Electronics Engineering (Survival Kit)

  • Upload
    spidyan

  • View
    219

  • Download
    0

Embed Size (px)

Citation preview

  • 7/27/2019 Electronics Engineering (Survival Kit)

    1/45

  • 7/27/2019 Electronics Engineering (Survival Kit)

    2/45

    4. Pentodea. A thermionic valve which has five electrodes (anode, cathode,

    control grid, screen and suppressor grid)

    5. Beam Power Tubea. An electron-beam tube built so that directed electron beams

    contribute substantially to its power handling capacity.

    Vacuum Tube Coefficients1. Amplification Factor()

    The ratio of the change in anode voltage of an electron tube to a

    change in control electrode (grid) voltage that produces the samechange in anode current when other voltages and current are heldconstant.

    2. Plate Resistance (rp)

    The circuit resistance of the internal plate to cathode circuit

    3. Transconductance (gm)

    It is the ratio of a change in anode current with respect to a change

    in control grid voltage.

    SEMICONDUCTOR FUNDAMENTALS

    An atom is the smallest particle of an element that still retains the

    characteristics of that element

    Atomus in Greek meaning invisible

    Consists of positively charged particles and uncharged particles

    Basic particles of negative charge.

    An atom or molecule that has been electrically unbalanced by the loss or

    gain of one or more electrons.

    An atom that has lost an electron

    An atom that has gained an electron

    Are formed when the electron in the outer shell of an atom gains sufficient

    energy from the surrounding media and break away from the parent atom.

    Broad Categories of Materials

    1. Conductor any material that will support a generous flow of chargewhen a voltage source of limited magnitude is applied across itsterminals.

    2. Insulator a material that offers a very low level of conductivity underpressure form an applied voltage source.

    3. Semiconductor a material that has a conductivity level somewherebetween an insulator and a conductor.

    a. A class of material whose electrical properties lie between theextremes of conductors and insulators.

    Element Silicon (Si), Germanium (Ge)

    Compound Glaium Arsenide (GaAs)

    Semiconductor whose electrical properties are dependent on semiconductor

    added to the semiconductor crystals.

    Impurity that gives up electrons

    Impurity that accepts electrons

    The process of adding

    impurity elements toincrease the number offree charges that can bemoved by an externallyapplied voltage.

    ATOMS

    NUCLEUS

    ELECTRONS

    OIN

    POSISTIVE ION

    NEGATIVE ION

    FREE ELECTRONS

    INTRINSIC SEMICONDUCTOR

    2

  • 7/27/2019 Electronics Engineering (Survival Kit)

    3/45

    DONOR IMPURITY

    ACCEPTOR IMPURITY

    DOPING

    A semiconductor whose density of hole concentration in the valence band

    exceeded by the density of electrons in the conductor band.

    Pentavalent Impurities (Donor Atom) N-type1. Phosphorous (P) z = 152. Antimony (Sb) z = 513. Arsenic (As) z = 33

    *Majority carrier is Electrons

    A form of semiconductor material whose electron density in the conduction

    band is exceeded by the density of holes in the valence band

    Trivalent Impurities (Acceptor Atom) P-type1. Boron (B) z = 52. Aluminum (Al) z = 133. Gallium z = 314. Indium (I) z = 49

    *Majority carrier is Hole

    The tendency of an atom to share electrons with their neighboring atoms to

    achieve stable condition

    The merging of a free moving and spatially separated electrons and holes,

    stopping their movement and current carrying capability.

    The amount of time between the creations and disappearance of free

    electrons.

    A two-terminal semiconductor device that exhibit a nonlinear current voltage

    characteristics.

    In the absence of an applied bias voltage, the net flow of charge in any

    direction for a semiconductor is zero.

    The current that exists under the Reversed biased condition which is a

    function of temperature alone.

    The semiconductor diode condition where the association of p-type and n-

    type material has been established.

    Diode Parameters

    The maximum reverse voltage that a diode can with stand without destroying

    the junction.

    Current that flows through a RB diode caused by thermally produced minority

    carriers.

    Caused by surface impurities and imperfection in the crystal structure.

    DIODE CIRCUITS AND APPLICATIONS1. Clipping Circuit

    a. Limiter (clipper)i. A diode circuit whose output is a function of the

    instantaneous input amplitude for a range of values betweenpredetermined limits.

    ii. A diode network that have the ability to clip off a portion ofthe input signal without distorting the remaining part of the

    alternatingwaveform.

    Two Categories1.Series Limiter the

    diode appears asseries element

    2.Parallel Limiter thediode appears as ashunt element

    N TYPE MATERIAL

    P TYPE MATERIAL

    COVALENT BONDING

    RECOMBINATION

    LIFETIME

    SEMICONDUCTOR DIODE

    UNBIASED DIODECONDITION

    REVERSE SATURATIONCURRENT (Is)

    FORWARD BIASEDCONDITION

    PEAK INVERSE VOLTAGE(PIV)

    REVERSE SATURATIONCURRENT (RSC)

    SURFACE LEAKAGECURRENT

    3

  • 7/27/2019 Electronics Engineering (Survival Kit)

    4/45

    Methods of determining the output waveform of a clipper1. Determine the output waveform without the effect of the diode by:

    a. Shorting the diode for series limiterb. Opening the diode for parallel limiter.

    2. Determine the clipping line

    a. For series limiter, clipping line is at the abscissab. For parallel limiter, clipping line is the output reflection of the

    voltage source if there is no voltage source present; the clippingline is at the abscissa.

    3. Inspect the position of the diodea. For series limiters, if the arrow head of the diode is:

    i. Pointing to the right the output waveform is above theclipping line.

    ii. Pointing to the left, the output waveform is below theclipping line.

    b. For parallel limiters, the procedure is:i. Pointing upward, the output waveform is above the

    clipping line.

    ii. Pointing downward, the output waveform is below theclipping line.

    4. For double diode clippers, the procedure is:a. Determine the output waveform without the effect of the diodes.b. Draw the clipping lines as dictated by the voltage sources.c. The resulting waveform is between the two clipping lines.

    A circuit that shifts the DC level of the input signal

    Is two or more peak detectors or peak rectifiers that produce a dc voltage

    equal to a multiple of the peak voltage.

    A rectifier that gives approximately double the output voltage of a

    conventional half-wave rectifier by charging a capacitor during the normallywasted half-cycle and discharging it in series with the output voltage duringthe next half-cycle.

    A type of diode circuit that converts alternating current into a current with a

    large unidirectional component (DC)

    A rectifier circuit consisting of a transformer with a single diode in the

    secondary circuit that conduct current during positive or negative half-cycleof input AC signal at a rate determined by the input frequency.

    The maximum allowable instantaneous reverse voltage that may be applied

    across the diode.

    Advantages of half wave rectifier1. simplicity2. low cost3. requires only one diode and can be used with or without transformer

    Disadvantages of half wave rectifier1. it is very efficient since only half of the input is used2. average output voltage is low3. ripple frequency is hard to filter

    Employs two diode and a

    center tappedtransformers enablingcurrent to conduct throughthe load during both half

    cycle of input voltage

    A bridge arrangement of

    four diodes providing fullwave rectification of thefull secondary voltage ofthe power transformerconsequently, eliminatinga center tappedsecondary.

    Advantages of full waverectifier

    1. it is more efficientsince it operates onboth half cycle of thesine wave

    2. ripple frequency iseasier to filter

    3. since the current sinthe halves of thetransformersecondary areopposite, there is noproblem with DC coresaturation.

    .

    CLAMPER OR DC RESTORER

    VOLTAGE MULTIPLIER

    HALF-WAVE VOLTAGEDOUBLER

    DIODE RECTIFIER

    4

  • 7/27/2019 Electronics Engineering (Survival Kit)

    5/45

    HALF WAVE RECTIFIER

    PEAK INVERSE VOLTAGE(PIV)

    FULL WAVE RECTIFIER (CENTER TAPPED)

    FULL WAVEBRIDGE RECTIFIER

    Disadvantages of full wave rectifier1. it requires a center tapped transformer2. diodes require higher PIV rating3. for a given transformer, the peak voltage requirement is lower in the full

    wave rectifier than in the half-wave.

    Changes the available electrical energy (usually AC) to the form required by

    the various within the system (DC).

    Changes the line voltage to the desired AC voltage with little loss of power

    Its function is to transform the AC voltage to DC voltage

    Smoothens the output of the rectifier so that the DC voltage is relatively freeof ripple.

    To provide a DC voltage of minimum ripple content

    The AC component of the output waveform

    Holds the DC output voltage constant, regardless of changes in the load or

    input voltage.

    Filters1. Capacitor Filter2. RC Filter used to further reduce the amount of ripple across the filter

    capacitor while reducing the DC voltage

    Its ability to hold the output under conditions of changing input or changing

    load

    Special Purpose Diodes1. Light Emitting Diode (LED) a semiconductor PN junction that when

    forward biased, emits light at a wavelength that is a function of itsmaterial and dopants.

    Typical AverageForward Current 10mA to 20mATypical ForwardVoltage 2.2 V to 3 V

    2. Photodiode asemiconductor PN

    junction device whoseregion of operation islimited to the RBregion. Theapplication of light tothe junction will resultin a transfer of energyfrom the incidenttravelling waves (inthe form of photons)to the atomic structureresulting in an

    increase number ofminority carrier and inreturn increase thelevel of reversecurrent.

    3. Optoisolator asolid state device thatprovide high electricalisolation by convertingthe input signal tolight emission andreconverting it to anelectrical signal.

    4. Schottky Diode (HotBarrier or SurfaceBarrier) asemiconductor diodeformed by contactbetween asemiconductor layerand metal contact; ithas a non-linearrectifyingcharacteristic.

    5. Zener Diode asilicon PN junction of

    reference diode thatprovides a specifiedreverse referencevoltage when it isoperated into itsreverse-biasavalanche breakdownregion. It exhibits asharp reversebreakdown at lessthan 6V.

    6. Tunnel Diode - aheavily doped junctiondiode that hasnegative resistance inthe forward directionover a portion of itsoperating range, dueto quantummechanical tunneling.

