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J.T. Kinard et al., assignors to Kemet Electronics Corp., Greenville, S.C. A method of anodizing a metal comprising immersing a metal substrate into a glycerine-based electrolytic solution comprising glycerine and 0.1 to 12% by weight of dibasic potassium phos- phate and applying a constant current to produce a uniform ox- ide film. PRETREATMENT OF ELECTRICALLY NON-CONDUCTIVE SURFACES U.S. Patent 6,235,182. May 22, 2001 M. Bele et all, assignors to Atotech Deutschland GmbH, Berlin, Germany Circle 166 on reader card or go to www.thru.to/webconnect , elemental solutions group incorporated Innovative Solutions To MP&M Compliance With Our Award Winning Technologies l Advanced Microfiltration Systems with BackPulse I Ion Exchange Recovery I Reverse Osmosis - Pure H20 8. WWT Recycling I Atmospheric & Vacuum Evaporation l Water Recycling I OPTIX ~ Acid Recovery Over 100 Years of Combined Hands.on Experience Philadelphia Boston Phoenix 215-489-6465 tel 215.489.0649 fax www.h2orecycling.com Circle 045 on reader card or go to www.thru.to/webconnect Method of coating electrically non-conducive surfaces of an arti- cle with solid material particles comprising pretreatment with a solution, which contains a solvent and at least one polyelectrolytic compound wherein the solution includes at least one charged sur- factant of opposed polarity rela- tive to the polyelectrolytic com- pounds and wherein the charge of the polyelectrolytic compound is at least partially compensated for or overcompensated and coating the surfaces with the solid mate- rial particles by bringing the pre- treated surfaces into contact with a dispersing containing the solid material particles, a second sur- factant stabilizing the dispersion against coagulation of the parti- cles and a salt destablizing the dispersion. COATING A SUBSlrRATE WITH A METALLIC LAYER U.S. Patent 6,235,411. May 22, 2001 K.J. Blackwell et al., assignors to International Business Machines Corp., Armonk, N.Y. A process for providing a metallic layer on a polyimide substrate, which comprises providing a sub- strate of a polyimide from diaryl dianhydride and a diamine; sput- ter coating a layer of chromium of 200 angstroms or less on said sub- strate at a deposition rate of about 4 angstroms/second or less, and wherein the temperature during the sputtering is about 5°C and resulting in improved adhe- sion, followed by coating a layer of copper on the layer of chromium. WATERBORNE COATING U.S. Patent 6,238,470. May 29, 2001 T.L. Mayer and R. Krasnansky, assignors to Rohm and Haas Co., Philadelphia, Pa. An aqueous coating composition with improved block resistance 156 Metal Finishing

Coating a substrate with a metallic layer

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Page 1: Coating a substrate with a metallic layer

J.T. Kinard et al., assignors to Kemet Electronics Corp., Greenville, S.C.

A method of anodizing a metal comprising immersing a metal substrate into a glycerine-based electrolytic solution comprising glycer ine and 0.1 to 12% by weight of dibasic potassium phos-

phate and applying a constant current to produce a uniform ox- ide film.

PRETREATMENT OF ELECTRICALLY NON-CONDUCTIVE SURFACES U.S. Patent 6,235,182. May 22, 2001 M. Bele et all, assignors to Atotech Deutschland GmbH, Berlin, Germany

Circle 166 on reader card or go to www.thru.to/webconnect

, elemental solutions group incorporated

Innovative Solutions To MP&M Compliance With Our Award Winning Technologies

l Advanced Microfiltration Systems with BackPulse

I Ion Exchange Recovery

I Reverse Osmosis - Pure H20 8. WWT Recycl ing

I A tmospher ic & V a c u u m Evaporation

l Water Recycling

I OPTIX ~ Acid Recovery

Over 100 Years of Combined Hands.on Experience P h i l a d e l p h i a Boston Phoen ix

215-489-6465 tel 215.489.0649 fax www.h2orecycling.com

Circle 045 on reader card or go to www.thru.to/webconnect

Method of coating electr ical ly non-conducive surfaces of an arti- cle with solid material particles comprising pretreatment with a solution, which contains a solvent and at least one polyelectrolytic compound wherein the solution includes at least one charged sur- factant of opposed polarity rela- tive to the polyelectrolytic com- pounds and wherein the charge of the polyelectrolytic compound is at least partially compensated for or overcompensated and coating the surfaces with the solid mate- rial particles by bringing the pre- t reated surfaces into contact with a dispersing containing the solid material particles, a second sur- factant stabilizing the dispersion against coagulation of the parti- cles and a salt destablizing the dispersion.

COATING A SUBSlrRATE WITH A METALLIC LAYER U.S. Patent 6,235,411. May 22, 2001 K.J. Blackwell et al., assignors to International Business Machines Corp., Armonk, N.Y.

A process for providing a metallic layer on a polyimide substrate, which comprises providing a sub- strate of a polyimide from diaryl dianhydride and a diamine; sput- ter coating a layer of chromium of 200 angstroms or less on said sub- s t ra te at a deposi t ion ra te of about 4 angstroms/second or less, and where in the t e m p e r a t u r e during the sputtering is about 5°C and resulting in improved adhe- sion, followed by coating a layer of copper on the layer of chromium.

WATERBORNE COATING U.S. Patent 6,238,470. May 29, 2001 T.L. Mayer and R. Krasnansky, assignors to Rohm and Haas Co., Philadelphia, Pa.

An aqueous coating composition with improved block resistance

156 Metal Finishing