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GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 1
GLAST Large Area TelescopeGLAST Large Area TelescopeTracker Subsystem
Gamma-ray Large Gamma-ray Large Area Space Area Space TelescopeTelescope
5B: EEE Parts and Electronic Packaging
Nick VirmaniLAT EEE parts and Electronic Packaging Manager
[email protected](202) - 767 - 3455
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 2
OutlineOutline
• EEE Parts Requirements• EEE Part Implementation Plan• EEE Parts Status • Process Flow for ASICs and MCM Fabrication, Screening,
and Qualification• Radiation Testing• Radiation testing Results• Electronic Packaging Program• ASIC and MCM Documentation Status• EEE Parts Issues & Risk Mitigation• Manufacturing and Test Process Flow of TKR Hardware
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 3
EEE Parts RequirementsEEE Parts Requirements
• Requirements Summary– Parts screening and qualification per GSFC 311-INST-001,
Level 2,– Additional requirements outlined in the LAT EEE parts
program control plan, LAT-MD-00099-1 – Review and approve EEE Part Lists.– Derate EEE Parts per PPL-21
• Review and approve derating information before drawing sign-offs.
– Perform stress analysis– Parts Control Board (PCB) Approach, a partnership
arrangement with NASA/GSFC parts engineer and code 562.
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 4
EEE Parts Implementation PlanEEE Parts Implementation Plan
• Part lists are reviewed and approved by the project PCB prior to flight procurements.
• Special considerations include:– Radiation evaluation of all active components– Radiation testing (TID and/or SEE ) when necessary– Parts stress analysis– PIND testing on all cavity devices– Destructive Physical Analysis (DPA), when applicable– Mandatory in process inspections and verification on
Multi-Chip Modules (MCMs) and other devices as required– Life Testing if Quality Conformance Inspection (QCI) data
within one year of the lot being procured is not available– No pure tin, cadmium, and zinc plating is allowed – Vendor surveillance where required.
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 5
EEE Parts Implementation PlanEEE Parts Implementation Plan
• Special considerations include cont’d:– 50V ceramic capacitors require 850C/85RH low voltage
testing– Mandatory surge current testing on all tantalum
capacitors– MCM testing and verification requires special evaluation
as outlined in the EEE parts plan– Age control requirements. Lot Date Code (LDC) older than
5 years requires DPA and room temperature re-screen– Parts traceability from procurement to assembly of board
and components.– GIDEP Alerts & NASA Advisories review and disposition
from selection of parts until subsystem integration.– Parts Identification list (PIL) includes LDC, MFR,
Radiation information on the flight lot
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 6
EEE Parts StatusEEE Parts Status
• The TKR subsystem EEE parts lists have been reviewed by the PCB all parts have been approved except ASIC screening, MCM screening, flex cable screening and qualification, and cristek connectors.
• Resettable polyswitch fuse specification LAT-SS-01116-04 was approved by the PCB and will review test data after completion of the tests.
• All part test data will be reviewed prior to flight assembly by the PCB where applicable.
• The goal is to approve the remaining parts on the parts lists prior to the CDR
• Discuss EEE parts availability weekly, to support fabrication schedule.
• Perform 100% incoming inspection as per defined procedures.
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 7
EEE Parts StatusEEE Parts Status
• Performed stress analysis of most of the approved parts on the parts lists and they meet derating criteria after stress application. Will complete the remaining analysis by the CDR.
• Perform screening and qualification tests as required per approved procedure.
• Hold regular meeting with GSFC Parts Engineer to resolve any parts-related issues and approve parts though the Parts Control Board (PCB).
• Attribute data for screening and lot specific qualification/QCI data shall be reviewed for acceptance of parts for flight.
• Parts Identification List (PIL) and As-built parts lists is maintained and will be submitted to GSFC.
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 8
Process Flow for ASICs and MCM Process Flow for ASICs and MCM Fabrication, Screening, and QualificationFabrication, Screening, and Qualification
WAFERS RECEIVE FROM MOSIS USING
AGILENT PROCESS
INSPECTIONWAFER
LAPPINGMOUNT
PROCEDURE
WAFER SAW
PROCEDURE
OPTICAL QC GATE
2ND OPTICAL INSPECTION
PACK DIE IN WAFFLE PACK OR GEL PACK FOR SHIPPING TO TELEDYNE WITH DATA
PACKAGE & TRACEABILITY
CONTROL MONITORS
FOR RADIATION
SAMPLE RADIATION TESTING
100% INSPECTION
Wafer Probe 100% Sort
dies
Wafer Probe Procedure
Receive/Inspect ASIC die in waffle or gel packs,
PWBs and parts, record data at Teledyne
VERIFY ADHESION AND
INSPECTION
Clean/Bake PWBs as per NASA-STD-
8739.3
BOND PITCH ADAPTER FLEX
CIRCUIT
DPA & Scanning Electron
Microscope (SEM)
Inspection
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 9
Process Flow for ASICs and MCM Process Flow for ASICs and MCM Fabrication, Screening, and QualificationFabrication, Screening, and Qualification
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 10
Clean Die Bonding Surfaces of PWB Plasma and Local
cleaning (IPA)
Apply Die Attach Material to PWB
(MCM)
Die Attach Material Cure per
Manufacturer’s Suggestions
Plasma Clean PWB and Die Bonding
Surfaces for Wedge Wire Bonding
Wirebond of ASIC die and MCM PWB
Die Attach Monitor
In Process Wirebond Pull Testing on
samples and Monitor
COB Die Placement on the PWB
Install connectors by hand-soldering
Functional Testing and verification of MCM as per test
program *
Rework or replace dies if required
100% Optical Inspection
* Test all register and memory locations, all I/O functions, including LVDS bias levels, all inter-* Test all register and memory locations, all I/O functions, including LVDS bias levels, all inter-chip communication, power consumption, all amplifiers by charge injection and test the trigger chip communication, power consumption, all amplifiers by charge injection and test the trigger output, and for excessive noise or instabilities.output, and for excessive noise or instabilities.
