AUTUMATION FOR ELECTRONICS -- A 1956 STATUS REPORT

Alfred R. GrayThe Martin CompanyBaltimore, Maryland

Summary 1. Mechanized single component-part insertionsystems, using "in-line" individual heads, and

At the 1955 IRE National Convention, the designed for high-volume assembly. This typeauthor delivered a paper entitled "Guided Missile is frequently referred to as the "DetroitReliability and Electronic Production Techniques". method".A general description was given of several contem-porary concepts of automation-for-electronics. 2. Mechanized component-part insertion sys-The present paper is a sequel to the previous re- tems, using.one or a relatively few multipleport. An attempt is made to view objectively the heads, and designed for high-volume assembly.various improved concepts and their advancing This we willterm the "Simultaneous method".techniques, and to evaluate them in terms of pre-sent trends for their use. Three needed basic 3. Automatized component-part processing sys-improvements for automatic electronic assembly tems, designed for high-volume fabrication ofmachines are outlined, and a prediction is made stacked-wafer modules -- sometimes abbreviatedthat the early incorporation of these improvements as the "Process method".will rapidly advance the acceptance and applicationof automation-for-electronics. 4. Automation by progra-mmed insertion systems,

using one or a relatively few heads, and de-Introduction signed for low-volume assembly. This type is

often known as the "Batch method".The word "automation" undoubtedly meets with

a slight element of resistance from some quarters 5. Semi-automatic single coomponent-part in---resistance born of the tradition that the proper sertion machines, desianed for low-volumeword-f65rm should be "automization". But "automation" assembly. This is best described as the "In-has now become of age, as evidenced by its appear- dividual method".ance in the latest edition of Webster's New Col-legiate Dictionary. It is defined as: "The Mechanized Single Component-Part Insertiontechnique of making a process or system automatic" Tyiem7 Using "In-Line"_Individual_Heads,or, "Automatically controlled operation of an Fo HighVlume Assembyapparatus, process, or system, especially by elec-tronic devices". A machine typical of this basic type of auto-

mation, and emphasizing radio and TV production,Now that we have "automation" defined and ac- is shown in Figure 1. In 1954, the United Shoe

cepted, let us look at its two general forms as ap- Machinery Corporation demonstrated an experimentalplied to our industry, "Electronics for Automation" version of this "Automatic Electronic Assemblyand "Automation for Electronics." "Electronics foal SysteTn" to the electronics industry. EighteenAutomation" is the responsibility of our sister months ago,four experimental in-line machines andgroup the PGIE; while "Autormation-for-d4lectronics" 15 bench-mounted machines were on trial throughoutis within the scope of our own group the POPT. the industry. Since then, 12 complete conveyorThis brings us back to the original subject. systems have been installed at RCA, Indianapolis;

Delco Riadio, Kokomo, Indiana; Philco, Philadelphia;In the 1955 IRE National Convention paper Philco, Sandusky, Ohio; Stromberg Carlson, Rochester;

entitled, "Guided Missile Reliability and Electrcnic Emerson, Jersey City; and Burroughs, Detroit. TheseProduction Techniques" we admitted that many prob- seven plants represent all segments of the elec-l.ems remained to be overcome before any of the tronics industry. One of these companies has fourcurrent automation schemes could be used to build compl3te systems, of 30 to 40 heads each, inelectronic equipment for high-performance aircraft. operation.It was predicted, however, that within two years afully automatic production line would be in opera- United Shoe's entire experience with component-tion, able to meet the specification requirements part preparation, points to lead-taping as the mostof even the intercontinental guided missile. With reliable method. Their records indicate an indi-only six months remaining before the target date, vidual head insertion reliability of over 99.8%.let us examine how much; and yet, how little pro- This means a system insertion reliability of overgress has been made. After first presenting the 9W, for a 30-head system or over 92% for a 40-headfavorable side, an attempt will be made to show system. Their experience also shows that bodyhow little has actually been accomplished when the taping increases the failure rate two or three ts.potentialities of automation are considered from anindustrial preparedness point of view. Production experience, likewise, shows that

under favorable conditions, 75% of the theoreticalLet us look at the progress side of the ledger. production-per-hour can be realized, or 9,000 sub-There are five basic types of automation for elec- assemblies in an 8-hour day. Production modeltronic assembly: headls are presently available for insertion of

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Fig. 1 - United Shoe's automatic electroric assembly system.

