStructure, Intel Play, Intel Play logo, Intel Pocket Concert, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel TeamStation, Intel Web Outfitter, Intel Xeon, Intel XScale, Itanium, JobAnalyst, LANDesk, LANRover, MCS, MMX, MMX logo, NetPort, NetportExpress, Optimizer logo, OverDrive, Paragon, PC Dads, PC Parents, Pentium, Pentium II Xeon, Pentium III Xeon, Performance at Your Command, ProShare, RemoteExpress, Screamline, Shiva, SmartDie, Solutions960, Sound Mark, StorageExpress, The Computer Inside, The Journey Inside, This Way In, TokenExpress, Trillium, Vivonic, and VTune are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

    Copyright © Intel Corporation, 2002

    *Other names and brands may be claimed as the property of others.

  • Thermal Design Guide 3

    Intel® Pentium ® 4 Processor-M for Applied Computing

    Contents 1.0 Introduction....................................................................................................................................5

    1.1 Document Purpose ...............................................................................................................5 1.2 Document Scope ..................................................................................................................5 1.3 References ...........................................................................................................................6 1.4 Definition of Terms................................................................................................................6

    2.0 Design Guideline ...........................................................................................................................7

    3.0 Mechanical Guidelines ..................................................................................................................7

    3.1 Processor Package...............................................................................................................7 3.2 Socket Information................................................................................................................9 3.3 Keep-In/Keep-Out Zones....................................................................................................12 3.4 Motherboard Interface: Clip and Retention Mechanism .....................................................14

    3.4.1 Retention Mechanism ............................................................................................14 3.4.2 Requirements for Solutions Using Intel® Retention Mechanism............................16 3.4.3 Heat Sink Clip Requirements.................................................................................17

    3.4.3.1 Heat Sink Attach Clip Usage..................................................................17 3.4.3.2 Clip Structural Considerations ...............................................................18

    3.5 Fan Requirements for Active Heat Sinks............................................................................18 3.5.1 Electrical Requirements.........................................................................................18 3.5.2 Variable Speed Fan ...............................................................................................18 3.5.3 Fan Power Connector ............................................................................................19 3.5.4 Reliability Requirements for Active Solutions ........................................................20

    3.6 Mechanical Performance Requirements.............................................................................20 3.6.1 Structural Requirements ........................................................................................20

    3.6.1.1 Random Vibration Test ..........................................................................20 3.6.1.2 Post-Test Pass Criteria ..........................................................................22

    3.7 Miscellaneous Requirements..............................................................................................22 3.7.1 Material and Recycling Requirements ...................................................................22 3.7.2 Safety Requirements .............................................................................................22

    4.0 Thermal Guidelines .....................................................................................................................23

    4.1 Introduction .........................................................................................................................23 4.2 Processor Junction Temperature and Die Modeling...........................................................23 4.3 Processor Thermal Design Power ......................................................................................24 4.4 Thermal Solution Requirements .........................................................................................24 4.5 Recommended Thermal Interface Material ........................................................................25 4.6 Reference Thermal Solutions .............................................................................................26

    4.6.1 Sanyo-Denki Active Heat Sink with Intel Retention Mechanism............................26 4.6.2 CoolerMaster* Active Heat Sink.............................................................................27

    5.0 On-Die Thermal Management .....................................................................................................27

    5.1 Thermal Monitor..................................................................................................................27 5.2 Thermal Diode ....................................................................................................................29 5.3 Catastrophic Thermal Protection ........................................................................................29

    6.0 Vendor List ...................................................................................................................................30

  • 4 Thermal Design Guide

    Intel® Pentium ® 4 Processor-M for Applied Computing

    Figures

    1 µFCPGA Package Geometry – Top and Side Views ................................................................... 8 2 µFCPGA Package Geometry – Bottom View ............................................................................... 8 3 µPGA478B Socket Dimensional Drawing................................................................................... 10 4 µPGA479M Socket Dimensional Drawing ..................................................................................11 5 Keep-Out Zone Using Reference Intel Retention Mechanism — Part 1 of 2 ............................. 12 6 Keep-Out Zone with Sizings, Dimensions and Architecture — Part 2 of 2 ................................. 13 7 Keep-In Zone for 1U and Double Slot CompactPCI Form Factors............................................. 13 8 Intel® Reference Retention Mechanism – Final Assembly ................

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