    7. Varactor Diode aPN semiconductordiode whosecapacitance varies

    5

  • 7/27/2019 Electronics Engineering (Survival Kit)

    6/45

    with the applied voltage. It is variable-reactance tuning element inoscillator and amplifier circuits, including parametric amplifiers.

    Advantages of Transistor over Vacuum Tubes1. smaller and light weight2. has no heater requirement or heater3. has rugged construction4. it is more efficient since less power is absorbed by the device itself5. it is instantly available for use; requiring no warm-up period6. lower operating voltages are possible.

    POWER SUPPLY

    TRANSFORMER

    RECTIFIER

    FILTER

    REGULATOR

    RIPPLE

    REGULATOR

    REGULATION OF A POWER SUPPLY

    Transistor BaseConfiguration

    1. Common BaseConfiguration

    a. The inputsignal isapplied at theemitter, theoutput istaken at thecollector and

    the base isthe commonterminal.

    b. Very low inputimpedance

    In the dc mode the levels

    of IC and IE due tomajority carrier are relatedby a quantity of alpha.The ratio of a smallchange in IC to smallchange in IE.

    2. Common EmitterConfiguration

    a. The input isapplied at thebase, theamplifiedoutput istaken fromthe collector,and theemitter is thecommon

    terminal.b. The best

    combinationof current andvoltages gain

    In the DC mode the levels

    of IC and IB are related bythe quantity beta. Theratio of a small change inIC to a small change in IBand is also calledcommon-emitter forward

    current amplificationfactor.

    3. Common CollectorConfiguration

    a. The inputapplied at thebase, the

    6

  • 7/27/2019 Electronics Engineering (Survival Kit)

    7/45

    output taken at the terminal and the collector is the commonterminal.

    b. This is often used for impedance matching

    Forward current gain in common collector configuration

    Comparison of Amplifier ConfigurationsCharacteristics Common Common CommonBase Emitter Collector

    Power Gain MODERATE HIGHEST MODERATEVoltage Gain HIGHEST MODERATE LOWEST

    (Less than 1)Current Gain LOWEST MODERATE HIGHEST

    (Less than 1)Input Impedance LOWEST MODERATE HIGHESTOutput Impedance HIGHEST MODERATE LOWESTPhase Inversion NONE 180 OUT OF

    PHASEApplication RF AMP UNIVERASAL ISOLATION

    Regions of Transistor Action:1. Active Region emitter-to-base junction is forward biased and the

    collector-base-to-base junction is reverse biased.2. Saturation Region both junctions are forward biased, amplifier3. Cut Off Region both junctions are forward biased

    Transistor Biasing

    An electrical, mechanical or magnetic force applied to a device to establish a

    desired electrical or mechanical reference level for its operation

    Is a DC voltage or current that sets the operating point for amplifying the AC

    signal.

    Reasons for biasing1. To turn ON the device2. To place it in operation in the region of its characteristics where the

    device operates most linearly.

    Types of Bias Circuits1. Fixed Bias is taken from a battery or power supply2. Self Bias (Emitter-Stabilized Bias) the amplifier produces its own DC

    voltage from an IR drop across a resistor in the return circuit of thecommon terminal.

    3. Voltage Divider Bias the most stable type of biasing

    4. Signal Bias the AC signal produces its own bias by rectification in theinput circuit of the amplifier.

    ALPHA ()

    BETA ()

    GAMMA ()

    BIAS

    AMPLIFIERS

    A circuits designed to

    increase the amplitude orlevel of an electronicsignal

    Classification of Amplifiers:

    I. According to Functiona. Voltage

    amplifierb. Current

    amplifierc. Power

    amplifierII. According to

    Configuration

    7

  • 7/27/2019 Electronics Engineering (Survival Kit)

    8/45

    a. Common base amplifierb. Common collector amplifierc. Common emitter amplifier

    III. According to class of operationa. Class A amplifierb. Class B amplifierc. Class C amplifierd. Class AB amplifier

    Comparison of Amplifier Classes

    Class A Class B Class C Class AB

    Efficiency 50% 78.5% 100% BetweenA and B

    Conduction 360 180 180 BetweenAngle A and B

    Distortion LOW HIGH EXTREME MODERATEBias (Base LINEAR CUT-OFF BELOW ABOVE

    Emitter) PORTION CUT-OFF CUT-OFF

    IV. According to Frequencya. DC amplifierb. Audio amplifierc. RF amplifierd. IF amplifiere. Video amplifier

    V. According to the Signal being amplifieda. Small signal amplifiersb. Large signal amplifier

    VI. According to method of coupling

    a. Direct couplingb. Capacitive couplingc. Inductive couplingd. Transformer coupling

    BJT SMAL SIGNAL ANALYSIS

    H Parameters

    Short circuit input impedance

    open circuit reverse voltage gain

    short circuit forward current gain

    open circuit output admittance

    AMPLIFIER

    hi

    hr

    hf

    ho

    Compound Configuration1. Cascaded Connection a

    series connection with theoutput on one stage thenapplied as input to thesecond stage. The cascadeconnection provides amultiplication of the gain ofeach stage for a largeroverall gain.

    8

  • 7/27/2019 Electronics Engineering (Survival Kit)

    9/45

    2. Cascode Connection has one transistor on top of (in series with) another.This arrangement is design to provide high input impedance with low voltagegain to ensure that the input Miller capacitance is minimum.

    3. Darlington Connection the composite transistor acts a single unit with acurrent gain that is the product of the current gains of the individual transistor.

    4. Feedback Pair is a two-transistor circuit that operates like the Darlingtoncircuit. It uses a PNP transistor driving an NPN.

    5. FET (Field Effects Transistor) a unipolar device which operates as avoltage controlled device with either electron current in N-channel FET or ahole current in a P-channel FET.

    a. A three-terminal unipolar device which depends for its operation on thecontrol of current by an electric field.

    Difference between BJT and FET1. its operation depends upon the flow of majority carriers only (unipolar

    device)2. simpler to fabricate and occupies less space in integrated form than BJT3. extremely high input resistance. Can take more input signal voltage.4. less noise than BJT

    5. exhibits no offset voltages at zero drain current. Excellent signal chopper6. relatively immune to radiation7. greater thermal stability than BJT8. less internal noise as an amplifier.

    Disadvantages1. Less gain2. Smaller power ratings3. switching speed is slower

    FET BJTSource Emitter Drain Collector

    Gate Base

    terminal where the charge carriers enter the channel bar to provide current

    thru channel

    terminal where the current leaves the channel

    controls the conductance between the source and the drain

    Two Types of FET1. JFET (Junction Field Effect Transistor)2. MOSFET (Metal Oxide Semiconductor FET)

    or IGFET (Insulated Gate FET)a. Depletion Enhancement MOSFETb. Enhancement only MOSFET

    Linear

    Indicates that for low values of Vds, current varies directly with voltage

    following ohms law.

    Saturation region/ amplifier region

    JFET operates as a constant current device because Id is relatively

    independent of Vds.

    If Vds increased beyond its value corresponding to Va, JFET enters the

    breakdown region where Id increase to an excessive value.

    Drain current with gate shorted to source condition

    SOURCE

    DRAIN

    GATE

    OHMIC REGION

    PINCH-OFF REGION

    BREAKDOWN REGION

    IDSS

    Proper Biasing for a JFET

    VDSVGS

    9

  • 7/27/2019 Electronics Engineering (Survival Kit)

    10/45

    N-CHANNEL + -P-CHANNEL - +

    DC Biasing for a JFET1. Fixed Bias a separate power source2. Self Bias3. Source Bias4. Voltage Divider

    Static Characteristics of JFET1. Drain Characteristics gives relation between ID and VDS for different

    values of VGS (running variable).2. Transfer Characteristics gives relation between ID and VGS for

    different values of VDS.

    Small Signal JFET Parameters1. AC Drain Resistance, rd

    a. The AC resistance between drain and source terminals whenJFET is operating in the pinch-off region

    b. Dynamic drain resistance.

    2. Transconductance, gm (U or S)a. Forward Transconductance or forward trans-admittanceb. Slope of transfer characteristicc. Similar to gm characteristics of vacuum tubes.

    3. Amplification Factor4. DC Drain Resistance, RDS

    Neutrally or lightly doped silicon

    Serves as a platform on which the other electrodes are diffused

    Channel has free charge carriers

    Current can be produced in the channel with voltage applied between drain

    and source but no gate voltage.

    The gate voltage can deplete or enhance the charge carriers in the channel

    to a greater or lesser extent to control the drain current.

    Normally ON device

    Normally OFF device

    The channel has very little doping

    Gate voltage must be applied to enhance the amount of charge carriers in

    the channel to produce drain current.

    Either or both gates control the amount of drain current

    Region void of free carriers and therefore unable to support conduction thru

    the region.

    Proper Biasing of MOSFETVDS VGS

    N-CHANNEL + +P-CHANNEL - -

    Proper Biasing of Depletion EnhancementVDS VGS

    N-CHANNEL + +/-P-CHANNEL - +/-

    IGFET or MOSFET

    DEPLETION ENHANCEMENT

    ENHANCEMENT ONLYMOSFET

    DUAL GATE IGFET orMOSFET

    DEPLETION REGION

    FEEDBACK AMPLIFIERAND OSCILLATORS

    10

  • 7/27/2019 Electronics Engineering (Survival Kit)

    11/45

    The application of a portion of the output signal of a circuit back to the input

    circuit.

    One in which a fraction of the amplifier output is fed back to the input circuit.

    Two Parts

    1. amplifier2. feedback circuit

    Types of Feedback1. Positive Feedback (Regenerative)

    a. if the feedback signal is combined in phase with the input signalb. if the feedback voltage or current is so applied to increase the

    input voltage or currentc. application: Oscillator circuits

    2. Negative Feedback (Degenerative)a. If the feedback signal is combined 180 degrees out-of-phase

    with the input signalb. If the feedback voltage or current is so applied to reduce

    amplifier inputc. Application: Amplifier circuits

    Signal Sources1. Thevenins Source2. Nortons Source

    Two Types of Sampling1. Voltage Sampling if the feedback network is connected in shunt

    across the output node.2. Current Sampling if the feedback network is connected in series with

    the output loop.

