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PATENTS GRANTED In the Metal Finishing Field v Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 2023 1 Heavy Iron Phosphate U.S. Patent 5258,078. Nov. 2, 1993 E. I! Kinkelaar, assignor to lexo Corp., Cincinnati An improved iron phosphating immer- sion bath composition, consisting of phos- phoric acid, soda ash, an organic or chlo- rate-based accelerating agent, an amount of gluconic acid effective to inhibit the fonna- tion of a nonadherent iron phosphate pow- dery coating for a time sufficient to deposit at least 80 mg per square foot of water. Electroless Nickel Bath U.S. Patent5,258,961. Nov. 2, 1993 N.M. Martyak et al., assignors to Monsanto Co., St. Louis An electroless nickel plating solution, comprising a water-soluble nickel salt associated with neutral zwitterionic coun- terion, monovalent anionic counterion, a chelant, or a mixture thereof; a monovalent or neutral reducing agent for nickel, and a stabilizer selected from the group consist- ing of protonated amine or hydroxyalkane- sulfonic acid. Electroless Copper Bath U.S. Patent 5258,299. Nov. 2, 1993 R.A. Mayemik, assignor to AMP-A/GO Corp., Newark, Del. In a method of manufacturing an elec- troless copper deposit from a plating bath containing a copper compound, ethylenedi- amine tetra acetic acid as the complexing agent for copper, a pH-adjusting agent, an additive selected from the group consisting of soluble inorganic silicon compounds and soluble inorganic germanium compounds, having a trace iron concentration of up to 125 mg of iron per mole of copper, and in which method an oxygen-containing gas is injected into the plating bath; the improve- ment for producing a copper deposit on a printed wiring board, comprising monitor- ing and maintaining the pH in the range of 11.2- 12 so that the content of the trace iron in the deposited copper layer is maintained below I .5 mg per mole of copper. Powder Coating Booth U.S.Patent5,259,879. Nov. 9, 1993 G.M.A. Khaffab et al., assignors to Ransburg Corp., Indianapolis A powder coating booth comprising a for ELECTROLESS PLATING WASTE TREATMENT SECONDARY CONTAINMENT ??No need for expensive tank passivation ??Flexible PVC or polyurethane construction ??Electronically lap-welded seams for superior strength ??Custom made to your exact dimensions ??Easy inexpensive drop-in installation 9 High resistance to plating solutions ??Good heat transfer Excellent for Electroless Nickel Plating Fast, Reliable, Friendly Service Stringent Quality Control Supplying Silicon Valley for Years CALL 8004234380 P.O. Box 750338, Petaluma, CA 94975 Since 1887 FAX: 707-778-8691 Circle 014 on reader lnfonnation card Sales and manufactur- ing locations in 10 major U.S. indus- trial centers Circle 007 on reader information cerd a4 METAL FINISHING . JANUARY 1995

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Page 1: Electroless copper bath

PATENTS GRANTED In the Metal Finishing Field

v

Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 2023 1

Heavy Iron Phosphate U.S. Patent 5258,078. Nov. 2, 1993 E. I! Kinkelaar, assignor to lexo Corp., Cincinnati

An improved iron phosphating immer- sion bath composition, consisting of phos- phoric acid, soda ash, an organic or chlo- rate-based accelerating agent, an amount of gluconic acid effective to inhibit the fonna- tion of a nonadherent iron phosphate pow- dery coating for a time sufficient to deposit at least 80 mg per square foot of water.

Electroless Nickel Bath U.S. Patent5,258,961. Nov. 2, 1993 N.M. Martyak et al., assignors to Monsanto Co., St. Louis

An electroless nickel plating solution,

comprising a water-soluble nickel salt associated with neutral zwitterionic coun- terion, monovalent anionic counterion, a chelant, or a mixture thereof; a monovalent or neutral reducing agent for nickel, and a stabilizer selected from the group consist- ing of protonated amine or hydroxyalkane- sulfonic acid.

Electroless Copper Bath U.S. Patent 5258,299. Nov. 2, 1993 R.A. Mayemik, assignor to AMP-A/GO Corp., Newark, Del.

In a method of manufacturing an elec- troless copper deposit from a plating bath containing a copper compound, ethylenedi- amine tetra acetic acid as the complexing agent for copper, a pH-adjusting agent, an

additive selected from the group consisting of soluble inorganic silicon compounds and soluble inorganic germanium compounds, having a trace iron concentration of up to 125 mg of iron per mole of copper, and in which method an oxygen-containing gas is injected into the plating bath; the improve- ment for producing a copper deposit on a printed wiring board, comprising monitor- ing and maintaining the pH in the range of 11.2- 12 so that the content of the trace iron in the deposited copper layer is maintained below I .5 mg per mole of copper.

Powder Coating Booth U.S. Patent5,259,879. Nov. 9, 1993 G.M.A. Khaffab et al., assignors to Ransburg Corp., Indianapolis

A powder coating booth comprising a

for ELECTROLESS PLATING

WASTE TREATMENT SECONDARY CONTAINMENT

??No need for expensive tank passivation

??Flexible PVC or polyurethane construction

??Electronically lap-welded seams for superior strength

??Custom made to your exact dimensions

??Easy inexpensive drop-in installation

9 High resistance to plating solutions

??Good heat transfer

Excellent for Electroless Nickel Plating Fast, Reliable, Friendly Service

Stringent Quality Control

Supplying Silicon Valley for Years CALL 8004234380

P.O. Box 750338, Petaluma, CA 94975 Since 1887 FAX: 707-778-8691

Circle 014 on reader lnfonnation card

Sales and manufactur- ing locations in 10 major U.S. indus- trial centers

Circle 007 on reader information cerd

a4 METAL FINISHING . JANUARY 1995