Ch1. VLSI System Design Methodology

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    VLSI System Design

    Methodology

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    Contents

    Structure Design Strategy

    System on chip design

    Sea of gate & Gate array design

    Standard cell design

    Full-custom mask design

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    Structure Design Strategy

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    System on chip design

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    System on Chip Design options:

    Programmable logic and structures,

    Programmable interconnect, Programmable

    gate arrays

    Sea of gate and gate array design

    Standard cell design

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    Programmable Logic

    In CMOS, the spectrum of programmable

    devices into 3 areas:

    Chips with programmable logic structures

    Chips with programmable interconnect

    Chips with reprogrammable gate arrays

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    The cmos system designer should be familiarwith these options for two reasons:

    First, it allows the designer to competently assess aparticular system requirement for an IC andrecommend a solution, given the system

    complexity, the speed of operation, cost goals,time-to-market goals, and any other top-levelconcerns.

    Second, it familiarizes the IC system designer withmethods of making any chip designreprogrammable and hence more useful and ofwider-spread use.

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    Programmable Logic Structures

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    The programming of PALs is done in three

    main ways:

    Fusible links

    UV-erasable EPROM

    EEPROM

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    Fusible links

    Fusible links use metals such as

    Platinum silicide

    Titanium tungsten to form the links

    These links are blown when current exceeds in the

    fuse.

    This is accomplished by using higher voltage than

    normal.Programming is a one time.

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    UV-erasable EPROM

    UV-erasable memories typically use a Floating Gate.

    The floating gate is interposed between the regular MOStransistor and the channel.

    To program the cell, voltage around 13-14volts is applied tothe control gate. While drain of the transistor to beprogrammed is held at around 12volts.

    Programming may be completed numerous times.

    The chips are usually housed in glass-lidded packages to allowillumination by UV light.

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    EEPROM

    EEPROM technology allows the electrical

    programming and erasure of CMOS ROM cells.

    Two transistors are typically used in a ROM

    cell.

    Access transistor

    Programmed transistor

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    A two-poly sandwich is again used in theprogrammed transistor with the control gateon the top.

    Series access transistor allows programming ofcells.

    EEPROM has a testability advantage overfused technologies.

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    Programmable interconnect.

    In PAL, the device is programmed by changing the

    characteristics of switching element.

    An alternative would be to program the routing.

    Commercially, programmable routing approaches are

    represented by products from Actel

    QuickLogic

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    Antifuse

    Based on an elementcalled a PLICE orantifuse.

    Normally high resistance

    (> 100 M)

    on application ofappropriate voltage,

    the antifuse is changedpermanently to a lowresistance structure

    (200-500)

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    Antifuse-based Actel FPGAs

    I/O Buffers

    Program/Test/Diagnostics

    I/O Buffers

    I/O

    Buffers

    I/O

    Buffers

    Vertical routes

    Rows of logic modules

    Routing channels

    Standard-cell likefloorplan

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    Interconnection Fabric

    Logic Modul

    Horizontal

    Track

    Vertical

    Track

    Anti-fuse

    Actel Interconnect

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    Pass transistors are used to connect wiresegments for the purpose of programming.

    These may be bypassed by antifuses if thelinks are required permanently.

    N1,N2,N3,N4,N9,N10,N11 are column access

    transistors. N5,N6,N7,N8 are row access transistors.

    To program antifuse all transistors in series are

    turned on at end is connected toprogramming voltage and ground supply.

    When the programming sequence is applied,the antifuse so selected is blown.

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    Basic Block in Actel FPGA

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    It consists 3 2-input muxes, nor gate.

    Implements 2 and 3 input logic functions and

    also 4 input functions.

    A latch also implemented using one logic

    element.

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    General Architecture of Xilinx FPGAs

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    RAM-based FPGAs

    CLB CLB

    CLBCLB

    switching matrix

    Horizontalroutingchannel

    Vertical routing channel

    Interconnect point

    [Adapted from http://infopad.eecs.berkeley.edu/~icdesign/. Copyright 1996 UCB]

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    Basic Block (CLB) in RAM-based FPGAs

    R

    Q1D

    CE

    R

    Q2D

    CE

    F

    G

    F

    G

    F

    G

    R

    Din

    Clock

    CE

    F

    G

    A

    B/Q1/Q2

    C/Q1/Q2D

    A

    B/Q1/Q2

    C/Q1/Q2

    D

    E

    Combinational logic Storage elements

    Any function of up to

    4 variables

    Any function of up to

    4 variables

    Courtesy of Xilinx

    [Adapted from http://infopad.eecs.berkeley.edu/~icdesign/. Copyright 1996 UCB]

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    Programmable Logic: FPGA

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    Xilinx 4000 Interconnect

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    Switch Matrix

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    Sea of Gates Uninterrupted lines of Pand N diffusions

    Metal interconnects over non used transistors Lines are interrupted connecting PMOS to Vdd and NMOS to Vss

    2-5 masks till three levels of metals, vias, interconnects

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    Gate Array - Sea-of-gates

    rows of

    cells

    routing

    channel

    uncommitted

    VDD

    GND

    polysilicon

    metal

    possible

    contact

    In1 In2 In3 In4

    Out

    Uncommited

    Cell

    CommittedCell

    (4-input NOR)

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    Sea-of-gate Primitive Cells

    NMOS

    PMOS

    Oxide-isolation

    PMOS

    NMOS

    NMOS

    Using oxide-isolation Using gate-isolation

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    Standard Cell Design

    SSI(nand,nor,xor,aoi,oai,inverters,buffers,regs)

    MSI(decoders,encoders,adders,comparators)

    Datapath(alus,adders,shifters)

    Memories(RAM,ROM,CAM)

    System-level bloks (processors, serial interfaces, etc.)

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    Standard Cell Libraries

    Typically contain a few hundred cells inverters, NAND gates, NOR gates, complex AOI, OAI gates, D-latches,

    and flip-flops

    Each gate type can have multiple implementations to provide adequate drivingcapability for different fanouts

    e.g the inverter gate can have standard size transistors, double sizetransistors, and quadruple size transistors

    the chip designer can choose the proper size to achieve high circuitspeed and layout density

    Cells characterized for various metrics, such as

    delay time vs. load capacitance Circuit, timing, and fault simulation models

    cell data for place-and-route

    mask data

    Cells designed such that they can be abutted to form rows

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    Standard Cell Based Design

    FunctionalModule(RAM,multiplier,)

    RowsofCells

    Logic Cell

    RoutingChannel

    Feedthrough Cell

    Routing channel

    requirements are

    reduced by presence

    of more interconnect

    layers

    [Adapted from http://infopad.eecs.berkeley.edu/~icdesign/. Copyright 1996 UCB]

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