Fig. 2 - United Shoe's indi- Fig. 3 - United Shoe's discvidual "Dynasert" capacitor insert-machine. ing machine.

jumpers, eyelet-type connectors, and component pwrts machine operates at the same 20-per-minute speedfrom small diodes to large tubular capacitors. as the insertion system. It applies flux, drys,Heads are in the advance development stage for the preheats, solder dips, and removes flux. Current-insertion of disc capacitors, tube sockets, and ly a market analysis is being conducted to deter-printed circuit elements. mine the interest of the industry.

Electronic Component Belting Machine, Model B, Interest in the Automation "break-even" pointreplaces the earlier 1/2 watt resistor machine. is naturally high throughout the electronics in-This newest auxiliary machine will belt a wide dustry, and experience may confirm that it is asvariety of component parts. It straightens leads, low as 50 assemblies when the operator-trainingtapes leads or bodies, and makes a preliminary period is taken into consideration.lead-cut.

United Shoe's present "Pallet Recirculator"The $64,ooo question is, "Who will eventually system includes a first-station board loader, a

belt component parts, the supplier or the user?" closed-loop escalator and conveyor that returnsThe answer is probably, "Both", for some time to the pallets to the first station, and a last-sta-come, and it is likely that some seldom-used parts tion board remover. Their engineers are now morewill always be prepared by the user. A year from sold on the use of pallets than ever.now, it is expected that a substantial number ofvendors will be supplying belted component parts. A bench-mounted segment of the system is also

being marketed, which has the advantage of laterAn Automatic Soldering Machine has likewise incorporation into a conveyor system. It is trade-

been developed by United Shoe, and a pilot model marked "Dynasert" and shown in Fig. 2. A dischas been delivered to Stromberg Carlson. This capacitor version is shown in Fig. 3.

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The "Autofab" machine shown in Fig. 4 is also has built a prototype of this design, coupled to atypical of the in-line or "Detroit method" of mech- transfer arrangement operating at right angles toanized production, but emphasizes assembly to mili- the "Autofab" output feeder conveyor, and ba8 de-tary specifications. Eighteen months ago "Autofab" livered it to I.B.M. "Autosol" (as it is now call-had just been demonstrated to the industry and the ed) is designed to keep step with the high-quantitypress (February, 1955). This development evolved capabilities of "Autofab". It provides for flux-from a merger of the nearly parallel, but indepen- ing, preheating and soldering. A waterfall systemdent, designs of General Mills and Taag Design. flows a flux-solvent over the board, and fungus

protection is provided before drying. Berg Manu-These two designs were combined to special I.B.M. facturing and Engineering has added "Autolug" toorder, and the development was completed by the I.B.M's already large family of mechanized assemb-Mechanical Division of General Mills under the ly machines.direction of Dr. Cledo Brunetti. The demonstrationmodel has been in use for over a year at Kingston, Second, the high-production version of "Auto-New York, on the production of over 800 circuits fab", "Autosol", and A.M.P's "Auto-prep" are inof Continental Defense Computers for the U.S. Air limited production as predicted. This is also trueForce. It has 24 component-part insertion heads of General Mills' own two models of automatic com-and delivers one sub-assembly every 3 seconds or ponent preparation machines, which straighten and9,600 per 8-hour day. Three detail views, a de- cut to length component-part leads as a separatetailed description, and cost estimates were given function.in our previous paper.

Third, a greater demand seems to exist for theIn the past 18 months three things have hap- Short-run "Autofab" (see Figure 5). This model is

peneds now in production. The prototype is presently de-signed to use Allen-Bradley lead-taped reels, al-

First, Taag Design completed a dip-soldering though it can be adapted to I.R.C.'s specialmachine originally called "Autodip". General Mills ALitomation Pacs. Early production will go to

Fig. 4 - General Mills' "Autofab" boardfeeder.

