1
Published December 2003 Hardbound 2080 Pages ISBN: 0-75-064509-8 GBP 140 US$ 200 Laboratory, IdahoFalls, U.S.A. Reviews of previous editions: "A publication of no equal that has become an essential reference during its 35 years of pubtication." ASUB Book List "All metallurgists will covet a copy of Smithells.'Chemist~ an~ [nd~s~y "(It) provides an invaluable reference sommefor all workers, libraries and research laboratories in the field of engineering and metallurgy." BNF Abstract ForMore InformationvisiC http://w~w.etsevier, com/inca/publications/store/6/7/6/9/4/3/ ,J Circle 106 on reader information card or go to www.thru.to/webconnect device based upon a time-divisional process gas supply in a chemical vapor deposition (CVD) method, where the process gases are supplied and purged sequentially, and additionally plasma is gen- erated in synchronization with the cycle of pulsing reactant gases. A method of forming thin films that possess a property of gradient composition profile is also disclosed. DEPOSITION OF COPPER FILMS US. 2004009665 (Applied Materials Inc.) Chang, M.; Chen, L. et al. A method of forming a copper film on a substrate by a cyclical deposition technique by alternately adsorbing a copper-containing precursor and a reducing gas on a substrate. The copper film formation is compat- ible with integrated circuit fabri- cation processes. In one integrat- ed circuit fabrication process, the copper film may be used as inter- connect metallization. METHOD OF REMOVING POLYMER AND APPARATUS FOB DOING THE SAME US. 2004009669 (NEC Electronics Corp.) Ohno, H.; Sonoda, H. et aI. Stripping a polymer adhered to a sidewall of an etched metal layer formed on a substrate, includes (a) dissolving the polymer by pro- viding chemicals onto a surface of the substrate, and (b) rinsing the chemicals out of the substrate by providing pure water onto a sur- face of the substrate, wherein at least a part of the step (a) is car- ried out in oxidation atmosphere. DISCOLORATION INHIBITOR FOR METALS U.S. 2004010065 Kohara, N.; Tsurumi, H. Discoloration inhibitor for met- als, for protecting metal artifacts, such as those made of silver, cop- per, and nickel, or their alloys, from tarnishing due to sulfur-con- taining gases such as sulfur oxide (SOX), mercaptans, and hydrogen sulfide, for example, during dis- play or storage of the metal arti- facts. A discoloration inhibitor for metals compris- ing: a fiber having a crosslinking structure and containing carboxyl groups therein, at least part of said carboxyl groups being present as a salt of an alkali metal, an alkali earth metal or ammonia; and fine particles of a metal and/or a metal compound substantially insoluble in water and reactive with a sulfur-containing compound dispersed in said fiber is disclosed. METHOD OF PRODUCING SPRAY DEPOSIT ON BEARING BOSS U.S. 6678956 (Hitachi Construction Machinery) Idetsu, W.; Suzuki, R. et al. Masking means prior to thermal spraying. 86 Metal Finishing

Deposition of copper films

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Page 1: Deposition of copper films

Published December 2003 Hardbound 2080 Pages ISBN: 0-75-064509-8

GBP 140 US$ 200

Laboratory, Idaho Falls, U.S.A.

Reviews of previous editions: "A publication of no equal that has become an essential reference during its 35 years of pubtication." ASUB Book List

"All metallurgists wi l l covet a copy of Smithells.'Chemist~ an~ [nd~s~y

"(It) provides an invaluable reference somme for all workers, libraries and research laboratories in the field of engineering and metallurgy." BNF Abstract

For More Information visiC

http://w~w.etsevier, com/inca/publications/store/6/7/6/9/4/3/ ,J

Circle 106 on reader information card or go to www.thru.to/webconnect

device based upon a t ime-divisional process gas supply in a chemical vapor deposit ion (CVD) method, where the process gases are supplied and purged sequentially, and additionally plasma is gen- erated in synchronization with the cycle of pulsing reactant gases. A method of forming thin films that possess a property of gradient composition profile is also disclosed.

DEPOSITION OF COPPER FILMS US. 2004009665 (Applied Materials Inc.) Chang, M.; Chen, L. et al. A method of forming a copper film on a substra te by a cyclical deposit ion technique by a l te rna te ly adsorbing a copper-containing precursor and a

reducing gas on a substrate. The copper film formation is compat- ible with integrated circuit fabri- cation processes. In one integrat- ed circuit fabrication process, the copper film may be used as inter- connect metallization.

METHOD OF REMOVING

POLYMER A N D APPARATUS FOB

DOING THE SAME

US. 2004009669 (NEC Electronics Corp.) Ohno, H.; Sonoda, H. et aI. Stripping a polymer adhered to a sidewall of an etched metal layer formed on a substra te , includes (a) dissolving the polymer by pro- viding chemicals onto a surface of the substrate, and (b) rinsing the chemicals out of the substrate by providing pure water onto a sur- face of the substrate, wherein at least a part of the step (a) is car- ried out in oxidation atmosphere.

DISCOLORATION INHIBITOR FOR METALS

U.S. 2004010065 Kohara, N.; Tsurumi, H. Discoloration inhibitor for met- als, for protecting metal artifacts, such as those made of silver, cop- per, and nickel, or their alloys, from tarnishing due to sulfur-con- taining gases such as sulfur oxide (SOX), mercaptans, and hydrogen sulfide, for example, during dis- play or storage of the metal arti-

facts. A discoloration inhibitor for metals compris- ing: a fiber having a crosslinking s t ruc ture and containing carboxyl groups therein, at least part of said carboxyl groups being present as a salt of an alkali metal, an alkali earth metal or ammonia; and fine particles of a metal and/or a metal compound substantially insoluble in water and reactive with a sulfur-containing compound dispersed in said fiber is disclosed.

METHOD OF PRODUCING SPRAY DEPOSIT ON BEARING BOSS U.S. 6678956 (Hitachi Construction Machinery) Idetsu, W.; Suzuki, R. et al. Masking means prior to thermal spraying.

86 Metal Finishing