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GreatTeamBackendFoundry,Inc.

www.gtbf‐ltd.com

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 Aleaderofsemiconductorpackagingandtes?ngservices,specializedinpowermanagement,smallsignal,discreteandcontrolICspackages.

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  DateofFounded：May/21/2001

  Paid‐inCapital:USD42.4Million

  MajorShareholders:Etron,Pouchen,Hotung

  Chairman:MaxWu

  C.E.O.:CraigTzeng  President:JohnsonTzu  No.ofEmployee:1,000(Apr2011)

  FactorySpace:11,000SquareMeter

  CurrentMaximumCapacity:210KK/month

  ManufacturingFacility：DongGuan,GuangDong,China

  URL:www.gtbf‐ltd.com

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Increaseproduc?vityandcosteffec?venesstoachievehighprofitabilityandmaximizetotalreturn.

Increaseproduc?vityandcosteffec?venesstoachievehighprofitabilityandmaximizetotalreturn.

Establishlong‐termpartnershipwithcustomer,vendorsandemployeesformutualgains.

EnsurehighgrowthtoincreasemarketshareinPowermanagement

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Toprovidethetotalsolu?onofdevelopment,produc?on,logis?csanddropshipforpackagingandtes?ngservice.

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PassedDelphiManufacturingCapabilityAssessmentAudit

PassedPanasonicAutomo?veauditPassedAlpinesaudit

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PackageJun2001 IncorporatedinBVIDec2002 Massproduc?onTO‐252packageFeb2003 IntroducedSOT‐89packageMay2004 IntroducedSOT‐23packageNov2005 IntroducedSOP‐8packageMay2007 IntroducedTO‐220andTSSOP‐8packagesAug2007 IntroducedSOT‐223packageAug2008 IntroducedTO‐220FandPPAK(DFN5x6)packagesAug2010 IntroducedMicro3packageOct2010 IntroducedDirectFET(customizedPackage)May2011 IntroducedTO‐247packageAug2011 IntroducedQFNPackageTechnologyAug2006 NewtechnologyALribbonmassproduc?on.Aug2008 ABCCuwirebondingIPregisteredApr2009 Massproduc?onABCCuwirebondingAug2010 Massproduc?onFullCuWirebonding

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  CurrentProducts  TOseries:TO252,TO220/FP,TO263,TO2477  SOseries:P/SOP8L,TSSOP8L  SOTseries:SOT223,SOT89,SOT2X(EIAJ/JEDEC),SC70

  DFN:5x6PPAK8L  QFN:2x2,3x3,4x4,5x5…  DirectFET:Large(6.95x9.1),Medium(4.9x6.3),Small(3.8x4.8),

Tiny(2.9x4.0)

9 Pla?

ng(O

utsou

rce)

DieSaw DieBond WireBond Molding

T/F Tes?ng&Packing Rel.Lab.

CentralIsle

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DieAjach Epoxy Solder Eutec?c

WireBond Au ABC/Cu Alwire&Ribbon

MCM LFBase

LaminateBase

Packing Tape&Reel Tube Tray

Tes?ng AnalogueIC PowerDiscrete MixSignal

Dieajach:Epoxy+Solder

Wirebond:Au/Cu+Alwire/ribbon

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2011 2012 2013

Performance

SmallFormFactor

LowCost

Cycle?me

Reliability

Ready

Alwire,AlRibbon,Cuwire,

Auwire

Solder,Epoxy,Eute;cBond

Backsidemetalpla;ng

WaferThining

MSLL1

RibbonBond CuClip

ThinWafer

QFN+MCM FlipChip

WCLSP

RibbonBond ThinWafer

LGA+MCM

CP ThinWafer

Mul?chippackaging

FlipChip

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  CurrentProducts  TOseries:TO252,TO220/FP,TO263,TO2477  SOseries:P/SOP8L,TSSOP8L  SOTseries:SOT223,SOT89,SOT2X(EIAJ/JEDEC),SC70

  DFN:5x6PPAK8L  QFN:2x2,3x3,4x4,5x5…  DirectFET:Large(6.95x9.1),Medium(4.9x6.3),Small(3.8x4.8),

Tiny(2.9x4.0)

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SOTSeries TSSOP SOT‐223 SOT‐23/25/26 SC70 SOT‐89

SOPSeries SOP‐8 SOP‐14 SOP‐16 PSOP‐8 MSOP‐8 PPAK

TOSeries TO‐252 TO220/FP TO263

 TO247

IPM

1sthalf2012

2ndhalf2012

2013~2ndhalf2011

1sthalf2011

TOSeries TO247

QFN

Forribbonbonding

QFN/LGAMCM

Forwirebonding

LowRdson Highdensity Highthermalperformance

IPM‐Auto

IGBTModule‐Rail

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Today 2ndhalf2011

1sthalf2012

2012~1sthalf2011

PowerModuleSiP IntegratewithIGBTs,Diodesanddrivers Transfermold Passivecomponents

TSSOP‐8 2to3DieMCM

PSOP8/SO8 2to3DieMCM

PSOP8 2to3DieMCM Ribbononchip

QFNRibbon+Ballbond 2to3DieMCM LowerResistance

D2PAK/DPAK 2to3DieMCM

IGBTModule MCMwithcas;ng Vacuumsoldering

QFN Buckconverter Copperbond Ribbonbond CLIPbond FlipChip

QFN Dr.MOS Copperbond Ribbonbond

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  Tosupportthemarketrequirements  Willheavyinvestintohighpowerpackages(IGBTs,IPMsetc,)  ImprovethermalperformanceforhightemperatureMCMapplica?ons

  Weofferourcustomersjointdevelopmentandmodifica?onfor  Newpackagingtechnologydevelopment(MCM&powerpackagesetc.)  Jointtestprogramdevelopmentforqualityimprovement  Forimprovementofthermalperformanceandcharacteriza?on

  Dedicatedcustomerlines(highIPprotec?on)  SecureQualityduetopermanentcustomersurveyatthefacility  Excellenttrainedworkforce

  Logis?c:Drop‐shipmentandHUBmanagement

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GreatTeamBackendFoundry,Inc.

B,gbmPark,.YueYuenIndustrialEstate,HuangJiangZhen,

DongGuanCity,GuangDongProvince,China

Tel：+86‐769‐83635267,+86‐769‐86915999

Fax：+86‐769‐83661290

E‐mail：Grace_Wu@gtbf‐ltd.com

www.gtbf‐ltd.com

EuropeanRepresenta?veHTCErnst.Weissbache.K

T:+49‐8106‐351646

eaweissbach@htc‐weissbach.com

www.htc‐weissbach.com

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Ourmanagementphilosophyistobetrulycustomer‐oriented

byprovidinghighlyreliableproductqualityandcon?nuousimprovement

inordertoachievetotalcustomersa?sfac?onand

cost‐effec?veness

Serviceisourmojo