Fig. 5 - "Autofab" short-rn assemblymachine.

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Beckman Instruments, Collins-Texas, Magnavox and At Chicago, the finished printed-wiringMcDonald Aircraft. This Short-run design is fully boards are stacked 14 to 18 inches high into theautomatic except for the feed Oa printed-wiring in-line air-cylinder-operated automatic assemblyboards. Component parts are fed from a chute, machine. No pallets are required. For the 10-leads are cut to length, inserted and crimped. The inch portable TV line, two 35-station machines arebench machine sells for $2,395. Extra accessories used in tandem, separated by a manual inspectionfor different body sizes or hole center distances, station. For the 10-inch portable TV, double boardsincluding chute cut-off, insertion and crimping are processed for assembly convenience, and aretool, sell for i495 complete. Tool changes are cut apart at the end of the line. For the 17-inchmade by a cam-lock device and change-over can be TV, one large board has been in production for overmade in 30 seconds. a year. The 21-inch model uses three boards.

The Admiral automation machine (not shown), is The main in-line assembly machine is current-likewise typical of the in-line or "Detroit method" ly able to insert jumpers, resistors-mouldedof mechanized production. Admiral is one of the cylindrical capacitors, tube sockets, and somemost progressive of the radio-TV manufacturers, who ceramic disc capacitors. However, the ceramicare developing automation equipment primarily for capacitors have presented a problem due to surplustheir own use. Eighteen months ago Admiral was "Durez" on the leads, and these are presently beingbuilding an 8-tube section of their latest 21-inch added by auxiliary semi-automatic machines whichtelevision set, using their own 15-station mechan- crimp after hand insertion. Resistors are fedized line. from taped reels, tubular capacitors from chutes,

and other parts by various methods. Malco contactPresently they have two automatized setups, inserting machines complete the set-up.

one at Harvard, Ill. for the processing of printed-wiring boards, and the other at Chicago for auto- Admiral has not yet gone into automaticmatic assembly. At Harvard, copper-clad laminate soldering. They feel there is little to be gained(pre-punched by the supplier) is automatically cut here by automation, as a machine usually requiresto size, silk screened with etching resist, dried, an attendant, and at Chicago one girl is able toand delivered to a manual inspection station. keep pace with the automatic equipment. This al-Next, the boards are hand fed to the automatic most spectacular performance may be attributed toetcher, where they are acid etched, rinsed, put the silicone-coated selective area technique.through a cleaning process to de-carbonize and Furthermore, only two soldering-touchup people arebrighten the copper surface, again rinsed, dried now required as contrasted with six or eight beforeby wringer rolls and hot air jets, and again de- selective soldering was developed. When completelylivered to an inspection station. Here, they are assembled, the boards are conveyor-fed to severalstacked into the third automatized machine where oscilloscope operators for alignment and inspection.they are silk screened with a silicone compound to In addition to their own installation, it will beprovide selSetive soldering, oven-baked for 10 min- remembered that Admiral delivered a 24-stationutes at 200 to a hard "glass" finish, silk screen- machine to RCA Indianapolis for TV assembly. Addi-ed on the back with tube and component-part symbol tional heads are being built for RCA's "red" mould-designation, air dried and delivered to the final ed mica capacitors.inspection station for shipment to the Chicagoassembly plant. The Multra Automatic Assembly Machine is an-

other of the in-line "Detroit method" family,except that it is built in a circle. This machinewas made for P. R. Mallory, Tarrytown, N. Y. toassemble 15,000 to 20,000 mercury batteries a day.It includes vibratory feeders and feedback systems.The machine can be modified to do 16 operations ofnumerous types, including feeding, sorting, sizing,forming, orienting and inspecting.

