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March 3-6 , 2002Hilton Phoenix East/Mesa Hotel
Mesa, Arizona
Sponsored By The IEEE Computer SocietyTest Technology Technical Council
Burn-in & TestSocket Workshop
IEEE IEEE
COMPUTERSOCIETY
COPYRIGHT NOTICE• The papers in this publication comprise the proceedings of the 2002BiTS Workshop. They reflect the authors’ opinions and are reproduced aspresented , without change. Their inclusion in this publication does notconstitute an endorsement by the BiTS Workshop, the sponsors, or theInstitute of Electrical and Electronic Engineers, Inc.· There is NO copyright protection claimed by this publication. However,each presentation is the work of the authors and their respectivecompanies: as such, proper acknowledgement should be made to theappropriate source. Any questions regarding the use of any materialspresented should be directed to the author/s or their companies.
Burn-in & Test SocketWorkshop
Keynote AddressTuesday 3/05/02 8:00PM
“Tooling: The Other ‘Capital’ Equipment”
Steven B. StraussITTO Manager
Intel Corporation
Technical Program
11
Steven B StraussIntel Test Tooling
Operation ManagerChandler, Arizona
Tooling:Tooling:The OtherThe Other
“Capital” Equipment“Capital” Equipment
22
Key Messages:Key Messages:• We have just experienced one of the worst
economic downturns in the history of thisindustry
• Technical challenges continue toaccelerate
• Increasing costs have driven changes inCapital Equipment for Test
• The Tooling Supply industry has notchanged to meet customer needs insolutions, cost, or capability
• It’s time
33Source: VLSI Research
1960
1962
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1998
2000
2002
2004
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0255075
100125150175200225250275300325350375400
Billio
n D
olla
rs ($
B)
-100%-90%-80%-70%-60%-50%-40%-30%-20%-10%0%10%20%30%40%50%60%
Gro
wth
Rat
e (%
)
Chip Sales $BChip Sales % ChangeCAGR 1958-2006
2001 = $141B down 31%2002 = $170B up 21%
15% CAGR1958-2006
The economic world we live in:The economic world we live in:Semiconductor Industry CyclesSemiconductor Industry Cycles
44
The economic world we live in:The economic world we live in:Lessons Learned?Lessons Learned?
TIME
GROWTH
EnablingTechnologies
IrrationalExuberance
RationalGrowth
Turbulence
Are we here?
55
“If the automobile industry advanced“If the automobile industry advancedas rapidly as the semiconductoras rapidly as the semiconductorindustry, a Rolls Royce would getindustry, a Rolls Royce would get500,000 miles per gallon of gas and500,000 miles per gallon of gas andit would be cheaper to throw itit would be cheaper to throw itaway than park it.”away than park it.”
– Gordon E. Moore– Gordon E. Moore Chairman Emeritus, Intel Corporation Chairman Emeritus, Intel Corporation
66
The Technical World we live in:The Technical World we live in:Extending Moore’s LawExtending Moore’s Law
4004400480088008
8080808080858085
80868086 286286386386
486486PentiumPentium®®
Pentium IIPentium II
Pentium IIIPentium III
1.8B1.8B
425M425M
0.0010.001
0.010.01
0.10.1
11
1010
100100
1,0001,000
10,00010,000
19701970 19801980 19901990 20002000 20102010
TransistorsTransistors(MT)(MT)
~2B Transistors~2B Transistors
Pentium 4Pentium 4
Transistors doubling every 2 years toward a billion transistorsTransistors doubling every 2 years toward a billion transistors
~2004: 5GHz, 80W
77
The Technical world we live in:The Technical world we live in:The Volume LifecycleThe Volume Lifecycle
No time for Mistakes - Get It Right The First TimeNo time for Mistakes - Get It Right The First Time
0.350.35µµmm(Act.)(Act.)
0.250.25µµmm(Act.)(Act.)
0.180.18µµmm(Act.)(Act.)
UnitUnitVolumeVolume
Quarters into ProductionQuarters into Production1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 1010
0.130.13µµmm(Est.)(Est.)
