Mil/Aero LDL 2 A Little History The following slides show what
military and aerospace flows were available from Xilinx for many
years Feedback from the space industry and recent military
satilitte failures indicated the need for more intensive screening
for some applications Our currently proposed full-V flow will
follow this brief history
Slide 3
Mil/Aero LDL 3 Manufacturing Flows: Serving the needs from
Space to Base R, V, H, SMD C, I, N, M, SMD
Slide 4
Mil/Aero LDL 4 Rad Tolerant Most Select M&SMD Grade More
Select N-Grade Select Products C&I-Grade All Xilinx Products
Controlled environments Plastic packages Supporting the Aerospace
and Defense Market Space environment Radiation hardened Harsh
environments requiring hermeticity Ceramic packages Wider
temperature range required Plastic packages (Mil Temp) (Mil Temp,
SMDs) PLUS
Slide 5
Mil/Aero LDL 5 Manufacturing Flows C and I grade - Commercial
or Industrial Temp, Plastic M grade - Military Temp, Ceramic N
grade - Military Temp, Plastic R grade (for space) - Radiation
tolerant, Military Temp, Plastic, Extended Flow V grade (for space)
- Radiation tolerant, Military Temp, Ceramic, Similar to Class-V H
grade (for space) - Radiation Tolerant, Military Temp, non-hermetic
ceramic Standard Microcircuit Drawing (SMD) - Military and
Radiation Tolerant, DSCC part number
Slide 6
Mil/Aero LDL 6 Extended Flows for Space Extended burn-in (up to
240 hours) XRAY DPA PIND for hermetic packages CSAM for plastic
packages
Slide 7
Mil/Aero LDL 7 Product Grade Comparisons For Critical Supply
Chain Issues Full documentation and controlled extended product
life cycle
Slide 8
Mil/Aero LDL 8 Product Grade Summary
Slide 9
Mil/Aero LDL 9 Where we are going Many changes are coming from
what I will call acquisition reform II. Xilinx response to customer
needs was to work with industry and customer experts and with DSCC
to define screening flows that will satisfy future customer needs
in the space and military markets. BUT, an issue arose in that
technology developed packages to which traditional full class-S/V
flows did not seem to apply. The solution was to work with our
partners to develop screening flows for these devices which would
demonstrate and the ensure equivalent reliability as standard
military screening flows provided.
Slide 10
Mil/Aero LDL 10 CG560 - Ceramic Column Array Package Attributes
Cavity Down, 42.5mm x 42.5 mm Ceramic substrate Interconnect: 90/10
hard solder column, 0.2mm tall attached with 63/37 soft solder.
Column Pitch = 1.27 mm Thermal Resistance: Theta JA = 14.3 C/Watt,
Theta JC = 1.6 C/Watt Hermetic Product
Slide 11
Mil/Aero LDL 11 CG717-Ceramic Column Array In Process
Configuration - LGA Post Group D & Burn-in Configuration
Package Attributes Cavity Up, 35mm x 35mm, 1.27 mm pitch, Ceramic
Substrate Interconnect: 90/10 hard solder column 0.2mm tall
attached with 63/37 soft solder Pin Compatible with the Virtex-II
BG728 Thermal Resistance: Theta JA = 12 deg C/Watt Hermetically
sealed with Au-Sn Lid 60 microns Bonding Pad Pitch
Slide 12
Mil/Aero LDL 12 CG717 Package X-Section
Slide 13
Mil/Aero LDL 13 CG717 Package Qualification Data
Slide 14
Mil/Aero LDL 14 CF1144 - Ceramic Flip Chip Package Attributes
35mm x 35mm, 1.0 mm pitch, Multi Layer Ceramic Substrate 90Pb/10Sn
flip chip solder 90Pb/10Sn hard solder column Thermal Resistance:
Theta JA =10 deg C/Watt, Theta JC = 0.5 deg C/Watt MSL1
(Non-hermetic) IBM technology with 30 years experience (Column) Lid
strength = 1200psi
Slide 15
Mil/Aero LDL 15 CF1144 Outgassing Data Epoxy Components
Underfill (0.56% of package weight) TML%: 0.13 CVCM %: 0.00 Lid
attach material (0.31% of package weight) TML%: 0.28 CVCM %: 0.16
Total package weight: 19.3g Tested by NASA.
Slide 16
Mil/Aero LDL 16 CF1144 Package Qualification Data
Slide 17
Mil/Aero LDL 17 Xilinx/Aerospace full class V flow
