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To learn more about onsemi™, please visit our website at www.onsemi.com ON Semiconductor Is Now onsemi and and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi ” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.

FPF2193 / FPF2194 / FPF2195 Full-Function Load Switch with … · 3 5 — t Pin Configuration Figure 3. 1.0 x 1.5 mm Chip-Scale Package Figure 4. Pin Configuration (Bottom View) Pin

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Page 1: FPF2193 / FPF2194 / FPF2195 Full-Function Load Switch with … · 3 5 — t Pin Configuration Figure 3. 1.0 x 1.5 mm Chip-Scale Package Figure 4. Pin Configuration (Bottom View) Pin

To learn more about onsemi™, please visit our website at www.onsemi.com

ON Semiconductor

Is Now

onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.

Page 2: FPF2193 / FPF2194 / FPF2195 Full-Function Load Switch with … · 3 5 — t Pin Configuration Figure 3. 1.0 x 1.5 mm Chip-Scale Package Figure 4. Pin Configuration (Bottom View) Pin

© 2009 Semiconductor Components Industries, LLC. Publication Order Number: December-2017, Rev. 2 FPF2194/D

FP

F2193 / F

PF

2194 / F

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2195 —

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FPF2193 / FPF2194 / FPF2195 Full-Function Load Switch with Adjustable Current Limit Features

<1.8 to 5.5 V Input Voltage Range

Controlled Turn-On

0.1 to 1.5 A Adjustable Current Limit

Under-Voltage Lockout

Thermal Shutdow n

<2 µA Shutdow n Current

Auto Restart

Fast Current Limit Response Time

5 µs to Moderate Over Currents

30 ns to Hard Shorts

Fault Blanking

Reverse Current Blocking

Applications

PDAs

Cell Phones

Handheld GPS Devices

Portable Enterprise / Industrial Devices

Digital Cameras

Peripheral Ports and Accessories

Portable Medical Equipment

Hot Sw ap Supplies

Description

The FPF2193, FPF2194, and FPF2195 form a series of

load sw itches that provides full protection to systems and loads that may encounter large current conditions.

These devices contain a 55 mΩ current-limited P-

channel MOSFET that can operate over an input

voltage range of 1.8 to 5.5 V. Internally, current is

prevented from flow ing w hen the MOSFET is off and the

output voltage is higher than the input voltage. Sw itch

control is by a logic input (ON) capable of interfacing

directly w ith low -voltage control signals. Each part

contains thermal shutdow n protection that shuts off the

sw itch to prevent damage to the part w hen a continuous

over-current condition causes excessive heating.

When the sw itch current reaches the current limit, the

parts operate in a constant-current mode to prohibit

excessive currents from causing damage. For the

FPF2193 and FPF2194, if the constant current condition

still persists after 30 ms, the parts shut off the sw itch

and pull the fault signal pin (FLAGB) LOW. The

FPF2193 has an auto-restart feature that turns the

sw itch on again after 450 ms if the ON pin is still active.

The FPF2194 does not have this auto-restart feature, so

the sw itch remains off until the ON pin is cycled. The

FPF2195 does not turn off after a current limit fault, but

remains in the constant-current mode indefinitely. The

minimum current limit can be set as low as 45 mA.

These parts are available in a space-saving six ball

advanced 0.98 x 1.48 mm WLCSP package.

Ordering Information

Part Number Current Limit [mA]

Current Limit Blanking Time [ms]

Auto-Restart Time [ms]

ON Pin Activity

Top Mark

FPF2193

100-1500

15/30/60 225/450/900

Active HIGH

S6

FPF2194 15/30/60 NA S7

FPF2195 0 NA S9

FPF2195BUCX 45-1500 0 NA SY

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F2193 / F

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2194 / F

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Application Diagram

Figure 1. Typical Application

Block Diagram

Figure 2. Functional Block Diagram

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FP

F2193 / F

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2194 / F

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Pin Configuration

Figure 3. 1.0 x 1.5 mm Chip-Scale Package

Figure 4. Pin Configuration (Bottom View)

Pin Definitions

Pin # Name Description

C1 ISET Current Limit Set Input. A resistor from ISET to ground sets the current limit for the sw itch.

B2 VIN Supply Input. Input to the pow er sw itch and the supply voltage for the IC.

B1 VOUT Sw itch Output. Output of the pow er sw itch.

