Integrating HDI Technologies with Rigid-flex - IBM ??Integrating HDI Technologies with Rigid-flex Presenter: ... LCD Display Rigid PCB Touch Panel ... Shocking Technology integration

  • View
    213

  • Download
    1

Embed Size (px)

Text of Integrating HDI Technologies with Rigid-flex - IBM ??Integrating HDI Technologies with Rigid-flex...

  • Integrating HDI Technologies

    with Rigid-flex

    Presenter: Bill Beckenbaugh, PhD

    VP, Design & Engineering Multek

    11/16/2011

  • Produced more than 600M PCB pcs for Mobile Devices.

    Shipped 61M handset PCBs in 2010

    15 years in mobile PCB and 5 years in mobile FPC

    8 factories on 4 continents with over 2M sq.ft manufacturing space.

    Top 5 Leading Suppliers HDI PCB - Prismark 2010

    Build HDI, Rigid-Flex, FPC/A, Displays, and Touch Panels for Mobile Devices

    Over $475M capital investment during the last 6 years.

    Multek Facts

  • Every Layer Interconnect(ELIC)

    & Rigid-flex Market Outlook

  • Mobile Phone Segment Forecast

    Smartphone shipment will reach 4.05 billion in 2011, increases YoY 49.89%.

    Smartphones will account for more than 25% of standard mobile phone, and >30% in 2012.

    Apples iOS market share is predicted to increase to 22% in 2011; while Android goes to 25%.

    Increasing demand for smartphone continues to benefit manufacturers of advanced components

    such as MEMS sensors, optical materials, touch solutions, and all HDI PCB technologies.

    Source: IDC/ Gartner

    Smartphone and Tablet volume demands for unique HDI interconnect materials and processes

    are funding the global future of PCB industry process, materials, and equipment innovations.

    | Copyright 2011 Multek. All rights reserved. |

  • 5

    Source: Japan Marketing Service, LTD., 2010 RFC & FPC Report

    | Copyright 2011 Multek. All rights reserved. |

  • Technology Drivers in Portables

  • 7

    Mobile Phone - Technology Revolution

    10L ELIC

    1217 K lasers

    5 X solid via plating

    4 X pressing

    4 + 2 + 4

    2,147 K lasers

    4X solid via plating

    4X pressing

    3 + (4) + 3

    878 K lasers

    3 X solid via plating

    4 X pressing

    Complexity

    YR2008 YR2009 YR2010 YR2011 YR2012 YR2013

    2 + 6 + 2

    175 K lasers

    no solid via plating

    2X pressing

    2 + (6) + 2

    260 K lasers

    2X solid via

    plating

    3X pressing

    All major customers are moving to ELIC !!

    ELIC

    Medias

    Ultra Thin 7.7mm

    Android 2.2

    5.1 megapixel

    CMOS camera

    1Seg digital TV tuner

    E-wallet function

    3G/GSM

    microSDHC

    Infrared comm /Blutooth,

    GPS and Wifi

    105g weight

    NB,3C,Mobile,MP3

    Module, GPS

    3G PDA combine GPS

    3G Smart phone

    4G Products

    ELIC-HDI

    0.3mm

    L/S 50/50

    ELIC-HDI

    0.25mm

    L/S 35/35

    0.3 mm BGA

    2 mil center core

    2 mil lines/spaces

    10 -12 layer ELIC

    Solid Via on all 4 layer

    1 mil SM registration

    2.2 million holes/panel

    3 mil micro via size

    8 mil min pad size

    No mechanical holes

    | Copyright 2011 Multek. All rights reserved. |

    http://pdadb.net/imageview.php?file=rim_blackberry_8520.jpg

  • E-Book PCB & Display at a glance

    LCD Display

    Rigid PCB

    Touch Panel Acoustic

    Touch

    FPC

    ITO Material

    | Copyright 2011 Multek. All rights reserved. |

  • 9 | Copyright 2011 Multek. All rights reserved. |

    Miniaturization continues pace: Wafer Scale Array ICs & 01005 SMT &

    beyond drive X,Y, & Z axis volumetric design for connectivity

    01005

    (M0402) 0050025 ?? (M0201)

  • CONFIDENTIAL | Copyright 2011 Multek. All rights reserved.

    Recess cavity

    75150

    30050

    50

    50

    250

    200

    300

    75

    Inner Layer Outer Layer

    Top View Cross Section

    0.3mm pitch

    VSDM in build-up layer

    XStatic

    Top

    Plane

    Signal / Plane

    Signal / Plane

    I/O

    Passive

    Signal 3

    Signal / Plane

    Signal / PlaneSignal / Plane

    Plane

    Bottom

    XStatic Core

    Signal 1

    VSD

    Layer

    Connector

    I/O

    GND Plane

    Signal 2

    Signal 3

    PassiveActive

    Shocking Technology

    ELIC Capabilities

    Multek New Technology Focus for Smartphone/Tablet

    | Copyright 2011 Multek. All rights reserved. |

  • 11

    Filled via HDI

    Technical Advantages of solid via

    Improved solder join reliability

    Elimination of air bubble

    Reduce solder short in BGA (0.5mm pitch or less )