    Two Types of Mixing1. Series Mixing the feedback network is connected in series with the

    input loop so that the feedback signal is in the form of voltage.2. Shunt Mixing the feedback network is connected in shunt with the

    input terminal so that what is added to the input is current.

    Effect of Negative Feedback1. Stabilize the amplifier2. Increase the bandwidth of an amplifier3. Improve the linearity of the amplifier4. Improve noise performance5. Improve the characteristics of an amplifier to approach ideal condition

    (Raise or lower the impedance of an amplifier)

    Effect of Positive Feedback1. increased pain that may lead to oscillation

    Feedback Configuration1. Voltage Series Feedback2. Voltage Shunt Feedback3. Current Series Feedback4. Current Shunt Feedback

    Parameter Voltage-Series Current-Series Voltage-Shunt Current-ShuntZif increased increased decreased decreased

    Zof decreased decreased decreased increased

    FEEDBACK

    11

  • 7/27/2019 Electronics Engineering (Survival Kit)

    12/45

    Process by which variations in amplitude are repeated continuously at a

    specific frequency

    Accomplished by using an amplifier in a circuit where part of the output is fed

    back to the input.

    The use of positive feedback which results in a feedback amplifier having a

    closed loop gain greater than unity

    If the output signal varies sinusoidally

    If the output voltage rises quickly to one voltage and later drops quickly to

    another voltage level.

    Uses an Op Amp and RC bridge circuit, with the oscillator frequency set by

    the R and C components.

    Oscillator Type Reactance ElementX1 X2 X3

    Colpitts C C L

    Hartley L L CTuned input LC LC --Tuned output

    Inductors L1 and L2 have a mutual coupling, M, which must be taken into

    account in determining the equivalent inductance for the resonant tank circuit

    Basically a tuned circuit oscillator using a piezoelectric crystal as a resonant

    tank circuit

    The crystal (usually quartz) has a greater stability in holding constant at

    whatever frequency the crystal is originally cut to operate

    Exhibits the property that when mechanical stress is applied across oppositefaces of crystal, a difference of potential develops across opposite faces ofthe crystal

    Piezoelectric effect

    2 Resonant Frequencies1. Series Resonant Circuit

    a. The reactance of the series RLC Leq are equal (and opposite),the impedance is very low (=R).

    2. Parallel Resonant Circuita. Higher frequencyb. The reactance of the series RLC Leq equal the reactance of

    capacitor, Cm

    c. Very high impedance

    OPERATIONAL AMPLIFIER AND INTEGRATED CIRCUITS

    A very high gain, high rin directly coupled negative feedback amplifier which

    can amplify signals having frequencies ranging from 0 Hz to 1 MHz.

    Originally designated to perform mathematical operations like summation,

    multiplication, differentiation and integration.

    An Ideal Operational Amplifier would have

    1. infinite input impedance it would consume no current from the source2. zero output impedance it would like a perfect voltage source to a load3. infinite gain any input would be infinitely amplified

    Typical Uses of Op Amp1. scale changing2. analog computer operations3. instrumentation and control system4. phase shift and oscillator circuit

    OSCILLATION

    SINUSOIDAL OSCILLATOR

    SQUARE WAVE ORPULSE OSCILLATOR

    WEIN BRIDGE OSCILLATOR

    HARTLEY OSCILLATOR

    CRYSTAL OSCILLATOR

    QUARTZ CRYSTAL

    OPERATIONAL AMPLIFIER

    12

  • 7/27/2019 Electronics Engineering (Survival Kit)

    13/45

    The terminal marked (-)

    Whatever signal polarity is applied to the inverting will cause the opposite

    polarity on the output terminal.

    The terminal marked (+)

    Whatever polarity is applied to the non-inverting input terminal will cause thesame polarity in the output terminal.

    Op Amp Circuits1. Constant Gain Inverting Amplifier2. Non-Inverting Amplifier3. Unity Follower provides a gain with no polarity reversal4. Summing Amplifier5. Integrator feedback component (capacitor), the output is the integral

    of the input with an inversion and scale multiplies of1/RC6. Differentiator the output is proportional to the time derivative of the

    input. The magnitude of the output is increase linearly with increasing

    frequency, and the different circuit has high gain at high frequencies.7. Differential Amplifier the differential amplifier is the marriage of boththe inverting and non-inverting amplifiers. The output is the result of thedifference between the two inputs.

    8. Comparator can be used as a limit, level detector or switch. It can alsobe used to convert a ramp input to a pulse and the pulse to reset theramp.

    Op Amp Specifications1. Input Offset Voltage

    The difference in the DC voltages that must be applied to the

    input terminals to obtain equal quiescent operating voltage (0output voltage) at the output terminals

    2. Input Offset Current The differences in the current at the 2 input terminals

    3. Quiescent Operating Voltage

    The DC voltage at either output terminal with respect to the

    ground4. DC Device Dissipation

    The total power drain of the device with no signal applied and no

    external load current5. Common Mode Voltage Gain, Ac

    The ratio of the signal voltage developed at either of the 2 output

    terminal to the common signal voltage applied to the 2 inputterminals connected in parallel

    6. Differential Voltage Gain Single Ended Input

    The ratio of the change in output voltage either output terminalwith respect to the ground to difference in the input voltages.

    7. Common Mode Rejection Ratio (CMRR)

    The ratio of the full differential voltage gain to the common mode

    voltage gain8. Single Ended Input Resistance (Rin)

    The ration of the change in input voltage to the change in input

    current measured at either terminal with respect to the ground9. Single Ended Output-Resistance (Ro)

    the ratio of the change in output voltage to the change in output

    current measured at either output terminal with respect to theground

    10. Slew Rate

    Device parameter including how fast the output voltage changeswith time

    11. Drift

    The term describing the change in output voltage resulting from

    change in temperature12. Roll-Off

    The reducing of op-amps gain due to increasing operating

    frequency.

    INVERTING INPUT

    NON-INVERTING INPUT

    13

  • 7/27/2019 Electronics Engineering (Survival Kit)

    14/45

    INTEGRATED CIRCUITS

    Lee de Forest invented the Triode Tube

    W.H. Brattain and I. Bardeen invented the transistor

    ICs (Microelectronics)

    A complete electronic circuits in which both the active and passive

    components are fabricated on an extremely tiny single chip of silicon

    J.K. Kilby develop the first IC

    Built by connecting separate components

    Advantages of ICs over Discrete Components1. extremely small physical size

    2. very small weight3. reduced cost (individual transistor)4. extremely high reliability

    a. absence of soldered componentsb. need for fewer interconnectionc. small temperature rise due to low power consumption

    5. suitable for small signal operation6. low power consumption7. easy replacement

    Disadvantages of ICs over Discrete Components1. coils or inductors cannot be fabricated2. ICs function at fairly low voltages

    3. handle only limited amount of power4. quite delicate and cannot withstand rough handling or excessive heat

    Scale of Integration1. SSI Small Scale Integration

    The number of circuits containing in an IC package is less than 30

    2. MSI Medium Scale Integration

    The number of per package is between 30 100

    3. LSI Large Scale Integration

    Circuits density is between 100 100, 000

    4. VLSI Very Large Scale Integration

    In excess of 100, 000

    Classifications of ICs by Structure1. Monolithic Integrated Circuits

    a. single stoneb. single solid structurec. all circuit components (both active and passive) are fabricated

    inseparably within a single continuous piece of Silicon crystallinematerial

    2. Thick and Thin Film ICsa. Only passive components are formed through thick and thin film

    techniques on the insulating surface as glass or a ceramicmaterial

    b. The active elements are added externally as discrete elementsto complete a functional circuit.

    Resistors and conductors are formed by varying the width and thickness of

    the film and by using materials of different resistivity

    Capacitor are produced by sandwiching an insulating oxide film between 2

    conducting films

    Printed thin film circuits

    Silk screen are made of

    fine stainless steel wiremesh and the links arepastes (of pulverizedglass and aluminum)which have conductive,

    resistive or dielectricproperties.

    1907

    1948

    1960

    INTEGRATED CIRCUITS

    1958

    DISCRETE

    THIN FILM ICs

    14

  • 7/27/2019 Electronics Engineering (Survival Kit)

    15/45

    THICK FIM ICs

    3. Hybrid or Multichip ICsa. formed either by interconnecting a number of individual chips or

    by a combination of film or monolithic IC techniques

    Classification of ICs by Function1. Linear ICs analog ICs because their inputs and outputs can take on a

    continuous range of values and the outputs are generally proportional tothe inputs

    Applications1. Op Amps 5. Small Signal Amplifier 2. Power 6. RF and IF Amplifier 3. Microwave Amps 7. Multiplexer 4. Voltage Comparators 8. Voltage Regulators

    2. Digitals ICs

    switching circuits

    monolithic integration because a computer uses a large number of

    identical circuits

    Applications1. logic gates 5. calculator chips

    2. flip flops 6. memory chips3. counter 7. microprocessors4. clock

    attachment of wires to an IC

    an extremely small part of a silicon wafer on which IC is fabricated

    Si wafer of 2cm diameter 1000 IC chips

    To check the proper electrical performance of each IC with the help of

    probes

    Introduction of controlled small quantities of a material into the crystal

    structure for modifying its electrical characteristics.

    A glass plate with circuit pattern drawn on it

    Putting a cap over the IC and sealing it

    Physical placement of materials on a given surface

    Removal of surface material form a chip by chemical means

    Providing ohmic contacts and interconnections by evaporating aluminum

    over the chip

    A photo sensitive emulsion which hardens when exposed to ultraviolet light

    Incising or cutting with a sharp point

    A thin slice of a semiconductor material either circular or rectangular in

    shape in which a number of ICs are fabricated simultaneously

    How Monolithic ICs aremade?