A1 FLAGB Fault Output. Active LOW, open-drain output that indicates an over-current supply, under-voltage, or over-temperature state.

C2 GND Ground.

A2 ON ON control input, active HIGH.

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F2193 / F

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2194 / F

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Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol Parameter Min. Max. Unit

VIN, VOUT, ON, FLAGB, ISET to GND -0.3 6.0 V

PD Pow er Dissipation at TA = 25°C(1) 1.2 W

TJ Operating Temperature Range -40 +125 °C

TSTG Storage Temperature -65 +150 °C

JA Thermal Resistance, Junction to Ambient 85 °C/W

ESD Electrostatic Discharge Capability Human Body Model, JESD22-A114 8000

V Machine Model, JESD22-A115 400

Note:

1. Package pow er dissipation on one-square inch pad, tw o-ounce copper board.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specif ied to ensure optimal performance to the datasheet specif ications. ON Semiconductor

does not recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol Parameter Min. Max. Unit

V IN Input Voltage 1.8 5.5 V

TA Ambient Operating Temperature -40 +85 °C

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2194 / F

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Electrical Characteristics VIN = 1.8 to 5.5 V, TA = -40 to +85°C unless otherw ise noted. Typical values are at V IN = 3.3 V and TA = 25°C.

Symbol Parameter Conditions Min. Typ. Max. Units

Basic Operation

V IN Operating Voltage 1.8 5.5 V

IQ Quiescent Current IOUT=0 mA, VON=V IN

V IN=1.8 V 70

µA V IN=3.3 V 75

V IN=5.5 V 80

RON On Resistance TA=25°C, IOUT=200 mA 55 80

m TA=-40 to 85°C, IOUT=200 mA 135

V IH On Input Logic High Voltage

ON

VIN=1.8 V 0.8 V

VIN=5.5 V 1.4

VIL On Input Logic Low Voltage VIN=1.8 V 0.5

V VIN=5.5 V 1.0

IIN On Input Leakage VON=VIN or GND -1 0 1 µA

V IN_SD V IN Shutdow n Current VON=0 V, V IN=5.5 V,

VOUT=Short to GND -2 2 µA

VFLB_L FLAGB Output Logic Low

Voltage

VIN=5 V, ISINK=10 mA 0.05 0.20 V

VIN=1.8 V, ISINK=10 mA 0.12 0.30

IFLB_H FLAGB Output Logic High

Leakage Current VIN=5 V, Sw itch ON 1 µA

Reverse Block

ISDT VOUT Shutdow n Current VON=0 V, VOUT=5.5 V,

VIN=Short-to-GND -2 2 µA

Vbreakdown Reverse Breakdow n Voltage VIN=VON=0 V, IOUT=200 µA 9 V

Protections

ILIM

Current Limit VIN=3.3 V, VOUT=3.0 V, RSET=690 600 800 1000 mA

Current Limit for

FPF2195BUCX

VIN=4.5 V, VOUT=4.2 V,

RSET=15.8 K 35 45 60 mA

ILIM(MIN) Minimum Current Limit VIN=3.3 V, VOUT=3.0 V,

RSET=5516 100 ma

TSD Thermal Shutdow n

Shutdow n Threshold 140

°C Return from Shutdow n 130

Hysteresis 10

VUVLO Under-Voltage Lockout VIN Increasing 1.55 1.65 1.75 V

VUVLO_HYST Under-Voltage Lockout

Hysteresis 50 mV

Dynamic

tdON Delay On Time RL=500 , CL=0.1 µF 20 µs

tR VOUT Rise Time RL=500 , CL=0.1 µF 20 µs

tON Turn-On Time RL=500 , CL=0.1 µF 40 µs

tdOFF Delay Off Time RL=500 , CL=0.1 µF 15 µs

tF VOUT Fall Time RL=500 , CL=0.1 µF 110 µs

tOFF Turn-Off Time RL=500 , CL=0.1 µF 125 µs

tBLANK Over-Current Blanking Time FPF2193, FPF2194 15 30 60 ms

tRSTRT Auto-Restart FPF2193 Only 225 450 900 ms

tSC Short-Circuit Response Time

VIN=VOUT=3.3 V, Moderate Over-

Current Condition 5 µs

VIN=VOUT=3.3 V, Hard Short 30 ns

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2194 / F

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2195 —

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Typical Performance Characteristics

Figure 5. Quiescent Current vs. Input Voltage Figure 6. Quiescent Current vs. Input Voltage

