1
layer electrodeposited coating com- prising electrocoating an aqueous paint composition comprising at least two sorts of resins, which are insoluble with each other, a curing agent, and a pigment, on an elec- trically conductive substrate; heat- ing it to form a layer separation; and then curing to form a plural- layer cured coating having at least two layers, wherein a concentra- tion of the pigment is distributed such that a pigment concentration in the resin layer directly contact- ing air is relatively higher than a pigment concentration in the resin layer directly contacting the elec- trically conductive substrate. SELECTIVE PLATING PROCESS US. Patent 6,334,942. Jan. I,2002 B. Haba et al., assignors to Tessera Inc., San Jose, Calif: A method of making metallic features on a support comprising providing a resist on the support so as leave openings at locations where metallic features are to be formed; depositing a principal metal to form a deposit with a top surface remote from the sup- port and edge surfaces extend- ing downwardly from the top surface toward the support; treating so as to remove resist immediately adjacent the princi- pal metal and form gaps between the edge surfaces; depositing a cover metal onto the exposed edge surfaces of the principal metal and form gaps between the edge surfaces; and depositing a cover metal onto the exposed edge surfaces of the principal metal deposit while the resist remains on the regions of the support remote from the principal metal deposit. El.ECVGOPlAllNG SUPPGRT DMCE US. Patent 6,334,943. Jan. 1,2002 I? Gheeraert et al., assignors to Sollac, Puteaux, France A method for supporting an elec- troplating electrode comprising providing an electrical contact surface on which a soluble anode electrode may slide and rest hav- ing a plurality of grooves; and supporting the soluble anode electrode with the contact sur- face when the contact surface is submerged in an electroplating bath during electroplating. MECALLIC MULVILAVER CGATING US. Patent 6,335,057. Jan. 1,2002 K. Noura et al., assignors to Kansai Paint Co. Ltd., Hyogo, Japan A process for forming a metallic multilayer coating film compris- ing coating on an uncured coating surface of a paint formed on a Guarantee compliance with the A1100 outical thickness gauaine wtem From 0.5-200 microns Aluminum finishing Lighting systems Aerosoace and Defense Windows and Displays . Automotive Coil and extruded Aluminum Continuous on-line measurement Thickness end point control High definition analysis NDT for Transparent Coatings www.filmthickness.com A nalytical [email protected] T echnologies Morganton, NCUSA LI.c 828 433 0074 828 433 9474 f “Serving Electronics Manufacturing, Plating, Chemical Processing, Water and Waste Water Treatment, and Swimming Pool Industries since 1978” Your Single Source Supplier of Corrosion Resistant Thermoplastic Products for Fluid Control & Storage Products Quality products and superior customer service, inclubincr: 6530 Cambridge St., Mpls., MN 55426 Ph: 952-925-5075 Fax: 965-925-1758 4345 Oneida St., Denver, CO 80216 Ph: 303-398-2700 Fax: 303-398-0200 930 DuPage Ave., Lombard, IL 60148 Ph: 630-629-5616 Fax: 630-629-5583 www.indelco.com Circle 114 on reader card or go to www.thtu.tolwebconnect Circle 009 on reader card or go to www.thru.to/webconnect November/December 2002

Electroplating support device

  • Upload
    vanphuc

  • View
    220

  • Download
    0

Embed Size (px)

Citation preview

Page 1: Electroplating support device

layer electrodeposited coating com- prising electrocoating an aqueous paint composition comprising at least two sorts of resins, which are insoluble with each other, a curing agent, and a pigment, on an elec- trically conductive substrate; heat- ing it to form a layer separation; and then curing to form a plural- layer cured coating having at least two layers, wherein a concentra- tion of the pigment is distributed such that a pigment concentration in the resin layer directly contact- ing air is relatively higher than a pigment concentration in the resin layer directly contacting the elec- trically conductive substrate.

SELECTIVE PLATING PROCESS US. Patent 6,334,942. Jan. I,2002 B. Haba et al., assignors to Tessera Inc., San Jose, Calif: A method of making metallic

features on a support comprising providing a resist on the support so as leave openings at locations where metallic features are to be formed; depositing a principal metal to form a deposit with a top surface remote from the sup- port and edge surfaces extend- ing downwardly from the top surface toward the support; treating so as to remove resist immediately adjacent the princi- pal metal and form gaps between the edge surfaces; depositing a cover metal onto the exposed edge surfaces of the principal metal and form gaps between the edge surfaces; and depositing a cover metal onto the exposed edge surfaces of the principal metal deposit while the resist remains on the regions of the support remote from the principal metal deposit.

El.ECVGOPlAllNG SUPPGRT DMCE US. Patent 6,334,943. Jan. 1,2002 I? Gheeraert et al., assignors to Sollac, Puteaux, France A method for supporting an elec- troplating electrode comprising providing an electrical contact surface on which a soluble anode electrode may slide and rest hav- ing a plurality of grooves; and supporting the soluble anode electrode with the contact sur- face when the contact surface is submerged in an electroplating bath during electroplating.

MECALLIC MULVILAVER CGATING US. Patent 6,335,057. Jan. 1,2002 K. Noura et al., assignors to Kansai Paint Co. Ltd., Hyogo, Japan A process for forming a metallic multilayer coating film compris- ing coating on an uncured coating surface of a paint formed on a

Guarantee compliance with the A1100 outical thickness gauaine wtem

From 0.5-200 microns Aluminum finishing

Lighting systems

Aerosoace and Defense Windows and Displays .

Automotive

Coil and extruded Aluminum

Continuous on-line measurement

Thickness end point control

High definition analysis

NDT for Transparent Coatings www.filmthickness.com

A nalytical [email protected]

T echnologies Morganton, NC USA

LI.c 828 433 0074

828 433 9474 f

“Serving Electronics Manufacturing, Plating, Chemical Processing,

Water and Waste Water Treatment, and Swimming Pool Industries

since 1978” Your Single Source Supplier of Corrosion

Resistant Thermoplastic Products for Fluid Control & Storage Products

Quality products and superior customer service, inclubincr:

6530 Cambridge St., Mpls., MN 55426 Ph: 952-925-5075 Fax: 965-925-1758

4345 Oneida St., Denver, CO 80216 Ph: 303-398-2700 Fax: 303-398-0200

930 DuPage Ave., Lombard, IL 60148 Ph: 630-629-5616 Fax: 630-629-5583

www.indelco.com

Circle 114 on reader card or go to www.thtu.tolwebconnect Circle 009 on reader card or go to www.thru.to/webconnect

November/December 2002