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© 2009 Intel Corporation.

Intel Intel Intel Corporation * Microsoft Windows Visual Studio Microsoft Corporation / *


Intel Intel Core Celeron Pentium Xeon Intel386 Intel486 Intel Corporation

• CPU

• ® Nehalem*

• ® Nehalem*

*



Web 2008 10



80 4.27GHz

* 1.37 SP TFLOPS

PDE

* 1 SP TFLOPS

* 0.51 SP TFLOPS

* 2 FMAC –2 FLOPS

Source: A 80-tile 1.28 TFLOP Network-on-Chip in 65 nm CMOS, ISSCC’07, Sriram Vangal, Jason Howard, Gregory Ruhl, Saurabh Dighe, Howard Wilson, James tschanz, David Finan, Priya Iyer, Arvind Singh, Riju Jacob, Shailendra Jain, Sriram venkataraman, Yatin Hoskote and Nitin Borkar.



®

Nehalem

TOCK

SANDYBRIDGE*

TOCK

WESTMERE *

32nm

TICK

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Core™ 2 ,Xeon®

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Pentium® D, Xeon®,Core™

TICK TOCK

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Extreme

Best

Better

Intel® Core™ i7 Processor Extreme Edition

Intel® X58 Express Chipset

Intel® G45 & P45 Express Chipsets

Intel® Core™2 Duo Processor E8xxx & E7xxx series

Intel® G45, G43, & P43 Express Chipsets

Intel® G31/P31 Express Chipsets

Intel® Core™2 Quad Proc. Q9xxx &Q8xxx series

Intel® Pentium® & Celeron® Proc.

Intel® G41 Express Chipset

Today Future

Roadmap

Intel® Core™ i7 Processor


Good



77

Best

Intel® Core™2 Quad & Duo proc. Q9000,E8000 series2

Intel® Q45 Express Chipset w/ICH10DO, Intel® TPM

Business Security:Prior generation Intel® vPro™ technology Plus:Microsoft NAP, Access Monitor

Proactive IT Care:Prior generation Intel® vPro™ Technology plus: Fast Call for Help, Remote Schedule Maintenance, Remote Alerts, DASH, Intel® Remote PC Assist Technology.

Intel® vPro Tech. for 2009

Today Future

Better

Good Intel® G31 Express ChipsetIntel® G41 Express Chipset

Intel® Pentium® processor1

* Qualification window begins at platform launch and continues for 3 months.** Deployment begins at the end of the Qualification window and continues for 12 months.1 Intel® Pentium® dual-core proc not SIPP eligible. 2. Check the feature set reference table for vPro and SIPP CPU details.3. Intel Std. Manageability and Intel AMT support WS-MAN and DASH

ng®rr

Intel® SIPP Deploy 2008/2009 Platform**

Intel® Core™2 Duo Proc. E8000 seriesIntel® Q43 Express Chipset w/ICH10D, Intel® TPMIntel® Standard ManageabilityIntel® SIPP

- Manageability Upgrade Available

UpgradeableIntel® B43 Express Chipset w/ICH10D

Roadmap



888

Roadmap

Extreme

Performance

Entry

Montevina’ / ‘Montevina Plus’


Intel® Core™2 ExtremeQX9300, X9100

Intel® Centrino® 2 processor technologyFeaturing Intel® Core™2 Quad Q9100, Q9000Featuring Intel® Core™2 Duo T9800, T9600, T9550,

T9400, P9600, P9500, P8700, P8600, P8400

Intel® Core™2 Duo Small Form Factor processors: Power-Optimized, Low Voltage, and Ultra Low-VoltageSP9400, SP9300SL9400, SL9300SU9400, SU9300, SU3300*

Mobile Intel® GM45, PM45 Express chipsets with ICH9M or ICH9M-EnhancedMobile Intel® GS45 Express Chipset with ICH9M-SFF-Enhanced

Intel® Celeron® processorsT1700, T1600, 585, 575, 723 900

Mobile Intel® GM45, GL40 Express chipsets with ICH9MMobile Intel® GS45 Express Chipset with ICH9M-SFF-Enhanced

Mobile Intel® GS40 Express Chipset with ICH9M-SFF-Enhanced

Intel® Centrino® 2 processor technologyFeaturing Intel® Core™2 Duo T9900, P9700, P8800

SP9600SL9600SU9600, SU3500*

Intel® WiMAX/WiFi Link 5050 SeriesIntel® WiFi Link 5000 SeriesIntel® 82567LF Gigabit Network Connection


Today Future



2

Intel® Itanium® Platform

Roadmap

MissionCritical

Intel® Itanium® processor 9100 series

Intel® E8870 Chipset — 400FSB, Intel® 82801DB (ICH4)