Figure 7. Quiescent Current vs. Temperature Figure 8. VON High Voltage vs. Input Voltage

Figure 9. VON Low Voltage vs. Input Voltage Figure 10. Current Limit vs. Output Voltage

Page 8: FPF2193 / FPF2194 / FPF2195 Full-Function Load Switch with … · 3 5 — t Pin Configuration Figure 3. 1.0 x 1.5 mm Chip-Scale Package Figure 4. Pin Configuration (Bottom View) Pin

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2194 / F

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Typical Performance Characteristics (Continued)

Figure 11. Current Limit vs. Temperature Figure 12. RON vs. V IN

Figure 13. RON vs. Temperature Figure 14. tON / tOFF vs. Temperature

Figure 15. tRISE / tFALL vs. Temperature Figure 16. tRSTRT vs. Temperature

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F2193 / F

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2194 / F

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Typical Performance Characteristics (Continued)

Figure 17. tBLANK vs.Temperature Figure 18. tON Response

Figure 19. tOFF Response Figure 20. Short-Circuit Response Time

(Output Shorted to GND)

Figure 21. Current Limit Response Time

(Switch is Powered into a Short)

Figure 22. Current Limit Response Time

(Output is Loaded by 2.2 , COUT=0.1 µF)

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F2193 / F

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Typical Performance Characteristics (Continued)

Figure 23. Current Limit Response Time

(Output is Loaded by 2.2 , COUT=10 µF)

Figure 24. Short-Circuit Detection Function(2)

Figure 25. tBLANK vs. Response(3)

Figure 26. tRESTART vs. Response(3)

Notes:

2. When the output voltage is below VSCTH=1.1 V, the current limit value is set at 62.5% of the current limit value. 3. VDRV signal forces the device to go into over-current condition by loading.

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Functional Description The FPF2193, FPF2194, and FPF2195 are current-

limited sw itches that protect systems and loads that can

be damaged or disrupted by the application of high

currents. The core of each device is a 55 mΩ P-channel

MOSFET and a controller capable of functioning over the

w ide input operating range of 1.8- 5.5 V. The controller

protects against system malfunctions through current

limiting, under-voltage lockout, and thermal shutdow n.

The current limit is adjustable from 100 mA (45 mA for

FPF2195BUCX) to 1.5 A through the selection of an

external resistor.

On/Off Control The ON pin controls the state of the sw itch. When ON is

HIGH, the sw itch is in ON state. Activating ON

continuously holds the sw itch in the ON state so long as

there is no fault. For all versions, an under-voltage on V IN

or a junction temperature in excess of 140°C overrides

the ON control to turn off the sw itch. In addition, excessive currents cause the sw itch to turn off in the

FPF2193 and FPF2194. The FPF2193 has an auto-

restart feature that automatically turns the sw itch on again

after 450 ms. For the FPF2194, the ON pin must be

toggled to turn the sw itch on again. The FPF2195 does

not turn off in response to an over-current condition, but

remains operating in constant-current mode as long as

ON is active and the thermal shutdow n or under-voltage

lockout have not activated.

Fault Reporting Upon the detection of an over-current, input under-

voltage, or over-temperature condition, FLAGB signals

the fault mode by activating LOW. For the FPF2193 and

FPF2194, the FLAGB goes LOW at the end of the

blanking time, w hile FLAGB goes LOW immediately for

the FPF2195. FLAGB remains LOW through the auto-

restart time for the FPF2195. For the FPF2194, FLAGB is

latched LOW and ON must be toggled to release it. With the FPF2195, FLAGB is LOW during the faults and

immediately returns HIGH at the end of the fault

condition. FLAGB is an open-drain MOSFET that requires

a pull-up resistor betw een V IN and FLAGB. During

shutdow n, the pull-dow n on FLAGB is disabled to reduce

current draw from the supply.

Current Limiting The current limit ensures that the current through the

sw itch doesn't exceed a maximum value, w hile not

limiting at less than a minimum value. The current at

w hich the parts limit is adjustable through the selection of

an external resistor connected to ISET. Information for

selecting the resistor is found in the Application

Information section. The FPF2193 and FPF2194 have a

blanking time of 30 ms, nominally, during w hich the

sw itch acts as a constant current source. At the end of

the blanking time, the sw itch is turned off. The FPF2195

has no current limit blanking period, so it remains in a constant current state until the ON pin is deactivated or

the thermal shutdow n turns off the sw itch.