Ilechanized Component-part Insertionl_5ems Using One or a Relatively

i | ||lil|l!!!!!l _ ~~~~~-ew71Hads, for INgE 1ViEum?"Simultaneous"

AssemblyA newcomer to the commercial market, yet no

stranger to automation, Equip-a-matic EngineeringCorp., Riverside, Illinois has announced a newconcept in automation-for-electronics -- one ofsimultaneous insertion. Mr. Jack J. Zimmerman,President, formerly Director of Industrial ResearchEngineering of Motorola ,and his staff have devel-oped a machine that will insert 45 to 100 resistorsin one stroke. The machine will use a new type of

Fig. 6 - "Autofab" semi-automatic area soldering molded circuit that requires no etching or drill-machine. ing and which is superior to XXX P- phenolic. The

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boards will be marketed by Die-form Circuits, In- provides for automatic dip soldering as indexingcorporated, and will cost 2/3 that of etched takes place. One girl produces 480 chassis, andwiring. five girls 1500, in an 8-hour day. The output is

manually loaded onto a conveyor which travels toThe Equip-a-matic insertion machine will be the tube and alignment stations. Of considerable

made of aluminum castings and with 45 insertion importance is the extremely low module failure-tools will sell for approximately $5o,ooo. Boards rate. (see Figure 8)will be injected and ejected at the rate of 360per hour. The turrets will hold a 4-hour supplyof boards and component parts, and will run un-attended. The company claims an extremely highdegree of reliability for the system. A "demon-strator" will be completed in December. Ordershave already been placed by a well known manufac-turer that supplies the home market.

To this general type we can add the bench-model semi-automatic "cut-and-clinch" machines,used by RCA at Bloomington, Indiana. There, anoperator installs four to eight component parts;and a foot-actuated air cylinder, cuts and clinchesthe entire group simultaneously.

Automatized Component-Part ProcessingSys-temc For High-Volume Fabrication

?fStz -ewafer 1.6I4c

The automation equipment of ACF Electronicsis typical of the automatized"Process method".

Eighteen months ago, ACF expected to produce Fig. 8 - Motorola's modularized porta-400,000 modules per month by the end of 1955, of ble radio.the type shown in Figure 7; and was building to- Motorola sees argumnts for and against theward a production rate of 1,000,000 modules per use of stacked-wafer modules. The Pro argauentsmonth* Since that time, the press has announced cent er modules. serocaresthat Capehart-Farnsworth, Warwick, Wells-Gardner, center around a more reliable and service-freeDumont, and others have been developing TV designs product at a reduced cost. Motorola puts it thiswith ACF. way, "We make a labor saving, because ACF assembles

the parts for us, sells us modules at the same costEmerson is in production on an AC-DC radio as the parts, and charges us nothing for the as-

and a TV receiver using ACF modules. sembly labor. There is a small capital equipmentexpenditure, and no delays due to breakdown ofcomplicated machinery. In general, we see a lotof potential for the stacked wafer module". Theirprincipal objection to the module is that engineer-ing changes cannot readily be made during produc-tion; therefore circuits must be "frozen" beforeattempting modular construction. However, thisonly restates a fundamental doctrine that produc-tion engineers have long been fighting for.

AC?' s progress in recent months has been in-the following directions:

Fig. 7 - ACF stacked wafer 1. Obtaining higher automation-to-manualmodule percentages and greater yields.

Motorola has been mass producing an ACF- 2. Working toward a vast improvement in themodularized portable radio for several months. preparation speed of the resistor formulation,They report that their modular portable is assembl- now being processed by ball grinding techniqaesed to a printed-wiring board which is die-punched, -- actually reducing the preparation time frometched, and has plated-through holes. The board weeks to minutes.is one of several that is processed in their otherChicago plant, which has a production of 10,000 3. Perfecting a machine for automaticallyboards per day. At the assembly plant, stacked- mounting mylar capacitors on wafers.wafer modules and other component parts are fed toa turnstile-like table that seats from one to five 4. Planning expansion - however, this mustoperators. The turnstile is semi-automatic, re- wait until sufficient process economy has beenquiring hand insertion of modules and parts, and realized to make the expansion profitable.