    1. Wafer Preparation

    a P-type SI bar is

    taken and cut intothin slices called

    wafers this wafers after

    being lapped andpolished to mirrorfinish serve as thebase or substratefor hundreds ofICs

    2. Epitaxial Growth

    An N-type layer

    (15m thick) isnow grown on theP-type substrate

    by placing thewafer in furnaceat 1200C andintroducing a gascontainingphosphorous

    BONDING

    CHIP (DIE)

    CIRCUIT PROBING

    DIFFUSION

    DIFFUSION MASK

    ENCAPSULATION

    15

  • 7/27/2019 Electronics Engineering (Survival Kit)

    16/45

    EPITAXY

    ETCHING

    METALLIZATION

    PHOTORESIST

    SCRIBING

    WAFER

    3. Oxidation

    A thin layer of SiO2 is grown over the N-type layer by exposing the

    wafer to an oxygen atmosphere at about 1000C4. Photolithographic Process

    Involves selective etching of Sio2 layer with the help of photographic

    mask, photoresist and etching solution.

    Helps to select particular areas of the N-layer which are subjected to

    an isolation diffusion process.5. Isolation Diffusion

    The wafer is subject to a P-layer diffusion process by which N-type

    layer is isolated into islands on which transistor or some othercomponents is fabricated.

    6. Base and Emitter Diffusion

    The P-type base of transistor is diffused into the N-type layer which

    itself acts as collector.7. Pre-Ohmic Etch

    For good metal ohmic contact with diffused layers, N+ regions are

    diffused into the structure.8. Metallization

    Done for making interconnections and providing bonding pads

    around the circumference of the chip for later connection of wiresI. Transistor

    II. ResistorIII. Capacitor

    9. Circuit Probing

    Each IC on the wafer is checked electrically for proper performance

    by placing probes on the bonding pads

    Faulty chips are marked and discarded after the wafer has been

    scribed and broken down into individual chips10. Scribing and Separating into Chips

    Wafer is broken down into individual chips containing the integrated

    circuits

    Wafers are first scribed with a diamond tipped tool and thenseparated into single chips

    11. Mounting and Packing

    The individual chip is very small and brittle

    It is cemented or soldered to a gold plated header through which

    leads have already been connected12. Encapsulation

    A cap is now placed over the circuit and sealing is done in an inert

    atmosphere

    Digital ICs

    Receives input of a linear

    voltage, comparing it to areference input voltage to

    determine which isgreater

    Digital to AnalogConverter Circuits

    Vary continuously over

    some range of values

    At one of 2 levels

    representing the binaryvalues of one or zero

    Uses a network of resistor

    Accepts inputs of binary

    values at typically 0V orVref and provides anoutput voltageproportional to the binaryinput values

    Analog to DigitalConversion

    Used to interconnect

    different types of signals,both linear and digital

    May be used to drive a

    load or to obtain a signalas a receiver circuit

    Used in the generation of

    pulse signals that aretriggered by an inputsignals

    Generation of a clock

    signal that operates at a

    frequency set by externalresistor and capacitor

    16

  • 7/27/2019 Electronics Engineering (Survival Kit)

    17/45

  • 7/27/2019 Electronics Engineering (Survival Kit)

    18/45

    i. permanent (internal)ii. temporary (external)

    A test in which ultrasound is used to examine the heart

    Heart in motion image

    Provide single dimension images that allow accurate measurement of theheart chambers

    Capable of displaying a cross-sectional slices of the beating heart, including

    the chambers, values and major blood vessels that exit from that left andright ventricle.

    Nerve and muscle test

    A test that assesses the health of the muscle and the nerves controlling the

    muscle

    555 TIMER

    EEG

    CT SCAN or CAT SCAN

    CAT

    AED

    MAMMOGRAPHY

    ECG or EKG

    ULTRASOUND

    NATURAL PACEMAKER

    ECHOCARDIAGRAM

    M MODE

    2D ECHO

    ELECTROMYOGRAPHY

    Magnetic Resonance

    Imaging

    A method of creating

    images of the inside ofopaque organs in livingorganisms as well asdetecting the amount ofbound water in geologicalstructures.

    Nuclear Magnetic

    Resonance Imaging

    Universally dropped due

    to negative annotations

    Uses large magnets and

    radio frequency waves tocreate moving images

    INDUSTRIALELECTRONICS

    Includes all

    semiconductor deviceswhich inherent on-offbehavior, as opposed toallowing gradual change

    in conduction Non-linear

    Regenerative switching

    devices and they cannotoperate in a linear manner

    Gate triggering circuit

    Small thyristors which do

    not switch the main loadcurrent

    Useful in the gate

    triggering circuit of alarger load power

    switching thyristors

    A 3-terminal device used

    to control large currents toa load

    Rectifier

    3 PN junction

    acts like a switch

    ON closed switchOFF open switch

    18

  • 7/27/2019 Electronics Engineering (Survival Kit)

    19/45

    Advantages of SCR over rheostat and transformers1. small and relatively inexpensive2. needs no maintenance3. wants very little power

    Applications1. lightning2. motor speed control3. electric wilding4. electric heating

    The no. of degrees of an AC cycle during which the SCR is turned ON.

    The no. of degrees of an AC cycle that elapses before the SCR is turned ON.

    Amount of gate current needed to fire a particular SCR.

    To further delay the firing of the SCR

    C values = 0.01 to 1uFTime constant = 1 to 30 msec.

    Disadvantages1. temperature dependence2. inconsistent firing behavior between SCRs of the same type

    break over in only one direction

    Unilateral Breakdown Devices1. Schochley Device 4 layer diode2. SUS Silicon Unilateral Switch3. Triac Triode AC

    - can conduct current in either direction when it is turned on- A 3-terminal device used to control the average current flow to a

    load.

    MRI

    NMRI

    THYRISTOR

    BREAK OVER DEVICES

    SCR(SILICON CONTROLLED RECTIFIER)

    CONDUCTION ANGLE (CA)

    FIRING DELAY ANGLE (FDA)

    IGT

    Advantage of 4 layer diodeover SCR

    1. relatively independentof temperature

    2. break over voltage

    can be heldconsistent from oneunit to another

    Advantages of Triac overMechanical Switches

    1. no contact bounce2. no arcing across

    partially openedcontacts

    3. operates much faster4. move precise control

    of element

    Other important electricalcharacteristics of Triac

    1. ITrms the maximumallowable mainterminal rms current

    1, 3, 6, 10, 15 and

    25 Amps.2. VDROM breakdown

    voltage

    19

  • 7/27/2019 Electronics Engineering (Survival Kit)

    20/45

    The highest main terminal peal voltage the triac can block in either

    direction

    100, 200, 400 and 600 Volts

    3. VTM the ON state voltage across the main terminals

    Ideal VTM = 0

    VTM = 1 to 2 Volts

    Bilateral Breakover Devices1. Diac (Diode AC)

    Bilateral trigger diode

    Symmetrical trigger diode

    2. Silicon Bilateral Switch

    Popular in low voltage trigger control circuits

    Has lower breakover voltages than diacs

    Advantages of Diacs1. relatively temperature stable2. have fairly close tolerance on breakover voltage

    Advantages of SBSs over Diacs1. more vigorous switching characteristics2. more temperature stable3. more symmetrical +VBO and VBO difference 0.3 V4. less batch spread than a diac < 0.1 V

    diacs 4 V

    Other PNPN Devices1. SCS Silicon Controlled Switch2. GTO - Gate Turn Off Switch3. LASCR Light Activated SCR

    Advantages of SCS over SCR1. reduced turn off time2. increased control and triggering sensitivity more predictable firing

    situation

    Disadvantages of SCS1. limited to low power, current and voltage ratings

    Application of SCS1. counters, registers and timing circuits2. pulse generators3. voltage sensors

    4. oscillators

    Advantages of GTO1. can be turned ON or OFF by applying the proper pulse to the cathode

    gate.2. improved switching characteristics

    Applications of GTO1. counters2. pulse generators3. Multivibrator4. voltage regulators

    Applications of LASCR1. optical light controls2. relays3. phase control4. motor control5. computer application

    Unijunction Transistor

    20

  • 7/27/2019 Electronics Engineering (Survival Kit)

    21/45

    A break over type switching devices

    Applications of UJT1. timers2. oscillators3. waveform generators

    4. gate control circuits for SCRs and triacs5. relaxation oscillator

    Programmable Unijunction Transistor

    Has effectively the same operating characteristics with as standard UJT and

    is used in similar application.

    Analogy between PUT and UJTCathode base 1

    Anode emitterGate base 2

    ROBOTICS

    Reprogrammable

    Multi-functional

    Designed to move materials, parts tools or other specialized devices by

    means of variable programmed motions and to perform a variety of othertasks

    Forced labor

    Worker

    Slavery

    Czeck playwriter

    Coined in1920 in R.U.R. (Rossums Universal Robots)

    Robot Institute of America

    Branch of the Society of Manufacturing Engineers (SME)

    Accepted by the 11th International Symposium of Industrial Robotics in 1981

    Robot Assembly1. Arm

    Provides necessary motion to move the tool or part into proper

    position for an operation.

    Manipulator

    2. Drive Muscle

    Engine that drives the links (the sections between the joints their

    desired position).

    Powered by air (pneumatic), water pressure (hydraulic), or electricity

    3. Controller

    Connected to a computer, which keeps the pieces of the arm

    working together.

    The brain of the robot

    UJT

    PUT

    4. End-Effector

    The tool that

    performs theactual work

    Hand connected

    to the robots arm

    actual work

    5. Sensor

    Send information,

    in the form ofelectronic signalsto the controller

    21

  • 7/27/2019 Electronics Engineering (Survival Kit)

    22/45

    Gives the robot controller information about its surroundings and lets

    it know the exact position of the arm, or the state of the world aroundit.

    Sight, sound, touch, taste and smell.

    6. Power Supply

    Provides the necessary power for moving the robot arm through its

    range of motion. The power source for hydraulic or pneumatic arms is generally much

    larger than their electrical equivalents.

    Axes of motion of robotic arms.