For preventing the sw itch from large pow er dissipation

during heavy load, a short-circuit detection feature is

introduced. Short-circuit condition is detected by,

observing the output voltage. The sw itch is put into short-

circuit current-limiting mode if the sw itch is loaded w ith a

heavy load. When the output voltage drops below VSCTH,

the short-circuit detection threshold voltage, the current

limit value is re-conditioned and the short-circuit current-

limit value is decreased to 62.5% of the current limit

value. This keeps the pow er dissipation of the part below

a certain limit even at dead-short conditions at 5.5 V input

voltage. The VSCTH value is set to be 1 V. At around 1.1 V

of output voltage, the sw itch is removed from short-circuit

current-limiting mode and the current limit is set to the

current limit value.

Under-Voltage Lockout (UVLO) The under-voltage lockout turns the sw itch off if the input

voltage drops below the under-voltage lockout threshold.

With the ON pin active, the input voltage rising above the

under-voltage lockout threshold causes a controlled turn-

on of the sw itch, w hich limits current over shoot.

Thermal Shutdown The thermal shutdow n protects the die from internally or

externally generated excessive temperatures. During an

over-temperature condition, FLAGB is activated and the sw itch is turned off. The sw itch automatically turns on

again if temperature of the die drops below the

threshold temperature.

Reverse-Current Blocking The entire FPF2193/94/95 family has a reverse current

blocking feature that protects the input source against

current f low from output to input. For a standard USB

pow er design, this is an important feature to protect the

USB host from being damaged due to reverse current

f low on VBUS.

When the load sw itch is OFF, no current f low s from the

output to the input. If the sw itch is turned on and the

output voltage is greater than input voltage, this feature is

activated and turns off the sw itch. This prevents any current f low from output to input. The reverse-current

blocking feature is deactivated if the VOUT - V IN is smaller

than a typically 50 mV threshold. During this time, some

current (50 mV/RON) f low s from the output to input until

input voltage becomes greater than output voltage.

FLAGB operation is independent of the reverse-current

blocking and does not report a fault condition if this

feature is activated.

Figure 27. Timing Diagram

w here:

tdON = Delay On Time

tR = VOUT Rise Time

tON = Turn-On Time

tdOFF = Delay Off Time

tF = VOUT Fall Time

tOFF = Turn-Off Time

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FP

F2193 / F

PF

2194 / F

PF

2195 —

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Application Information

Figure 28. Typical Application

Setting Current Limit

The FPF2193, FPF2194, and FPF2195 current limit is

set w ith an external resistor connected betw een ISET and

GND. This resistor is selected using the follow ing equation:

LIMSET

I

6.551R (1)

RSET is in and ISET is in Amps.

Table 1 can also be used to select RSET. A typical

application w ould be the 500 mA current required by a

single USB port. Using Table 1, an appropriate selection

for the RSET resistor w ould be 788 Ω. This ensures that

the port load could draw 525 mA, but not more than 875 mA. Likew ise for a dual-port system; an RSET of

368 Ω alw ays delivers at least 1125 mA and never more

than 1875 mA.

Table 1. Current Limit Various RSET Values

RSET( ) Min. Current

Limit (mA) Typ. Current

Limit (mA) Max. Current

Limit (mA)

368 1125 1500 1875

441 928 1250 1562

552 750 1000 1250

613 675 900 1125

690 600 800 1000

788 525 700 875

919 450 600 750

1103 375 500 625

1226 338 450 563

1379 300 400 500

1576 263 350 438

1839 225 300 375

2206 188 250 313

2758 150 200 250

3677 113 150 188

5516 75 100 125

15800(4)

35 45 60

Note:

4. FPF2195BUCX only.

Input Capacitor To limit the voltage drop on the input supply caused by

transient inrush currents w hen the sw itch is turned on

into a discharged load capacitor or a short-circuit, a

capacitor needs to be placed betw een V IN and GND. A

0.1 µF ceramic capacitor, CIN, placed close to the pins is

usually suff icient. Higher values of CIN can be used to

further reduce the voltage drop.