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Today, ACF's sockets, molded of melamine, be- Aerovox is currently working with many TVcome almost an integral part of the mpdule. Tape manufacturers on sample quantities, and has con-resistors and deposited-silver high-K ceramic centrated upon a line of printed wiring breadboard#capacitors are the other predominant elements, and standard modules built around the NationalCurrently, deposited carbon resistors, glass and Bureau of Standards' Preferred Circuits. Theseceramic capacitors are mounted by hand. ACF is uodules are to speed up circuit and system devel-known to be working with a national supplier to bpment. Representative quantities of the first 7provide pyrolytic glass resistors, and IRC is announced modules are now in jobber stock through-rumored to be developing a flat deposited carbon Fut the country and there is a large back-up stock1% resistor for stacked-wafer use. For their at New Bedford, Massachusetts. Recently, 8 addi-commercial versions, a Dures coating is used that tional "preferred circuits" have been made avail-has been wax impregnated, and for Military versions 4ble. After operating the Arlington Facility foran epoxy coating is supplied. a few months, it was moved to Olean, New York where

all of 'the company' s ceramic products are manu-Development of the stacked-wafer module-was factured.

first carried out by the National Bureau of Stand-ards and sponsored by the Navy Bureau of Aero- A second module-processing facility is nownautics. Originally code named "Tinkertoy", it is being built at Olean, by. the Luther Manufacturingnow formally described as Modular Design and Mech- Company, an Aerovox subsidiary. The Luther facilityanical Production of Electronics. The original Ji scheduled to begin operation soon, and is ex-manufacturing facility Was designed by Kaiser pected to be in production in early 1957. ItsElectronics. capacity will be 50,000 modules per day.

The Mead Carney and Co., management consult- Both Aerovox and ACF Electronics were askedants, originally submitted a Report 1728 to NBS how each reacted to the other's competition. Eachindicating the savings attained using the stacked- stated that they could not get any sizable produc-wafer concept. Their report shows a 38.5% savings tion contracts if it were not for the other. Just(compared with conventional component parts) when as the Military cannot consider the use of a pro-Vui1ding stacked-wafer modules using hand methods. duct unless it is backed up by one or two otherthis is based on an $82,000 capital investment for suppliers, so too, a large co.mmercial company musta 400-module-per-hour hand process facility. The operate. A TV manufacturer cannot put itself athead Carney report further indicates a 44% saving the mercy of one supplier's strikes, floods orwhen using the machine process. This percentage fires. Aerovox is currently working on conversionwas based on a $665,000 capital investment for a of both commercial and Military designs to modular405-module-per-hour machine process facility. Al- construction.though the capital investment for machine assemblyis 8 times that for hand operation, the report Automation by Programmed Insertion Systems,points out that the difference in investment would Usin One Or A Relatively Few Headsbe repaid by manufacturing cost savings within less For Low-Volume Assemblythan one-year-and-five-months of operation at full.capacity. Typical of the "Batch method", General Elec-

tric' s Automatic Component Assembly System was de-In the writer's opinion, the advantage for the *signed under contract to the Signal Corps. This

machine process would be at least twice as specta- ystem is based upon the principle where "batches"cular if it had been feasible to improve the pro- of 20 boards are each "circulated" to an insertioncesses before going into pilot-plant operation and head to pick up the first pa't before the secondcost determination. This opinion is based partly part is made available for intsertion. The entireupon a knowledge of the history of process devel- pperation is programmed on punched cards, and isopment generally, partly upon a study of the ap- completely automatic through the following cycle:pendices of the report, and partly upon independent component part selection, insertion and clinching;reports prepared by Communication Measurements printed wiring board loading, pallet recirculating,Laboratory. The Mead Carney report shows hand- and sub-assembly testing. The system is adaptableprocess vs. machine-process "break-even" points, to any size of printed wiring board or configuration.from 30,000 pieces up. All of these "break-even"points will be brought down as machine and pro- During 1955, GE combined the various automaticcesses are improved, machine-components and tested them as a system.