Technologies

FSB 667, DDR2-667,

Dual-Core,

Hyper-Threading Technology,

Intel® Virtualization Technology,

Intel® Cache Safe Technology. IA-64,

Demand Based switching,

Core Level Lockstep

Q1 ’09 Q2 ’09 Q3 ’09 Q4 ’0920102009

Next Generation Intel® Itanium®

Next-generation Intel® Itanium® processor (Tukwila*)

Boxboro-MC Chipset

Technologies

Quad-Core

Intel® QuickPath Interconnect ,

Dual Integrated Memory Controllers



10

Caneland Platform

Expandable Server (EX)Roadmap

Expandable

2009 2010

Intel® Xeon® processor 7400 series 45 nm 6-core

Intel® Xeon® processor 7300 & 7200 series

Intel® 7300 Chipset

Enabled chipsets -4P/8P+ platforms Technologies

Quad-Core, Dual-Core,

Intel® Core™ Microarchitecture,

Dedicated High-Speed Interconnects (DHSI),

FBDIMM Memory Technology,

Intel® VT,

Next Generation Intel® I/OAT,

64 MB Snoop Filter

Next-generation Intel® Xeon® processor (Nehalem-EX* )

Boxboro-EX Chipset

TechnologiesUp to 8 cores /16 Threads

24MB Shared Cache

Integrated Memory Controllers

Intel® Turbo Boost

Intel® Hyper-Threading

Next Generation Expandable Platform



11

Intel ® Xeon® 5500 Platform

Efficient Performance (EP) Roadmap

Efficient Performance

Two Socket

1.Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS

exemptions may apply to other components used in the product package.

Intel ® Xeon® processor 5500 series Next-generation Intel ® Xeon® processor

Intel® 5520 Chipset Intel® 5520 Chipset

Technologies Technologies

Quad-Core / Dual Core Up to 6 cores/12 Threads

DDR3 1333/1066/800 memory Improved Energy Efficiency

Intel® Turbo Boost Technology, Cache Enhancements

Intel® VT

Intel® QuickPath Interconnect (QPI)

Intel® Hyper-Threading Technology

Lead and halogen free platform kit1

20102009



12


Entry Server (EN) Roadmap

EntryTwo Socket

Intel® 5000V Chipset (previously Blackford)

Intel ® Xeon® processor 5500 series


EntryOne Socket

Intel® Core™ Microarchitecture

Intel® Core™ Microarchitecture

Intel® Xeon® processor 5400 series

Intel® Xeon® processor 5200 series

Intel® 5100 Chipset (previously San Clemente)

Intel® Xeon® processor 3300 seriesIntel® Xeon® processor 3100 seriesIntel® Xeon® processor 3200 series Intel® Xeon® processor 3000 series

Intel® 3210/3200 Chipset

Next-generation Intel ® Xeon® processor

Intel® 3400/3420 Chipset

Next Generation (Intel® Microarchitecturecodename Nehalem) Platform

1H ‘09 2H ‘09



13



Workstation (WS) Roadmap

WorkstationTwo Socket



WorkstationOne Socket



Intel® Core™2 processor series


2009 2010

Intel® Core™ Microarchitecture(codename Merom & Penryn)


Next-generation Intel® Xeon® processor

Ibex Peak Chipset**

Next Generation (Intel® Microarchitecturecodename Nehalem ) Platform




• CPU

• ® Nehalem*

• ® Nehalem*

*


Intel Xeon Intel Intel Corporation

® Nehalem*

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45nm/

®

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© 2009 Intel Corporation*




DRAM

QPI

IMC QPIPower

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6 /3

1 1 1

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Integer ALU & Shift

Integer ALU &LEA

Integer ALU &Shift

BranchFP AddFP Multiply

ComplexInteger

Divide

SSE Integer ALUInteger Shuffles

SSE Integer Multiply

FP Shuffle

SSE Integer ALUInteger Shuffles



•• ®

Nehalem*33%

• uOPs(CPU ) 0

16

32

48

64

80

96

112

128

Dothan* Merom* Nehalem*

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Merom* Nehalem*

32 36

32 48

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• ® Core™ ® Core™2

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CPU CPU

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– DDR3– 3– DDR3-1333

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IMC (BW)• 3• DDR3-1333

–– HEDT: 32 GB/sec – 2 : 64 GB/sec

•– IMC–

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Request Reordering

Harpertown*1600 FSB

0

1

2

3

4

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3x DDR3-1333

2 socket Streams Triad

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*



Non-Uniform Memory Access (NUMA)• FSB

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Documents

G2G GTGy GeG{GIGQGCG G G{G GWGlGQGeFÚG G ...jp.xlsoft.com/documents/intel/seminar/2009/intel...Better Intel® Core i7 Processor Extreme Edition Intel® X58 Express Chipset Intel ®