Intel Pentium for Applied .2 Thermal Design Guide Intel® Pentium ® 4 Processor-M for Applied Computing

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  • Intel Pentium 4 Processor-Mfor Applied ComputingThermal Design Guide

    October 2002

    Order Number: 273729-003

  • 2 Thermal Design Guide

    Intel Pentium 4 Processor-M for Applied Computing

    Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectualproperty rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liabilitywhatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating tofitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are notintended for use in medical, life saving, or life sustaining applications.

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    The Intel Pentium 4 Processor-M may contain design defects or errors known as errata which may cause the product to deviate from publishedspecifications. Current characterized errata are available on request.

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  • Thermal Design Guide 3

    Intel Pentium 4 Processor-M for Applied Computing

    Contents1.0 Introduction....................................................................................................................................5

    1.1 Document Purpose ...............................................................................................................51.2 Document Scope ..................................................................................................................51.3 References ...........................................................................................................................61.4 Definition of Terms................................................................................................................6

    2.0 Design Guideline ...........................................................................................................................7

    3.0 Mechanical Guidelines ..................................................................................................................7

    3.1 Processor Package...............................................................................................................73.2 Socket Information................................................................................................................93.3 Keep-In/Keep-Out Zones....................................................................................................123.4 Motherboard Interface: Clip and Retention Mechanism .....................................................14

    3.4.1 Retention Mechanism ............................................................................................143.4.2 Requirements for Solutions Using Intel Retention Mechanism............................163.4.3 Heat Sink Clip Requirements.................................................................................17

    3.4.3.1 Heat Sink Attach Clip Usage..................................................................173.4.3.2 Clip Structural Considerations ...............................................................18

    3.5 Fan Requirements for Active Heat Sinks............................................................................183.5.1 Electrical Requirements.........................................................................................183.5.2 Variable Speed Fan ...............................................................................................183.5.3 Fan Power Connector ............................................................................................193.5.4 Reliability Requirements for Active Solutions ........................................................20

    3.6 Mechanical Performance Requirements.............................................................................203.6.1 Structural Requirements ........................................................................................20

    3.6.1.1 Random Vibration Test ..........................................................................203.6.1.2 Post-Test Pass Criteria ..........................................................................22

    3.7 Miscellaneous Requirements..............................................................................................223.7.1 Material and Recycling Requirements ...................................................................223.7.2 Safety Requirements .............................................................................................22

    4.0 Thermal Guidelines .....................................................................................................................23

    4.1 Introduction .........................................................................................................................234.2 Processor Junction Temperature and Die Modeling...........................................................234.3 Processor Thermal Design Power ......................................................................................244.4 Thermal Solution Requirements .........................................................................................244.5 Recommended Thermal Interface Material ........................................................................254.6 Reference Thermal Solutions .............................................................................................26

    4.6.1 Sanyo-Denki Active Heat Sink with Intel Retention Mechanism............................264.6.2 CoolerMaster* Active Heat Sink.............................................................................27

    5.0 On-Die Thermal Management .....................................................................................................27

    5.1 Thermal Monitor..................................................................................................................275.2 Thermal Diode ....................................................................................................................295.3 Catastrophic Thermal Protection ........................................................................................29

    6.0 Vendor List ...................................................................................................................................30

  • 4 Thermal Design Guide

    Intel Pentium 4 Processor-M for Applied Computing

    Figures

    1 FCPGA Package Geometry Top and Side Views ................................................................... 82 FCPGA Package Geometry Bottom View ............................................................................... 83 PGA478B Socket Dimensional Drawing................................................................................... 104 PGA479M Socket Dimensional Drawing ..................................................................................115 Keep-Out Zone Using Reference Intel Retention Mechanism Part 1 of 2 ............................. 126 Keep-Out Zone with Sizings, Dimensions and Architecture Part 2 of 2 ................................. 137 Keep-In Zone for 1U and Double Slot CompactPCI Form Factors............................................. 138 Intel Reference Retention Mechanism Final Assembly ......................................................... 149 Intel Reference Retention Mechanism with Sizings, Dimensions and

    Architecture ......................................................................................