    Available to a fixed-base fully articulated arm.

    Motion of the entire arm about the fixed base.

    Movement above the waist

    Elbow movement

    Different types of wrist motion1. pitch up and down2. yaw side to side3. roll rotation of the wrist about the axis of the forearm

    Classification of Robots1. movement2. control used3. program used

    Classification According to Control1. Fixed and Variable Sequence Robots

    Also known as pick and place robot.

    Can be programmed for a specific sequence of operations

    2. Playback Robot

    Memorizes and records the path and sequence of motions and can

    repeat them continuously without any further action or guidance formthe operator

    3. Numerically Controlled Robots

    Programmed and operated much like a numerically controlled

    machine.

    Servo-control by digital data and its sequence can be changed with

    relative ease.4. Intelligent (sensory) Robots

    Robots capable of performing some of the functions and tasks

    carried bout by human beings.

    Equipped with a variety of sensors with visual and tactile (touching)

    capabilities

    Classification According to Movement1. Rectilinear

    It can move its end effector in only 3 directions: up and down, left

    and right along a track and front to back,

    Box shaped work envelop

    Smaller range of motion

    Easiest to program because of rectangular coordinates system theyuse.

    DEGREES OF FREEDOM

    WAIST MOTION orARM SWEEP

    SHOULDER orVERTICAL MOTION

    ELBOW EXTENSION

    2. Cylindrical

    Has a greater

    range of motionthan the

    22

  • 7/27/2019 Electronics Engineering (Survival Kit)

    23/45

  • 7/27/2019 Electronics Engineering (Survival Kit)

    24/45

    RESOLUTION

    ACCURACY

    Costs and benefit consideration

    Safety of robot is an important consideration

    COMPUTER

    An electronic data processing machine capable of performing mathematical

    and logical operations accurately and processing large volumes of data athigh speeds.

    Characteristics1. electronic2. internal3. stored data4. program execution modulation

    General Capabilities1. performs operations at extremely fast speeds and almost perfect

    reliability and accuracy2. ability to store and retrieve information3. ability to perform mathematical and logical operations4. ability to handle large volumes of repetitive tasks accurately over long

    periods of time5. can communication with its operations and with other machines6. performs decisions based on a program7. capable of remote processing8. capable of processing one job at a time or several job almost

    simultaneously.

    ECONOMICS

    ROBOTS SAFETY

    COMPUTER

    24

    Actuator Type Advantages Disadvantages

    Electric Lower initial cost a fluid system

    Much lower operating cost than

    a hydraulic system

    Clean no oil leaks to wipe up

    Accurate servo-type positioning

    and velocity can be achieved

    Not such great force capability as

    a hydraulic system

    Very little holding strength when

    stopped will allow a heavy loadto sag; mechanical breaks arerequired.

    Hydraulic Great force capability can

    handle heavy loads

    Great loads

    Great holding strength when

    stopped hydraulic cylinder willnot allow a heavy load to sag.

    Accurate servo-type positioning

    and velocity control can beachieved.

    Intrinsically safe in flammable

    environments such as painting.

    High initial cost

    High operating cost

    Messy tends to leak oil

    Pneumatic Lower initial cost than a

    hydraulic system.

    Lower operating costs than a

    hydraulic system.

    Clean no oil leaks to wipe up

    Quick response

    Programming of accurate

    positioning and velocity controlare impossible; use mechanical

    stops Weak force capability

    Not so much holding strength

    when stopped as hydraulicsystem allows a heavy load tosag

  • 7/27/2019 Electronics Engineering (Survival Kit)

    25/45

    LIMITATIONS1. functions only when it is provided with input information2. can detect but cannot correct an in accurate entry3. subject to occasional breakdown

    Classification of Computer1. According to age and component generators

    a. 1st generation computers (1951-1958)- Vacuum tubes (UNIVAC I)

    b. 2nd generation computers (1959-1965)- transistors

    c. 3rd generation computers (1965-1970)- ICs- Improved reliability and faster speed

    d. 4th generation computers- MSI and LSI- Apple II, TRS-80

    e. Current generation computers- VLSI, optical devices, parallel processing, etc.- Multi-user, multitasking

    2. According to sizea. mainframe

    - large scale- medium scale- small scale

    b. Minicomputersc. Microcomputers

    3. According to applicationa. Scientific

    - small volumes

    - performs complex calculations using sophisticatedformulas

    b. business- large volumes of data- simple calculations

    4. According to Designa. General purpose

    - Performs variety of operations- Versatile enough to process diversified tasks

    b. Special purpose- Performs specific operations- Ex. Automatic Tire Alignment

    Main Parts of a Computer System1. Software- programs that make a computer works- set of instructions for the computer to follow

    2. Hardware- physical components that make up a computer

    Interface or group of devices where people talk to the computer

    Consists of electronic circuits that interpret and execute program instructions

    as well as communication with the Input/Output and storage devices.

    2 parts of CPU1. Arithmetic Logic Unit (ALU)2. Control Unit

    Devices that give out information coming from the computer

    Devices where computer interacts with the user

    Storage where programs are placed inside the computer system

    2 Types

    1. main memory2. secondary memory

    INPUT UNIT

    CENTRAL PROCESSING UNIT(CPU)

    OUTPUT DEVICES

    MEMORY

    25

  • 7/27/2019 Electronics Engineering (Survival Kit)

    26/45

    Input Devices

    The keys on the computer keyboard are arranged in much the same way as

    those on the typewriter

    Device that is moved by hand over a flat surface

    Has a ball on its underside.

    Device that uses a laser beam to read special letters, numbers or symbol

    Output Devices

    An indispensable output device similar to a television

    VDU (Video Display Unit)

    VRT (Video Display Terminal)

    CRT (Cathode Ray Tube)

    Produces printed reports as instructed by a computer program.

    Produces information on paper output

    Combine a magnetic roller with powdered ink called toner to transfer high

    quality characters of image onto a page.

    Have small nozzle that actually spray fast drying ink onto the page to form

    characters of image.

    Use print head to strike an inked ribbon against paper like a typewriter

    creating characters out of a series of dots.

    Device that uses al light source to read text and images directly to thecomputer.

    Looks and behaves like a photocopier.

    Looks and acts like fax machine

    The page or item is fed into the machine scanned, then split out on the other

    end.

    Low cost alternative

    Manual device you move over a flat surface just as you do your PCs mouse

    Memory

    Type of permanent memory

    Non-volatile

    Stores some of the operating system software of the computer.

    The only software built-in into the computer system

    Provides the interface between the computer hardware system and the

    operating system

    Provides control to all devices that require interaction or services of the

    microprocessor.

    Where the various parameters needed by the BIOS to perform its tasks are

    permanently saved in a little piece of CMOS

    Enable a ser of instructions so the CPU can communicate with other parts of

    the motherboard

    Memory where data and programs are stored

    Working storage of the computer system

    Read/write memory

    Data are written to and read from it temporary of volatile memory

    The main board

    The most input part of the

    computer

    Manage all transaction of

    data between CPU andthe peripherals

    Houses the CPU and its

    second level cache, thechipset, the BIOS, mainmemory, I/O chips, partsfor keyboard, serial I/O,parallel I/O disks and plugin cards

    KEYBOARD

    MOUSE

    BAR CODE READER

    MONITOR

    PRINTER

    LASER PRINTER

    INKJET PRINTER

    DOT MATIRX PRINTER

    SCANNER

    FLATBED SCANNER

    SHEETFED

    HAND SCANNER

    READ ONLY MEMORY(ROM)

    BASIC INPUT OUTPUTSYSTEM (BIOS)

    COMPLEMENTARY METALOXIDE SEMICONDUTOR(CMOS)

    CHIPSET

    26

  • 7/27/2019 Electronics Engineering (Survival Kit)

    27/45

    RANDOM ACCESS MEMORY(RAM)

    MOTHERBOARD

    Plug into an expansion slot in PC.

    Has a set of connectors that are exposed on the back of the PC

    Microphone and speakers

    May include a volume control.

    A metal box found at the portion of the system unit case

    Used to convert high voltage AC to a lower DC voltage to power up thecomputers electronic components.

    +5 volts supplies all electronic circuits on motherboard, adaptor cards, and

    peripherals such as disk devices, keyboard, mouse, etc.

    +12 volts used to power motors of disk device systems such as hard disk,

    CD-ROM and floppy disk devices.

    Let communicate over standard telephone lines with other computer users.

    Transfer data, exchange electronic files and ever carry typed, conversation

    real time.

    Hardware founds plug into an expansion slot in PCs system unit

    Connected to the PC by plugging a cable into a port on the system unit.

    Number System

    Said to be of base 10 because it uses 10 digits and the coefficients are

    multiplies by power of 10.

    Two possible values 0 and 1.

    A number expressed in base r can be converted to its decimal equivalent by

    multiplying each coefficient with the corresponding power of r and adding.

    Multiplication is by r and the coefficient found form the integers may range in

    value from 0 to r-1.

    Used in digital computers for simplifying the subtraction operations and for

    logical manipulations.

    Binary digit.

    It is possible to arrange n bits in 2nd distinct ways.

    To represent a group of 2n elements in a binary code requires a minimum of n

    bits.

    Binary Coded Decimal

    A straight assignment of the binary equivalent.

    Decimal digit BCD Excess 30 0000 00111 0001 01002 0010 10103 0011 01104 0100 01115 0101 10006 0110 10117 0111 1010

    8 10001011

    9 10011100

    Error Detection Codes

    An extra bit included with

    a message to make totalno. of 1s either odd oreven.

    A no. in the reflected code

    changes by only one bitas its provides from oneno. to the next.

    Binary code of a group of

    elements consisting of the

    10 decimal digits, the 26letters of the alphabet anda certain no. of specialsymbols such as dollarsign.