    Improved PCB design

    Enhance circuit routing flexibility

    Size reduction of PCB

    Improve thermal performance

    Enhance signal quality

    (shorter path)

    | Copyright 2011 Multek. All rights reserved. |

  • ELIC and FPC Development

    for Rigid-flex

  • Process flow comparison of stacked via technologies

    Interconnect technology ELIC + HDI ALIVH-C B2it + HDI

    Layer structure

    Inner layer

    Conductive

    material Cu plating Cu paste Ag past

    Process

    Connection Plating joint Compression joint Compression joint

    Outer layer Process Laser + cu plating Laser + cu plating Laser + cu plating

    | Copyright 2011 Multek. All rights reserved. | 15

  • Plated stacked uVia Process overview

    14 | Copyright 2011 Multek. All rights reserved. |

    L4 L3 L2

    Prepreg L8

    Prepreg L1

    Prepreg L2

    Prepreg L7

    Prepreg L6

    Prepreg L3

    Core L4 & L5

    L1 1. Laser Drill

    2. Print & Etch Circuit

    3. Copper Plate

    4. Laminate

    5. Laser Drill X2

    6. Print & Etch Circuit

    7. Copper Plate

    8. Laminate

    9. Laser Drill X2

    10. Print & Etch Circuit

    11. Copper Plate

    12. Laminate

    13. Laser Drill X2

    14. Print & Etch Circuit

    15. Copper Plate

    cu1

    tcu2

    bcu2

    bcu3

    tcu3

    tcu4

    bcu4

  • 15 | Copyright 2011 Multek. All rights reserved. |

    ELIC & Copper solid via

    Copper solid via & stack microvia (Plating method) Methodology

    - Copper filling of via by electroplating

    - Process with special plating additive system & agitation (impingement)

    - DC plating method in Multek

    Localized

    accumulation of

    brightener accelerates

    the plating inside via

  • 16 | Copyright 2011 Multek. All rights reserved. |

    Process Flow-8 Layer ELIC

    Cu reduction : L4/5

    Laser drill :

    L4/L5

    PTH/ uvia filling

    Dry film

    DES & AOI : L4 & L5

    Oxide replacement

    Lamination : L3/6

    Cu reduction : L3/6

    Laser drill :

    L3/L4 & L6/L5

    PTH/ uvia filling

    Dry film

    DES & AOI : L3 & L6

    Oxide replacement

    Lamination : L2/7

    Cu reduction : L2/7

    Laser drill :

    L2/L3 & L7/L6

    PTH/ uvia filling

    Dry film

    DES AOI : L2 & L7

    Oxide replacement

    Lamination : L1/8

    Cu reduction : L1/8

    Laser drill :

    L1/L2 & L8/L7

    PTH/ Cu filling

    Dry film

    DES & AOI : L1 & L8

    S/M

    Routing; QC/ET

    Remark : Only key process steps are shown.

  • 17

    Multek FPC Process Capabilities

    25um Via Novaflex HDI

    Roll-to-Roll FCCL

    Fine lines

  • 18

    PTH hole quality: FPCs require optimized drill/de-smear processing

    De-smear and plating done in horizontal lines yields excellent PTH uniformity

    | Copyright 2011 Multek. All rights reserved. |

  • XStatic: A Voltage Switchable Dielectric (VSD)

    Polymer Diode

    Shocking Technologies

    19

    A Voltage Switchable Dielectric (VSD) behaves like an insulator (dielectric) during

    normal circuit operation and becomes conductive when voltage surpasses a predefined

    threshold.

    During conduction, the resistance changes so as to maintain a constant clamp voltage. The

    material becomes an insulator again after the voltage drops back below the threshold to

    normal operating levels.

    The clamp is bi-directional working equally well with both positive and negative pulsed

    events.

    The sub-nanosecond response time is fast enough to clamp ESD transients to a safe level.

    Insulator

    Conductor

    ESD Transient Voltage

    +100 V +200 V +300 V +30 KV

    Clamp Voltage

    Adjustable

    -100 V -200 V -300 V -30 KV

    Clamp Voltage

    Adjustable

    Normal

    Operation

  • XStatic

    VSDM

    Plated via connecting net

    of interest to VSD Switching Gap

    Ground

    Plane

    How It Works

    Shocking Technologies

  • 21

    Customer qualification

    VSD material characterization

    Processing - laser drilling, desmear, PTH/plating

    ELIC TV of using VSDM Cu foil in build-up layer

    XStatic Structure: Via pad to Ground plane

    XStatic Core

    Top

    Plane

    Signal / Plane

    Signal / Plane

    I/O

    Passive

    Signal 3

    Signal / Plane

    Signal / Plane

    Signal / Plane

    Plane

    Bottom

    Shocking Technology integration with our ELIC process

    | Copyright 2011 Multek. All rights reserved. |

  • Rigid Flex Roadmap

  • 23

    Roadmap: ELIC Technology

    2011 2012 2013

    Layer count

    Thickness

    Min.

Recommended

View more >