88
• Issue– How do you
deliver a lot ofnoise free power,quickly
– Power in = HeatOut
• Capabilitiesneeded�� 2X improvement in2X improvement in
capacitance andcapacitance andinductance needed /inductance needed /generationgeneration
�� Need to optimize theNeed to optimize thecomplete silicon tocomplete silicon totester power deliverytester power deliverysolutionsolution
PII / PIIIPentium
486386286
8086
80858080
800840040.01
0.10
1.00
10.00
100.00
???
1970 1980 1990 2000 2010Year
Icc
(am
p)
The Technical World we live in:The Technical World we live in:Power DeliveryPower Delivery
P4
99
How rapidly can we innovate new thermalsolutions / interface materials ?
0.10.1
11
1010
100100
’71’71 ’74’74 ’78’78 ’85’85 ’92’92 ’00’00 ’04’04 ’08’08
PowerPower(Watts)(Watts)
4004400480088008
8080808080858085
80868086286286
386386486486
PentiumPentium®®
processorsprocessors
The Technical World we live in:The Technical World we live in:Power Density will get worsePower Density will get worse
0000
50505050
100100100100
150150150150
200200200200
250250250250
300300300300
W/c
m2
Tod
ayT
oday
Tod
ayT
oday
+1yr
+1yr
+1yr
+1yr
+2yr
+2yr
+2yr
+2yr
+4yr
+4yr
+4yr
+4yr
AveAveAveAveAveAveAveAve
Hot spotHot spotHot spotHot spotHot spotHot spotHot spotHot spot
1010
CPU Packaging ChallengesCPU Packaging ChallengesC
ompl
exity
/ Pe
rfor
man
ce
25 MHz 2.0+ GHz
WIREBOND FLIPCHIP5 WATTS 100+ WATTS
ORGANIC
SINGLE CHIP
PPGA
PLGAOLGA
FCxGA1
FCxGA2ORGANIC
MODULAR
INT1
Slot M
Slot2
Slot 1
INT2
INT3
FCxGA4
• Current & power are increasing• Voltage scaling lowers noise margins• Frequency push for performance > 3 GHz• Form-factors continue to segment
1111
Communications ProductsCommunications ProductsPackaging ChallengesPackaging Challenges
CostReduce
vfBGA
µµµµBGA
.5mm Ball Pitch
.8 mm Thick
DensityIncrease
DensityIncrease
1.2 mm Thick
SCSP
DieDensity
> 2 DieLarger Body
FCBGA
FC-CSP
Increase Body & I/O
CapabilityIncrease
Mixed-Stack
CapabilityIncrease
Backside Stack
Ultra-Thin Die
TSOP
DensityIncrease
IntegratedComponents and
Substrates
WLPLead/Halogen Free
Future possibilities …Stacked package MCM ?Through Silicon vias ?
1212
The Technical World we live in:The Technical World we live in:Device I/O TrendsDevice I/O Trends
1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0USB
Firewire USB2
Infiniband
SerialATA
SDRAMDDR
RDRAM
DDR2
AGP AGP2x
AGP4x
AGP8x
PCI-XPCI PCI 2
FSB
FSB
FSB
FSBFSB
SerialATAI/O
Dat
a R
ate
(Gbp
s)
Memory Interface
Peripheral Interfaces
FSB
High
Spe
ed S
eria
l
BSBBSB
BSB
1313
The Manufacturing World we live in:The Manufacturing World we live in: Test Flow Revolution Test Flow Revolution
• The test industry has changed– Implemented advanced DFT to
manage test complexity– Eliminate capability treadmill– Enable parallel test in complex
designs• Migrate significant percentage of test
content to less expensive structuraltest
– Enables capital cost reduction– Deliver state-of-the-art capabilities– Simplified tester hardware designs– Optimized content and flow
Fab
Structural Wafer Sort
Assembly
STDBI
Structural Class
Functional Class
PPV
Optimization
in progress
1414
Capital vs. ToolingCapital vs. Tooling
• Historically Capital Equipment got all the attention• But… We are buying less and less Test Capital• And…Tooling is becoming a bigger and bigger %
$
OtherToolingCapital
Burn InFunctional
Test PPVStructural Test
CPU
B
CPU
C
CPU
A
CPU
B
CPU
C
CPU
A
CPU
B
CPU
C
CPU
A
CPU
B
CPU
C
CPU
A
1717
Big Boards and Sockets: Burn in, Massively parallel test and fusing
What is Tooling?What is Tooling?