    SOUND CARDS

    POWER SUPPLY

    MODEMS

    INTERNAL MODEM

    EXTERNAL MODEM

    DECIMAL SYSTEM

    BINARY SYSTEM

    NUMBER BASECONVERSION

    CONVERSION OF A DECIMALFRACTION TO BASE r

    COMPLEMENTS

    BIT

    BCD

    27

  • 7/27/2019 Electronics Engineering (Survival Kit)

    28/45

    ERROR DETECTION CODES

    REFLECTED CODE GRAY CODE

    ALPHANUMERIC CODES

    American Standard Code for Information Interchange

    Extended Binary Coded Decimal Interchange Code

    Circuit whose input and output signals are 2-state, low or high voltages

    Deals with variables that take on 2 discrete values and with operations that

    assume logical meaning

    Consists of binary variables and logical operation.

    1 stands for the more + of 2 voltage levels

    1 stands for the more of the 2 voltage levels

    a logic circuit with one or more input signal but only one output signal

    Basic Logical Operations

    Represented by a dot or by the absence of an operator

    A logic circuit where output is high only when all inputs are high

    A table that shows all input and output possibilities for a logic circuit

    ANDX Y Z0 0 00 1 01 0 01 1 1

    Represented by a plus signal

    A logic circuit with 2 or more inputs and only one output 1 or more high

    inputs produce a high output.

    OR

    X Y Z0 0 00 1 11 0 11 1 1

    Represented by a prime (sometimes by a bar)

    A gate with 1 input and 1 output (complement)

    NOT

    X Z0 11 0

    Electronic digital circuits

    Logic circuits

    Block of hardware thatproduces a logic 1 or logic0 output signal if inputlogic requirements aresatisfied digital circuits

    Switching circuits

    Other Logic Operations

    Compliment of the OR

    function and its name isan abbreviation of Not-OR.

    All inputs be low to get a

    high output.

    NORF = (X+Y)X Y F0 0 10 1 01 0 01 1 0

    ASCII

    EBCDIC

    CIRCUIT LOGIC

    BINARY LOGIC

    POSITIVE LOGIC

    NEGATIVE LOGIC

    GATE

    AND (INTERSECTION) GATE

    TRUTH TABLE

    OR (UNION) GATE

    28

  • 7/27/2019 Electronics Engineering (Survival Kit)

    29/45

    NOT (INVERSION) GATE

    LOGIC GATES

    NOR FUNCTION

    Complement of AND Abbreviation of Not-AND

    NANDF = (XY)X Y F0 0 10 1 11 0 11 1 0

    Similar to OR but excludes the combination of both X and Y equal to 1.

    XORF = XY + XYF = X + YX Y F0 0 00 1 11 0 11 1 0

    A function that is 1 when the 2 binary variables are equal

    i.e., when both are 0 or both are 1.

    X-NOR

    F = XY + XYF = X . YX Y F0 0 10 1 01 0 01 1 1

    Produces the transfer

    function but does notproduce any particularlogic operation since thebinary value of the outputis equal to the binary

    value of the input.

    BUFFERX F0 01 1

    A set of elements, a set of

    operators and a no. ofunproved axioms ofpostulates.

    Most Common Postulates inAlgebra

    1. closure2. associate law3. commutative law4. identity element5. inverse6. distributive

    History of Boolean algebra

    George Boole introduced

    a systematic treatment oflogic and develops for thispurpose an algebraicsystem.

    C.E. Shannon introduced

    a 2-valued BooleanAlgebra called SwitchingAlgebra, in which hedemonstrated that theproperties of bistableelectrical circuits can berepresented by thisalgebra.

    Every algebraic

    expression deducible fromthe postulates of Boolean

    Algebra remains valid ifthe operators and identityelements areinterchanged.

    NAND FUNCTION

    EXCLUSIVE OR(XOR or EOR)

    29

  • 7/27/2019 Electronics Engineering (Survival Kit)

    30/45

    EQUIVALENCE or EXCLUSIVE-NOR or EXCLUSIVE OR-NOT

    BUFFER

    BOOLEAN ALGEBRA(SYMBOLIC OGIC)

    1854

    1938

    DUALITY PRINCIPLE

    Symbol is of the form mj where j denotes the decimal equivalent of the binary

    no. of the mintern designated.

    The complement of a function expressed as the sum of minterns equals the

    sum of minterns missing from the original function.

    A Boolean expression containing AND terms called product terms of one or

    more literals each.

    A Boolean expression containing OR terms called sum terms

    May be regarded as a pictorial form of a truth table of as an extension of the

    Venn Diagram.

    A primary building block

    from which more complexfunctions are obtained.

    Specifies the no. of

    standard loads that the

    output of the gate candrive without impairmentof its normal operation.

    The current flowing in the

    input of a gate in thesame IC family.

    Power consumed by the

    gate which must beavailable from the powersupply.

    The average transitiondelay time for the signal topropagate form input tooutput when the signalschange in value.

    The limit of a noise

    voltage which may bepresent without impairingthe proper operation ofthe circuit.

    Consists of logic gates

    whose outputs at any timeare determined directlyfrom the presentcombination of inputswithout regard to previousinputs.

    2 binary inputs and 2

    binary outputs

    A combinational circuit

    that forms the arithmeticsum of 3 input bits.

    Consists of 3 inputs and 2outputs.

    A combination logic circuit

    that recognizes thepresence of a specificbinary no. or word.

    A digital function that

    produces a reverseoperation from that of adecoder.

    An electronic switch thatpermits any one of anumber of inputs to bechosen and routed to theoutput.

    Has 2 or more inputs and

    a single output.

    A combinational logic

    circuits that receives

    30

  • 7/27/2019 Electronics Engineering (Survival Kit)

    31/45

    information on a single line and transmits this information on one of 2npossible output lines.

    Employ memory elements (binary cells) in addition to logic gates.

    Their outputs are a function of the inputs and the state of the memory

    elements.

    A system whose behavior can be defines from the knowledge of its signals at

    discrete instant of time.

    A 2 state circuit that can remain in either state indefinitely.

    An external trigger can change the output.

    Also called a Bistable Multivibrator.

    To eliminate the possibility of race condition.

    Ideal memory element when it comes to circuits that count.

    Change of the output to the opposite state in a JK Flip Flop.

    MINTERM OF STANDARD PRODUCT

    CONVERSION BETWEEN CANONICAL FORMS

    SUM OF PRODUCT (SOP)

    PRODUCT OF SUMS (POS)

    KARNAUGH MAP

    BASIC CIRCUIT

    FAN-OUT

    STANDARD LOAD

    POWER DISSIPATION

    PROPAGATION DELAY

    MOISE MARGIN

    COMBINATIONAL LOGIC CIRCUITS

    HALF ADDER

    FULL ADDER

    DECODER

    ENCODER

    MULTIPLEXER (DATA SELECTOR CIRCUIT)

    DEMULTIPLEXER

    SEQUENTIAL CIRCUITS

    SYNCHRONOUSSEQUANTIAL CIRCUIT

    FLIP FLOP

    D FLIP FLOP (D-LATCH)

    JK FLIP FLOP

    TOGGLE

    Changing the output state

    of a flip flop on the risingand falling edge of a clockpulse.

    The minimum amount of

    time the input signalsmust be held constantafter the clock edge hasstruck.

    The minimum amount of

    time the inputs to a flipflop must be presentbefore the clock edgearrives.

    Time it takes for the

    output of a gate or flip flopto change after the inputshas changed.

    A type or of triggering in

    which the output of a F/Fresponds to the level(high or low) of the clocksignals.

    The simplest type of F/F,

    consisting of 2 crosscoupled NAND and NORlatches.

    Type of triggering using 2

    cascaded latches.

    An undesirable condition

    which may exist in asystem when 2 of moreinputs changesimultaneously.

    A group of memory

    elements that worktogether as a unit primarypurpose is to store aword.

    A register that temporarily

    stores a word during dataprocessing.

    31

  • 7/27/2019 Electronics Engineering (Survival Kit)

    32/45

    A register that can shift the stored bits one position to the left of right.

    Has control inputs that determine what it does on the next clock pulse.

    Means storing a word in the shift register by entering 1 bit per clock pulse.

    Loading all bits of word in parallel during one clock pulse.

    A register capable of counting the member of clock pulses that have arrived

    at its clock input.

    Counts clock pulses only when commanded to do so.

    A counter in which the clock drives each F/F to eliminate the ripple delay.

    A counter producing words with 1 high bit which shifts one position per clock

    pulse.

    The no of stable states a counter has.

    Divide by 10 circuits

    Decade counter.

    Counts down.

    F/F outputs are connected to steering networks

    The counter starts at a number greater than 0

    A non-inverting buffer that can be closed or opened by a control signal

    A tri-state switch

    A counter that allows you to preset a number from which the count begins.

    A group with wires used as a common word path by several registers.

    Where the programs and data stored before calculations begins.

    A way of specifying the location of data in memory similar to a house

    address.EDGE TRIGGERING

    HOLD TIME

    SET-UP TIME

    PROPAGATION DELAY TIME

    LEVEL CLOCKING

    LATCH

    7 MASTER SLAVE TRIGGERING

    RACE CONDITION

    REGISTER

    BUFFER

    SHIFT REGISTER

    CONTROLLED SHIFTREGISTER

    SERIAL LOADING

    PARALLEL LOADING(BROADSIDE LOADING)

    COUNTER

    CONTROLLED COUNTER

    SYNCHRONOUS COUNTERS

    RING COUNTER

    MODULUS OF A COUNTER

    MOD 10 COUNTER

    DOWN COUNTER

    UP DOWN COUNTER

    PRESETTABLE COUNTER

    3-STATE SWITCH

    PRESSENTABLE COUNTER(PROG. COUNTER)

    BUS

    MEMORY

    ADDRESS

    The time it takes to read

    the contents of a memorylocation after it has been

    addressed.

    A type of memory in

    which data stored in thememory is lost when thepower is turned off.

    A type of memory in

    which the stored data isnot lost when the power ifturned off

    Programmable ROM

    Allows the user to storethe data.

    Programming is

    permanent.

    Erasable PROM

    A device that is ultraviolet-

    erasable and electricallyreprogrammable.

