patterning the resist: selectively etching WC plating the copper layer using the patterned resist as a mask to thereby form a copper circuit to be used as a part of a circuit board; measuring a degree of oxidation of the cop- per layer, ,iaid measuring being accomplished prior to coating the resist on the copper layer by irradiating a surface of the copper layer with an irradiation beam so that at least a portion 01‘ the irradiation beam is reflected from the surface as a reflected beam and evaluating a characteristic of the reflected beam as a measure of the degree of oxidation: and after an excessive degree of oxidation has been determined. either removing at least a portion of the oxidized copper or covering the oxidized copper with a copper cladding prior to the coating of the copper layer with the resist.

Electrical Connector Formed by Metal Plating U.S. Patenl 5,6X,483. May 6, 1997 T Akfoh, assignor to The Whitaker Corp., Wilmington, Del.

An electrical connector comprising a di- electric h,ousing made of a heat-resistant plasrlc that can accept metal plating having a roughened surface covered with a metal layer. a conductor pattern formed by pho-

Coating and Surface Treatment Systems for

Metals by J, E:dwards 470pages $135.00

Selection of the most appropriate coating or other surface treatment is addressed in the comprehen- sive guide. Part I covers 76 indus- trially important coating types from acrylic polymers through zinc alloys. Part II provides an overvkw of the 19 most impor- tant coating and treatment meth- ods with emphasis on the impli- cations for a parlicular product in terms of its substrate or shape. Part III offers a guide to coating characteristics.

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tolithography on the metal layer. excess an abrasive layer- and a second major sur- metal removed from the housing leaving face having a layer of pressure-sensitive the conductor pattern thereon in the form of adhesive and a protective liner covering the closely spaced contact members, the hous- layer of pressure-sensitive adhesive, the ing including a contact section and a so- liner having a perimeter coterminous with dering section, with the contact members the perimeter of the substrate in which the extending along one surface of the contact liner has a lift flap secured thereto with a section and along one part of the soldering greater bond strength therebetween than section including a side surface and a bot- the bond strength developed between the tom surface of the soldering section, and liner and the pressure-sensitive adhesive. the side surface of the soldering section the lift flap not extending heyond the pe- having arcuate depressions along which the rimeter of the liner and having a free por- contact members extend. tion accessible to finger grip.

Cationic Electrodeposition Composition U.S. Pafent 5,633,297. May 27, 1997 J.T. Valko and RF: Karabin, assignors to PPG Industries Inc., Pittsburgh

An electrodepositable composition com- prising a nongelled cai:ionic water-dispers- ible resin electrodepositable on a cathode. which is derived from a polyepoxide.

Abrasive Articles U.S. Patent 5.626,639. May 6, 1997 W.B. King, assignor to 3M Co., St Pau/, Minn.

An abrasive article comprising a sub- strate having a first major surface bearing

Sputtering Apparatus U.S. Patent 5,626.727. May 6 1997 H. Yamanishi ef al, assignors fo Matsushita Electric lndustriai Co. Ltd., Osaka-fu, Japan

A sputtering apparatus using a plurahty of rectangular targets to form a thin film on a substrate comprising a plurality of mag- nets disposed along both side edges of each target in such a manner that the polarities of adjacent magnets along the side edges of the target are opposite, and the polarities of the magnets confronting each other across the target are opposite, the surfaces of at least two said targets being inclined to a surface of the substrate al an angle not smaller than 30” and not larger than 60”

electroplating equipment l Single and multi-strand Reel to Reel

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100 METAL FINISHING l JANUARY 1998