Rework, if required
Encapsulate ASIC die and bond areas
Process Flow for ASICs and MCM Process Flow for ASICs and MCM Fabrication, Screening, and QualificationFabrication, Screening, and Qualification
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 11
100% Inspection
Full Functional Testing using
configured software test & EGSE
Full Functional Testing using
configured software test & EGSE
Pack each MCM individually in the
ESD container with pigtail hanging outside of the
container for testing
MCM ready functional test &
environmental test
Conformal Coat
100% thermal cycling –30 to +85
degrees C, unpowered
Clean
Functional Testing
100% Visual
Inspection
100% Dynamic burn-in at 85
degrees C with continuous
monitoring for 168 hours
100% Inspect
Review results data package
Process Flow for ASICs and MCM Process Flow for ASICs and MCM Fabrication, Screening, and QualificationFabrication, Screening, and Qualification
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 12
100% VisualInspection
Present data to the Parts Control Board (PCB) Screening &
Qualification
MCM ready for next step and sample
selection for qualification
Select 38 MCMs from screened lot
Radiograph 2 samples and DPA
on 1 sample
Store MCM in nitrogen purge
storage
100% powered thermal cycling –30 to +85 degrees C,
100 cycles
Obtain approval from PCB
100% Visualinspection
100% Dynamic burn-in testing for
240 hours
100% Visual
Inspection
Thermal Vac testing for 10 samples, 12
cycles
Process Flow for ASICs and MCM Process Flow for ASICs and MCM Fabrication, Screening, and QualificationFabrication, Screening, and Qualification
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 13
Vibration Testing 10 samples
100% Visual
Inspection
Review of DataPCB Approval
Radiograph CSAM & DPAFunctional
Testing
Process Flow for ASICs and MCM Process Flow for ASICs and MCM Fabrication, Screening, and QualificationFabrication, Screening, and Qualification
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 14
Radiation TestingRadiation Testing
• All EEE parts are being reviewed by PCB and screened for radiation susceptibility against the radiation specification defined in GLAST IRD-433-SPEC-001.
• Requirements:– Total dose requirement, including standard factor of 2
safety margin is 4.5 Krad (Si) for 5 years behind 100 mils Aluminum.
– Our goal is to test all parts up to 10 Krads (Si).– SEE Damage – no SEE shall cause permanent damage to
the subsystem.
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 15
Radiation TestingRadiation Testing
• SEE Rate and Effects Analysis:– SEE rates and effects shall take place based on threshold
LET (LETth) as follows:
SEE immune is defined as a device have an LETth > 37 MeV*cm2/mg
– Our goal is to test each part to this specification.
Device Threshold Environment to be Assessed
LETth < 15 MeV*cm2/mg Cosmic Ray, Trapped Protons, Solar Heavy Ion and Proton
LETth =15-37 MeV*cm2/mg
LETth > 37 MeV*cm2/mg
Cosmic Ray, Solar Heavy Ion
No analysis required
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 16
Radiation Testing ResultsRadiation Testing Results
• Radiation testing was performed on engineering parts produced using similar processes and materials.
• An earlier version of ASICs tested and met requirements.• No outstanding issues
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 17
Electronic Packaging ProgramElectronic Packaging Program
• Electronic Packaging, Manufacturing, Test, and Process Control program– Manufacturing, Assembly, and Quality Control of electronic
system will be in compliance to the NASA technical standards: NASA-STD-8739.1, NASA-STD-8739.2, NASA-STD-8739.3, NASA-STD-8739.4, NASA-STD-8739.7, and IPC-6012 & 6013.
• Rigid MCM PWBs shall meet the requirements of LAT Procurement Specification, LAT-DS-01127-01 based on Mil-PRF-55110, Revision F, and GSFC S-312-P-003 with a minimum internal annular ring of 0.002”.