    32

  • 7/27/2019 Electronics Engineering (Survival Kit)

    33/45

    Electrically Erasable PROM

    Non volatile like EPROM but does not require ultraviolet light to be erased.

    Read Write Memory

    Core Ram

    Non volatile.

    Uses bipolar or MOS F/Fs

    Data is retained indefinitely as long as power is applied to the F/Fs

    Uses MOSFETs and capacitors that store data.

    Highly volatile because not only must the power be kept on, but the

    capacitor charge also be refreshed every few msec.

    Must be able to process data.

    Brain of the computer

    Shingle chip capable of processing data and controlling all the components,

    whether input of output.

    Keep all other parts working together in the right time and sequence.

    Contains the microprocessor data processing logic.

    Prominent part of microprocessor wherein the data is being stored.

    Programs which can assist users of particular type of computer to make the

    best use of their machine.

    A way detailed list of steps which must be followed to accomplish a certain

    task.

    A diagrammatic representation of a sequence of events.

    A section of program which will repeat over and over again.

    A program in which each step is followed by the next without any alternate

    routes or paths.

    Allows us to write one program that can do different things at different times.

    A section of a program which causes different actions to be taken on

    conditions.

    A portion of the program which is called upon to perform a specific task.

    Only language the computer actually understands

    Consists of 1s and 0s.

    A low-level language which uses mnemonics in place of binary patterns.

    Abbreviations for machine language instructions.

    ACCESS TIME

    VOLATILE

    NON-VOLATILE

    PROM

    EPROM

    EEPROM

    RAM

    STATIC RAM

    DYNAMIC RAM

    PROCESSOR

    CONTROL UNIT

    ARITHMETIC LOGIC UNIT

    REGISTER

    SOFTWARE

    PROGRAM

    FLOWCHART

    LOOP

    STRAIGHT-LINE PROGRAM

    BRANCHING

    BRANCH

    SUBROUTINE

    MACHINE LANGUAGE

    ASSEMBLY LANGUAGE

    MNEMONICS

    Uses advanced

    commands.

    Formula translation Language that handles

    high level mathematicsvery well and isdesignated for scientistsand engineers.

    Common Business

    Oriented Language

    33

  • 7/27/2019 Electronics Engineering (Survival Kit)

    34/45

  • 7/27/2019 Electronics Engineering (Survival Kit)

    35/45

    Measurements of quantities in Electrical Engineering or Electrical

    Engineering quantities such as voltage, current, etc.

    Device that can give quantitative description on a given parameters.

    Electromechanical device with moving pointers, spring and moving coils or

    moving vanes.

    Utilize electronic circuits in place of electromechanical and provide a

    numerical readout.

    Auto range

    Minimum power consumption.

    Bearing friction

    Frequency variations

    Possible loss of magnetism.

    Parallax error-reading from the sides.

    Interpolation error-estimating between graduation Interpretation error-reading on the wrong side of the scale and falling to

    consider the multiplying factor.

    Consists of a movable coil situated within the magnetic field of a permanent

    magnet.

    Consists of moving coil, spring and permanent magnet.

    Consists of a moving coil, called: armature that is free to move within a

    magnetic field set-up by two stationary field coils.

    2 soft iron vanes, movable and stationary.

    Resistance of the ideal ammeter is zero. Needle deflection is directly proportional to current.

    Arises form the fact that meter face is not accurately marked.

    Error caused by the internal resistance of the ammeter.

    Resistor connected in parallel with meter to increase the measuring

    capability of the ammeter.

    R(ab) dictates the circuit what must be obtained in measuring circuit.

    R,L,C (DC), and Z (AC) Variable control use to losing the bridge to a balanced equation is connected

    to branches.

    Galvanometers for DC and Oscilloscope for AC

    Basic meter movement consisting of a fixed coil divided into two equal halves

    and a moving coil between the field coils.

    Consists of a fixed coil of many turns and tow iron-vanes placed in the fixed

    coil.

    Variable capacitor

    Used to measure high voltage but little current.

    Used to measure RF AC signal.

    Consists of a heater and a dArsonval meter movement.

    Consists of a permanent magnet and a moving coil.

    To measure alternating current with the dArsonval meter, first rectify the AC

    by use of a diode rectifier to produce unidirectional current flow.

    INSTRUMENTATION

    INSTRUMENT

    ANALOG METER

    DIGITAL METER

    LIMITATION OF ANALOGMETER, ERROR

    LIMITATION OF ANALOGMETER, USER ERROR

    DARSONVAL METER

    ELECTRODYNAMETER

    IRON VANE MOVEMENTS

    IDEAL AMMETER

    CALIBRATION ERROR

    AMMETER LOADING EFFECT

    DC AMMETER SHUNTRESISTANCE, Rsh

    COMPARING CIRCUIT

    MEASURING CIRCUIT

    DETECTION CIRCUIT

    ELECTRODYNAMOMETERMOVEMENT

    ERON-VANE METERMOVEMENT

    ELECTROSTATIC METERMOVEMENT

    THERMOCOUPLE METER

    DARSONVAL METERMOVEMENT

    DARSONVAL METER,HALFWAVE RECTIFICATION

    35

  • 7/27/2019 Electronics Engineering (Survival Kit)

    36/45

    To improve the sensitivity of a rectifier type of voltmeter, full-wave

    rectification is used.

    Making a comparison measurements are widely used to measure resistance,

    inductances, capacitances and impedance.

    Consists of two parallel resistance branches containing two series elements,usually resistors.

    Modified version of the Wheatstone bridge containing additional set of radio

    arms to compensate for lead and contact resistors of 1 ohm or loss.

    Known and simplest of loop tests used principally to locate ground faults in

    short sections of communications and power cables.

    Ground faults and short circuits in high resistance loops such as long

    communications lines.

    Used to measure inductance and capacitance accurately.

    Used to measure the impedance of a capacitive circuit.

    Also called as Capacitance Comparison Bridge or the series RC bridge.

    Also called as parallel capacitance comparison.

    Used to determine an unknown inductance with capacitance standards.

    Measure either the equivalent-series components or the equivalent parallel

    components of impedance.

    Measure insulating properties, for phase angles of nearly 90 degrees.

    Used on laboratories to measure the impedance of both capacitive and

    inductive circuits at higher frequencies.

    BASIC ELECTRICITY

    An invisible force that can produce heat, light motion and many other

    physical effects that can be seen in battery, static charge, lightning,electronics.

    Negatively charges particle

    Positively charge particle

    Have no electric charge

    Static electricity at rest, without any potion.

    Mks unit of quantity

    Charge in motion, a continuous flow of free electrons.

    The base unit of current

    Source of electrons, the force that causes the motion of electrons

    A potential energy difference that exist across two points which tend to cause

    a flow of electrons

    Unit of emf and voltage, specifies the energy available when a given charge

    is transported from the low to high potential.

    A property of electric circuit, material and substance that converts electrical

    energy to heat energy.

    The base unit or

    resistanceDARSONVAL METER, FULLWAVE RECTIFICATION

    DC BRIDGE

    WHEATSTONE BRIDGE

    KELVIN BRIDGE

    MURRAY LOOP

    VARLEY LOP

    AC BRIDGE

    AC WHEATSTONE BRIDGE

    SMILAR ANGLE BRIDGE

    OPPOSITE-ANGLE BRIDGE

    MAXWELL BRIDGE

    WEIN BRIDGE

    SCHERING BRIDGE

    ELECTRICITY

    ELECTRONS

    PROTONS

    NEUTRONS

    CHARGE

    COULOMB

    CURRENT

    AMPERE

    ELECTROMOTIVE FORCE

    VOLTAGE

    VOLT

    RESISTANCE

    36

  • 7/27/2019 Electronics Engineering (Survival Kit)

    37/45

    OHMS

    The opposite or reciprocal of resistance, it measures how fast electrons

    could easily pass through a material

    The unit of conductance

    The resistance of a conducting material is directly proportional to its length

    ( R L ) and inversely proportional to its cross sectional area (R L/A ).

    A convenient use of area used with circular wires because the use of

    square inches or square feet results in complicated calculations andinconveniently small numbers for ordinary size of wires.

    Effect of temperature on resistance

    To increase the resistance of pure metals. The increase is large and fairly

    regular for normal ranges of temperature.

    To increase the resistance of alloys though in their case, the increase is

    relatively small and irregular. To decrease the resistance of electrolytes, insulators (such as paper

    rubber, glass, mica etc.) and partial conductors such as carbon.

    Change in resistance per degree change in temperature.

    The ratio of potential difference (V) between any two points on a conductor

    to the current ( I ) flowing between them is constant provide thetemperature of the conductor does not change.

    Device having known specific values of resistance and used for the control

    of current or the production of heat.

    The resistor in an incandescent lamp.

    Used as heating elements in toasters, flat irons and other heating

    resistance heating elements.

    They are very accurate and its ohmic and wattage (above 2 W) is painted

    on its covering.

    1/8 W to 2W in rating, and its ohmic rating can be determine by its color

    code.

    Use a thin film of metal or a metal particle mixture to achieve various

    resistances.

    Made by depositing a carbon film on a small ceramic cylinder.

    Connected n a circuit to vary the current

    Connected in a circuit to vary the voltage.

    A potentiometer equipped with plastic thumbwheel or a slot for a

    screwdriver for occasional adjustment.

    A temperature sensitive resistors

    A voltage sensitive resistors.

    A light sensitive resistors.

    Materials through which electron can freely travel silver (Ag 47) , copper

    (Cu 29) gold (Au 79).

    Consist of a group of wires twisted to form a metallic string.

    The term given to an

    insulated wire.

    CONDUCTANCE

    SIEMENS

    RESISTANCE LAW

    CIRCULAR MIL

    TEMPERATURECOEFFICIENTS OFRESISTANCE

    OHMS LAW

    RESISTORS

    FINE TUNGSTEN WIRE

    NICKEL-CHROMIUM ALLOY

    WIRE WOUND

    CARBON COMPOSITION

    METAL FILM

    CARBON FILM

    RHEOSTAT

    POTENTIOMETER

    TRIMMER

    THERMISTOR

    VARISTORS

    PHOTORESISTORS

    CONDUCTORS

    CORD

    37

  • 7/27/2019 Electronics Engineering (Survival Kit)

    38/45

    INSULATORS

    Serves as physical shield against heat or moisture, and they are rated from

    250 to 15,000 volts.