Output Capacitor A 0.1 µF capacitor, COUT, should be placed betw een

VOUT and GND. This capacitor prevents parasitic board inductances from forcing VOUT below GND w hen the

sw itch turns off. For the FPF2193 and FPF2194, the

total output capacitance needs to be kept below a

maximum value, COUT(max), to prevent the part from

registering an over-current condition and turning off the

sw itch. The maximum output capacitance can be

determined from the follow ing formula:

IN

BLANKLIMOUT

V

(min)t(max)I(max)C

(2)

Power Dissipation During normal operation as a sw itch, the pow er

dissipated depends upon the level at w hich the current

limit is set. The maximum allow ed setting for the current

limit is 1.5 A and results in a pow er dissipation of :

mW75.123055.0)5.1(R)I(P 2ON

2LIM (3)

If the part goes into current limit, the maximum pow er

dissipation occurs w hen the output is shorted to ground.

For the FPF2193, the pow er dissipation scales by the

auto-restart time, tRSTRT, and the over-current blanking

time, tBLANK, so that the maximum pow er dissipated is:

mW6.5155.15.545030

30

(max)I(max)Vtt

t(max)P LIMIN

RSTRTBLANK

BLANK

(4)

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F2193 / F

PF

2194 / F

PF

2195 —

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This is more pow er than the package can dissipate, but

the thermal shutdow n of the part activates to protect the

part from damage due to excessive heating. When

using the FPF2194, attention must be given to the

manual resetting of the part. The junction temperature is

only able to increase to the thermal shutdow n threshold.

Once this temperature has been reached, toggling ON

does not turn the sw itch on until the junction

temperature drops. For the FPF2195, a short on the

output causes the part to operate in a constant-current

state, dissipating a w orst-case pow er of:

W25.85.15.5

(max)I(max)V(max)P LIMIN

(5)

This large amount of pow er activates the thermal shutdow n and the part cycles in and out of thermal

shutdow n as long as the ON pin is active and the short

is present.

Board Layout

For best performance, all traces should be as short as

possible. To be most effective, the input and output

capacitors should be placed close to the device to

minimize the effects that parasitic trace inductances

may have on normal and short-circuit operation. Using

w ide traces for V IN, VOUT, and GND help to minimize

parasitic electrical effects along w ith minimizing the case-to-ambient thermal impedance.

Page 14: FPF2193 / FPF2194 / FPF2195 Full-Function Load Switch with … · 3 5 — t Pin Configuration Figure 3. 1.0 x 1.5 mm Chip-Scale Package Figure 4. Pin Configuration (Bottom View) Pin

www.onsemi.com 13

FP

F2193 / F

PF

2194 / F

PF

2195 —

Fu

ll Fu

nctio

n L

oad

Sw

itch

with

Ad

justa

ble

Cu

rren

t Lim

it

Physical Dimensions

Figure 29. 6-Ball, Wafer-Level Chip-Scale Package (WLCSP)

D E X Y

1.480±0.030 0.980±0.030 0.240 0.240

BOTTOM VIEW

SIDE VIEWS

RECOMMENDED LAND PATTERN

BALL A1

INDEX AREA

SEATING PLANE

A1

F

(NSMD PAD TYPE)

(Ø0.350)

SOLDER MASK

OPENING

(X) ±0.018

(Y) ±0.018

(Ø0.250)

Cu Pad

0.06 C

0.05 C E

D

F

NOTES:

A. NO JEDEC REGISTRATION APPLIES.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCE

PER ASMEY14.5M, 1994.

D. DATUM C IS DEFINED BY THE SPHERICAL

CROWNS OF THE BALLS.

E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS

±43 MICRONS (539-625 MICRONS).

F. FOR DIMENSIONS D, E, X, AND Y SEE

PRODUCT DATASHEET.

G. DRAWING FILNAME: MKT-UC006AFrev2.

0.03 C

2X

0.03 C

2X

Ø0.315 +/- .025

6X

1 2

A

B

C

0.332±0.018

0.250±0.025

D

E

(1.00)

(0.50)

0.005 C A B

0.50

0.501.00

0.625

0.539

TOP VIEW

B

A

C

Page 15: FPF2193 / FPF2194 / FPF2195 Full-Function Load Switch with … · 3 5 — t Pin Configuration Figure 3. 1.0 x 1.5 mm Chip-Scale Package Figure 4. Pin Configuration (Bottom View) Pin

www.onsemi.com 14

FP

F2193 / F

PF

2194 / F

PF

2195 —

Fu

ll Fu

nctio

n L

oad

Sw

itch

with

Ad

justa

ble

Cu

rren

t Lim

it

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