• Flex circuit and cables shall meet requirement of LAT-PS-01132 and IPC 6013 class 3. Coupons shall be submitted to GSFC for evaluation.
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 18
Electronic Packaging ProgramElectronic Packaging Program
• PWB Coupon will be analyzed by GSFC prior to flight assembly.
• Particular attention will be paid to the quality of workmanship, soldering, welding, wiring, marking of parts and assemblies, plating and painting.
• Verification of flight hardware will be performed by NASA certified and qualified personnel other than the original operator.
• An item inspection will be performed on each component to verify:– Configuration is as specified on each component
drawing/specification.– Workmanship standards have been met.– Test results are acceptable
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 19
ASIC and MCM Documentation StatusASIC and MCM Documentation Status
• Wafer Procurement from MOSIS / Agilent
– LAT-PS-1279: Overview
– LAT-PS-1201: Front-end readout chip (GTFE) approved by PCB
– LAT-PS-1222: Readout controller chip (GTRC) approved by PCB
– LAT-PS-1250: wafer probing, review in process
– LAT-PS-01321: wafer lapping, dicing, and inspection, review in process.
– LAT-TD-1325: Radiation testing, to be reviewed.
• Several other documents such as MCM assembly, SMT assembly, part procurements are in draft format and shall be released by CDR.
• Final board prototypes were recently produced and are being tested:
– PWB: loaded with parts and new ASICs for functional testing
– Pitch Adapter: Teledyne is bonding 3 of them to MCMs to check that the new design works
– Bias: sent to Italy for review
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 20
EEE Parts Issues & Risk MitigationEEE Parts Issues & Risk Mitigation
• MCM board qualification and handling.– To mitigate this risk, processes, procedures, qualification
plan, and vendor verification plan is in process and will ensure they are implemented successfully.
• Pitch adapter flex gluing and alignment accuracy when bonding to PWB.– To mitigate this risk, processes will be verified and
controls will be implemented at Teledyne.• Flight ASICs testing
– To mitigate this risk, all processes and procedures are being approved. Test software is being improved, which will be used for verification.
• MCM Assembly and Verification– To mitigate this risk, manufacturing readiness reviews will
be performed and mandatory inspection points will be selected.
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 21
EEE Parts Issues & Risk MitigationEEE Parts Issues & Risk Mitigation
• Flex Cable to LAT-PS-01132, defines procurement and qualification requirements.– To mitigate this risk EM flex cable will be manufactured to
this specification and will be qualified.– A visit to the vendor (Parlex) is planned for early April,
together with GSFC representatives.• Flex Cable Assembly.
– To mitigate risk a detailed procedure being written & EM flex will be assembled and will be tested prior to flight production.
• Radiation Testing & Plans– To mitigate risk GSFC is involved in approving plans but
radiation plans yet not approved.
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 22
ConnectorsConnectors
• Nano-connectors: Omnetics was recently approved and the parts are now on order, including the connector savers.
• Micro-D connectors: Kristek connectors are not yet approved, but we don’t expect any difficult issues.
On MCM
On cable
Larger 080 screws
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 23
SMT PartsSMT Parts
• HV capacitors: Novacap
– Procurement spec: LAT-PS-01194
– On order for the Tracker and Calorimeter
• Polyswitches: Raychem (Tycho)
– Procurement spec: LAT-SS-01116
– A sample lot was already procured and all testing performed, so no surprised are expected in the flight lot
– Recently finalized and approved, and the parts are on order
– Long process of testing at UCSC and discussions with the vendor
• 100% of parts: screening after thermal cycle
• 10% of parts: more extensive tests after soldering
• Smaller sample for qualification testing at UCSC
• Ceramic & tantalum capacitors: approved with no issues
• Resistors: approved with no issues
• Thermistor: approved with no issues
GLAST LAT Project TKR Peer Design Review, Mar 24-25, 2003
5B Nick Virmani 24
Manufacturing and Test Process Flow Manufacturing and Test Process Flow for Tracker Hardwarefor Tracker Hardware
Pre-Production Procurement Fabrication Assembly
-Initial Quality Planning-Design Reviews-Critical Components-Documentation Reviews-Lessons Learned-Quality Criteria-Design Requirements-Workmanship Standard-Training and Certification
-Pre-award surveys-Supplier Evaluation-Purchase Document Review-Source inspection where applicable-Critical Components-Nonconforming Material Control
-Manufacturing Reviews-Work instructions and procedures-Calibration-Process Readiness-Nonconforming Material Control-Inspection-Material Review Board-Audits
-Work instructions, procedures, and travellers-Audits-Configuration verification-Inspection
Integration & Test
-Test Readiness Review-Nonconforming material control- Previous Operation Audits-Component Data/Subsystem packages-Test Procedures-Test Monitoring-Data Review-Closeout of open NCMRs.
Storage & Shipping
-Storage and Shipping Requirements-Inspection and storage shipping controls-Data Package Reviews-Audits