    The current in amperes, a conductor can carry continuously under the

    condition of use without exceeding its temperature rating.

    Materials whose electrical characteristics fall between that of conductors

    and insulators silicon ( Si 14 ) germanium ( Ge 32) metallic compoundscadmium sulfide ( CdS) and cadmium selenide ( CdSe).

    Rate of producing work or consuming energy.

    The S.I. unit of electric power.

    Power rating of electric motor

    The accomplishment of motion against the action of a force which tends to

    oppose the motion

    The S.I. unit of electric energy and work.

    Ratio of useful energy to total input energy which is always a decimal or a

    number less than 1.

    A natural phenomenon in which some material (ferromagnetic) can be

    attached by a magnet but not other material ( non-magnetic)

    A substance that attracts pieces of iron (and its compound) steel, nickel,

    cobalt.

    A field force like electricity and earths gravitational force which acts without

    physical contacts.

    A region in which magnetic materials is acted upon by a magnetic force.

    Represents the line which seems to emanate from north and terminates to

    South Pole.

    The areas where the effect of magnetic field is concentrated.

    Characteristics of magnetic lines of force.

    They possess a positive direction

    They always form a complete loop

    They tend to become as short as possible

    They repel one another

    Like poles repel one another

    They arrange to set up their maximum number

    The total number of magnetic lines of force in a magnetic field.

    The S.I. unit is the Weber (Wb)

    Establishment the magnetic flux in magnetic circuit the counterpart of EMFan electric circuit.

    The limiter of the magnetic circuit to the establishment of a magnetic flux

    A measure of the ability of a magnetic circuit to permit the setting up of flux

    A figure indicating the ability of a material to permit the setting up of flux.

    Ratio of absolute permeability of a material to permeability of vacuum.

    The flux per cross

    sectional area.

    Magneto motive force

    per unit length.

    Magnetic materials

    whereby a change in amagnetization LAGSthe application of amagnetizing force.

    CONDUCTOR INSULATOR

    AMPACITY

    SEMICONDUCTORS

    POWER

    WATTS

    HORSEPOWER

    WORK

    JOULE

    EFFICIENCY

    MAGNETISM

    MAGNET

    MAGNETIC FORCE

    MAGNETIC FIELD

    MAGNETIC LINES OF FORCE

    POLES

    MAGNETIC FLUX

    MAGNETOMOTIVE FORCE

    RELUCTANCE

    PERMEANCE

    38

  • 7/27/2019 Electronics Engineering (Survival Kit)

    39/45

  • 7/27/2019 Electronics Engineering (Survival Kit)

    40/45

    LOOP

    MESH

    DIRECT METHOD

    NETWORK REDUCTION METHOD

    KIRCHOFFS LAW

    KIRCHOFFS CURRENT LAW

    KIRCHOFFS VOLTAGE LAW

    MESH ANALYSIS

    MESH CURRENTS

    A systematic application of KCL at a node and after simplifying the

    resulting KCL equation, the node voltage ca be calculated.

    A node with three or more circuit elements joined together.

    The node from which unknown voltages are measured.

    The current through or voltage across an element in a linear bilateral

    network is equal to the algebraic sum of the current or voltages producedindependently in each source.

    Any resistance R in a branch of network in which current I flowing can be

    replaced, for the purpose of calculations by a voltage equal to IR, or

    If the resistance of any branch of the network of a network is changed from

    R to (R + R) where the current flowing originally is 1, the change ofcurrent at any other place in the network may be calculated by assumingthan assuming than an emf of -1 (R) has been injected into the modifiedbranch while other sources have their emfs suppressed and arerepresented by their internal resistance only.

    In any linear-bilateral network if a source of emf, E in any branch produces

    a current I in any branch., then the same emf, E acting in the secondbranch would produce the same current I in the first branch.

    A voltage source and series resistance combination is equivalent to a

    current source and parallel resistance combination if their respective opencircuit voltages and currents are equal,

    Any 2 terminal of a linear, active bilateral network of fixed resistances and

    voltages sources may be replaced by a single voltage source and a seriesinternal resistance

    Any 2 terminal active network containing voltage sources and resistanceswhen viewed from its output terminals, is equivalent to a constant-currentsource and a parallel internal resistance

    A special case of the application of Thevenins theorem or Nortons

    theorem used for finding the Common Voltage across any network whichmay contains a number of parallel voltages sources.

    For loads connected directly to a DC voltage supply, maximum power will

    be delivered to the load when the resistance equal to the internal

    resistance of thesource.

    Produced an emf when

    two dissimilar metalsare immersed in an acid

    or salt solution, knownas electrolyte.

    Can not be used again

    after it has dischargedall its electrical energy.

    Almost obsolete; used

    in larger bell, indicatorcircuits, and for railwaysignaling.

    It can be recharge after

    supplying it with theelectrical energy

    Consist of positive and

    negative leadelectrodes and anelectrolyte of dilutesulphuric acid all placedin an acid resistantcontainer.

    Measures the capacity

    of cell.

    Used to measure the

    specific gravity of a cell.

    The maximum of force

    available in a cell toproduce current flow

    Some resistance to

    current flows throughthe cell (less than 1ohms in a good cell)

    The voltage measuredin the terminal of a celland is less than the cellemf.

    NODAL ANALYSIS

    PRINCIPAL NODE

    REFERENCE NODE

    SUPERPOSITION THEOREM

    COMPENSATION THEOREM

    40

  • 7/27/2019 Electronics Engineering (Survival Kit)

    41/45

    RECIPROCITY THEOREM

    SOURCE CONVERSION THEOREM

    THEVENINS THEOREM

    NORTONS THEOREM

    MILLSMAN THEOREM

    MAXIMUM POWER TRANSFER

    CELL

    PRIMARY CELL

    DRY CELL

    SECONDARY CELL

    LEAD ACID CELL

    AMPERE HOUR

    HYDROMETER

    EMF OF CELLS

    INTERMNAL RESISTANCE

    POTENTIAL DIFFERENCE

    Provide high PD by connecting the positive terminal of one cell to the

    negative terminal of the other.

    Heavier currents can drawn

    ALTERNATING CURRENT CIRCUITS

    A complete set of positive and negative alternation of sinusoidal waveform

    Number of cycles completed in one second.

    The amount of time required for one cycle to be completed.

    The value at any point in time on a sine wave, at different points.

    The value of voltage or

    current at the positive ornegative maximum withrespect to zero timeaxis.

    The voltage or currentfrom the positive peakto the negative peak orvice versa.

    For sinusoidal half

    period

    The equivalent of DC as

    far as heating atresistance is concerned.

    The ratio of the effective

    value to the averagevalue.

    The ratio of maximum

    value to the effectivevalue.

    An angular

    measurement thatspecifies the position ofa sine wave relative to arelative to a reference.

    A rotating arrow used torepresent the timevarying quantities interms of their magnitudeand angularmeasurements.

    Total circuit limiter to

    flow of AC, in ohms.

    The product of rms

    value voltage andcurrent

    The power actually

    consumed by an ACcircuit.

    The power taken by a

    reactance ( inductive orcapacitive)

    The cosine of angle

    between voltage andcurrent in AC circuit.

    Current remain in phasewith the voltage

    Current leads voltage

    by an angle electricaldegree.

    Current lags voltage by

    an angle electricaldegree.

    41

  • 7/27/2019 Electronics Engineering (Survival Kit)

    42/45

    There is a phase difference of 90 electrical degrees between current and

    voltage, so no useful work done.

    Maybe two, three, four six. Nine-phase but the most common for power

    and lighting applications is the three phase.

    Resistance offered by inductor or capacitor to alternating current in AC

    circuit.

    Resistance of inductive device to AC.

    Resistance of capacitive device to AC.

    The reciprocal of impedance, in Siemens

    CELLS IN SERIES

    CELLS IN PARALLEL

    CYCLE

    FREQUENCY

    PERIOD

    SINE WAVE INSTANTANEOUS VALUE

    PEAK OR MAXIMUM VALUE

    PEAK TO PEAK VALUE

    AVERAGE VALUE

    EFFECTIVE OR ROOT MEAN SQUARE VALUEFORM FACTOR

    CREST FACTOR

    PHASE

    PHASOR

    IMPEDANCE

    APPARENT POWER

    AVERAGE POWER

    REACTIVE

    POWER FACTOR

    UNITY PF

    LEADING PF

    LAGGING PF

    ZERO PF

    POLYPHASE CIRCUIT

    REACTANCE

    INDUCTIVE REACTANCE

    CAPACITIVE REACTANCE

    ADMITTANCE

    Is the ability of the

    inductance andcapacitance to pass AC,in Siemens

    The ability of the

    inductor to permitcurrent to flow.

    The ability of the

    capacitor to permitcurrent to flow.

    RESONANCE ANDFILTERS

    Is the condition existing

    in a circuit, containingR, L, and C, where theapplied voltage V is inphase with the resultingcurrent I;

    Is the ability of a circuit

    to respond more readilyto signals of a particularfrequency to which it istuned than to signals of

    other frequencies.

    Is a range of

    frequencies betweentwo points on itsselective curve? Thebandwidth is takenbetween the pointswhere the current,voltage, or impedanceis 70.7% of maximum,depending on whether itis a series or parallel-

    tuned circuits.

    A figure of merit for RLC

    circuit: that is refers tothe goodness of areactive component.

    The higher the Q-factor,

    the narrower the BWand more selective isthe circuit.

    42

  • 7/27/2019 Electronics Engineering (Survival Kit)

    43/45

    Q-factor in the order of 100-300 are useful in communication engineering

    The disadvantage of high Q-factor in series circuit, it can lead to dangerous

    high voltage across the insulation and may result in electrical breakdown.

    ELECTRICAL MACHINES

    A rotating machine used