1919
Provides a temporary Thermal Mechanical and/orElectrical interface to the DUT
Is custom to productsIs dependent on and customized to: Packagingform factors, Electrical and Thermal requirements
and Device FunctionHas demand that is driven by product ramp cycles
and is renewed and upgraded by product,package etc…
Provides supplier and supply chain challenges likeno other commodity
Is a technology, development and HVM enabler!
Tooling:Tooling:
2020
What does it takes to deliver tooling in this environment ?What does it takes to deliver tooling in this environment ?
RFI Suppression with different via types (1000mils spacing or 8 vias)
-30
-20
-100
10
20
30
40
4.8 5 5.2 5.4 5.6 5.8 6 6.2
Frequency (GHz)
Max
E-f
ield
(V/m
)
No Via ThickPTH (20mils FHS)ThinPTH (10mils FHS)Thick Filled Via (20mils FHS)Thin Filled Via (10mils FHS)
PCB Technology / DesignMethodologies
Socket/Contactor Design andFabrication
High Speed/Data Rate & PowerDelivery Modeling/Simulation
C21b
C21a
L1 L2R1 RM2
1
System Integration
RF/EMC Modeling &Simulation
ContactTechnology
Electrical & TestCircuit Design
REQUIREDTOOLING
COMPETENCIES
Thermal Control /Mechanical Actuation
2222
The Treadmill Challenge in ToolingThe Treadmill Challenge in Tooling• NPI increasing at 40%
to 50% per year–More custom designs
• Steep Product Ramps -GIRTFT
• Product Health is a biglever
• Tooling and Servicecosts are increasing asan overall percentageof test cost
Product A Product B
Test
Cos
t / U
nit
TOOLING
Depreciation Tooling Support Labor
2323
Tooling suppliersTooling suppliers• Are there any “turn key” tooling suppliers?
The tooling industry is fragmented• The Capital Analogy:
– Buy capital equipment – One stop shopping– You don’t buy the pieces from 2-3 suppliers!
• Lets buy a Burn In board– 1 supplier for design– 1 supplier for PCB manufacturing– 1 supplier for sockets
• Who stands by the final product? The Customer ?The Tooling Supply Chain Needs to
provide Solutions, not components
2424
• Tooling suppliers fall into 2 categories– Component manufacturers– Integrators or Assemblers
• A typical tooling supply chain contains 2-4poorly synchronized suppliers–Design–Custom component design and manufacturing–Assembly or Integration–HVM support
This industry infrastructure will not achievethe requirements of the next generations
Today’s Tooling Supply ChainToday’s Tooling Supply Chain
2525
ToolingToolingToolingTooling Lead TimeLead TimeLead TimeLead Time
0
5
10
15
Goal < 2 weeksGoal < 4 weeks
Supplier Lead Time
Complex Assemblies
Sub Components
Wee
ksW
eeks
2626
The Next GenerationThe Next GenerationTooling Supply ChainTooling Supply Chain
• Is proactively on the “treadmill”– Technically– Economically– Logistically
• Enables fungible designs that last 2-3 processgenerations
• Is in sync with the specific technologies of thecustomers
• Provides turn key solutions• Has 2 - 4 weak lead times• Is low, low, low cost and continues to drive costs
down
2727
What it takesWhat it takes• Evolution will not yield these goals!• The scaling treadmill that the industry has relied
upon needs to be replaced by disruptivetechnologies
• If you want to survive you must:– invest in disruptive technologies– cannibalize your current ones– acknowledge that your business model will be
completely different in 2 years.
Can you do this? If not you won’t survive!About ½ of you will be around in 2 years
Will you be one of them?
2828
““We sometimes refer to the definition of insanity asWe sometimes refer to the definition of insanity asdoing the same thing the same way over and overdoing the same thing the same way over and overagain, hoping for a different result. If you want toagain, hoping for a different result. If you want to
achieve different results -- achieve different results -- betterbetter resultsresults -- you have-- you haveto do things differently. Success is not accidental. Itto do things differently. Success is not accidental. Ithappens because people plan carefully and they layhappens because people plan carefully and they laythe necessary groundwork to get the right result inthe necessary groundwork to get the right result in
the end.the end.””--- - Craig BarrettCraig Barrett President and CEO, Intel Corporation President and CEO, Intel Corporation December 29, 2000 December 29, 2000