HP ProBook 6570b Disassembly Instructions

7/23/2019 HP ProBook 6570b Disassembly Instructions

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PSG instructions for this template are available at EL-MF877-01

Item Description Notes

Quantityof itemsincludedin product

Printed Circuit Boards (PCB) or Printed CircuitAssemblies (PCA)

With a surface greater than 10 sq cmMother Board,Function Board,USB Small Board

3

Batteries All types including standard alkaline and lithium coinor button style batteries Coin cell battery,batterypack

2

Mercury-containing components For example, mercury in lamps, display backlights,scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greaterthan 100 sq cm

Includes background illuminated displays with gasdischarge lamps LCD panel

1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuringgreater than 2.5 cm in diameter or height

0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants

weighing >25 grams (not including PCBs or PCAsalready listed as a separate item above)

0

Components and parts containing toner and ink,including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, ventchambers, and service stations.

0

Product End-of-Life Disassembly InstructionsProduct Category: Notebooks and Tablet PCs

Marketing Name / Model[List multiple models if applicable.]

HP ProBook 6570b Notebook PC

Purpose:The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructionsfor the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EUdirective 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, asapplicable.


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Components and waste containing asbestos 0

Components, parts and materials containingrefractory ceramic fibers

Components, parts and materials containingradioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where componentsand materials requiring selective treatment can be removed.

Tool Description Tool Size (ifapplicable)

Automatic screw driver Philip #1

Automatic screw driver T8

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove the Battery,and loosen screws on logic lower.2. Get HDD, ODD and memory.3. Remove KB,Pull out connecter.4. Remove C cover5. Pull out the DC IN cable, HDD connecter,ODD connecter,and USB Board cable,Remove Speaker cable from MB.6. Loosen screw on WLAN and remove antenna.7. Remove the MB,take down the thermal module and the CPU.8. Remove LCD module, tear down LCD Cover.

9. Remove panel and camera

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the itemscontained in the product that require selective treatment (with descriptions and arrows identifying locations).


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WEEE DisassemblyWork Instructs Tabulator: Nathan Ho

PSG instructionsfor thistemplate are available at EL-MF877-01

WorkInstructs

DocumentName:DisassemblyWI Step : 1

Subjec

t

: Get

Batt

ery&BigDoor Dat

e: 2012-02-14

Step:

Take offthe batterandthe s stem door.ToolDescription ToolSize ToolDescription ToolSize

Automatic screwdriver Philip#1 Automatic screwdriver T8

Pointforattention: Iffindingsomedefects,noticethegafferandassess.

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Work Instructs

DocumentNo. :DisassemblyWI Step : 2

Subjec

t

: Get

WLAN card and memory Dat

e : 2012-02-14

Step:

1. Loosen screws onWLAN card, WWAN card and modem.

2. Pull out theMemory card andRTC battery.

ToolDescription ToolSize ToolDescription ToolSize

Automaticscrewdriver Philip#1 Automaticscrewdriver T8

Pointfor attention: If findingsome defects,notice the gafferand assess.

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Work Instructs


Subjec

t

: Disassemble hinges Dat

e : 2012-02-14

Step:

Loosen screws on backofsystem.

ToolDescription ToolSize ToolDescription Tool Size




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Work Instructs


Subjec

t

: Disassemblekeyboard Dat

e : 2012-02-14

Step:

Remove thekeyboard, and then loosen all thescrews under the keyboard.





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Work Instructs


Subjec

t

: DisassembleLOW

ER_

CASE

Dat

e : 2012-02-14

Step:

Disassemble LOWER CASE.



Pointfor attention: If findingsome defects,notice the gafferandassess.


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Work Instructs


Subjec

t

: DisassembleMB Dat

e : 2012-02-14

Step:

1. Loosen screws onM/B.

2.Takeoffthermal module.





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Work Instructs


Subjec

t

: DisassembleMB Dat

e : 2012-02-14

Step:

1. Remove CPU.





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Work Instructs


Subjec

t

: Disassemble funct

ionboard Dat

e : 2012-02-14

Step:

1. Loosen five screws on hinges.

2. DividedLCD module and LOWER_CASE into twoparts.





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Work Instructs


Subjec

t

: DisassembleKB_DEC

K Dat

e : 2012-02-14

Step:

1. Loosen fourscrews on thehinges cover.

2. DisassembleKB_DECK.





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Work Instructs


Subjec

t

: DisassembleLCD module Dat

e : 2012-02-14

Step:

1. Loosen two screws onLCD lowercorner.

2.Take away thehinge covers.

3. Disassemble LCD Bezel.





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Work Instructs


Subjec

t


e : 2012-02-14

Step:

1. Loosen four screws on hinges.

2. Disassemble LCD and Display A cover.





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Work Instructs


Subjec

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Step:

1. Loosen six screws onLCD and disassemble Hinges.





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Work Instructs


Subjec

t


e : 2012-02-14

Step:

Take down LVDS Cable and camera module.




Documents

HP ProBook 6570b Disassembly Instructions