In January of this year, the entire system wasIn March 1955, we stated that there was no transported to GE's Light Military Electronic Dept.

conflict between modular stacked-wafer design and at Utica and is now undergoing a pilot run type ofautomatic insertion of standard component parts. shake down, under contract with the Signal Corps,Also, to meet military requirements, we needed at to get the "bugs"' out of it. It will be rememberedleast three suppliers of modules, and at least that it was this same Department, which in 1953 andthree suppliers of insertion machines - each with 1954 conducted the surveys that gave a lot-size ofreal resources for mass production. Over a year 100 to 200 as the predominant lot size on militaryago, one of the major needs was satisfied as the development contracts.Aerovox Corporation took over the operation of theNBS Arlington facility, retained key Kaiser-Willys Melpar' s "Mini-Mech" might be classified underpersonnel, and entered the modul1e business in the "Batch method", although each printed wiringearnest. board is completely inserted before another one is

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moved in place. Discussed 3m our original status sently being built as a flexible individual head,report, "Mini-Meoh" was developed under contract transfer devices have been added by users. Pro-with the Ebreau of Ships. Since 1955, Melpar has gramming by punched tape, and other improvementsdeveloped a larger and more flexible machine, which have also been planned. This is a very interestingwill handle boards 2" x 2", 2" x 4", 2" x 6", development, and its potentialities in the futurebn x VIP 4" x 6", and 6" x 6". of automation-for-electronics should not be over-

looked.Melpar and GE may soon have company if, as

rumored, Sperry Rand decides to tape-control the Machine Wrapping of Solderless ConnectionsMinn-A-Matic machine, and if IBM decides to builda six-head programmed insertion machine. Mr. R. F. Mallina has reported on the Bell

Telephone development of a punched-tape-controlledSemiautomatic Single Comnonent-Part Insertion machine that automatically wires complex electrical

Machines For Low-Volume Assembly circuits by means of a six-turn 29,000-psi "solder-less wrapped connection". Called the M-4, it may

Machines of this type, designed by United be coupled to several other machines, all controll-Shoe and General Mills have been treated earlier. ed from a single master tape and centralized com-

puter. 10,000 connections are made per hour. ItTo these semi-automatic machines we need to has been used by Western EleOtric at Kearny, New

add a relative newcomer. A year ago, the Minnesota Jersey for several years and by three leading TVEngineering Co. contributed to automation by intro- manufacturers, making 300,000,000 wrapped conmec-ducing their "Minn-A-matio" head. More recently tions without a single reject. Clevite-Brush De-this development has been taken over by Remington velbpment Company, of Cleveland, and Keller ToolRand Univac (see Figure 9). The principal feature Div. of Gardner-Denver, Grand-Haven, Michigan, areof this machine is its ability to eliminate pre- both working on the machine's commercial developnent.punching of holes in printed-wiring boards.

Automatic EtchiWiMachinesFor Prin Wiring

In 1955, it was anounced that Master EtchingMachine Company was designing an automatic etchingm*achine that could operate 5-in-tandem to supplyan in-line automatic assemobly machine. Such almodel is now available. Since that timee, severalother makes and models have appeared, designed byAstinghouse, 1.C.A., Printed Electronics, G.E.,

and others discussed herei da.

Printed Electronics, Natick, Maccachusettnhas marketed the "Protomaker" which is portable,self contained, and makes prototypes in 30 to perminutes. Ideal for model shops, it applies photoresist, dries, sensitizes, develops and rinses.It also can clean by reverse-current, and solderplate.

At G.e.'s Electronic ComponentPlanat, "printedFig. 9 - "Ninn-a-matice single compo- wiring" is plated on the boards and "plated through"

nent part insertion machines . the holes in a 75-foot long automatic plating tank.When installed, a capacity of 5 million boardu per

This is accomplishad by preceding component-part year was anticipated.insertion with a drilling operation. Low cost0.020n to 0.060" drills are used. For short-ru General Research and Supply are marketing theircommercial applications it brings about a cost "Series "B" Decorator Press" for silk screen print-saving, and for military applications it makes the ing of heavy deposits of plating and acid resists,use of glass laminated epoxy more practicable, for printed wiring mass proction. A precisionThe macrine drils, inserts, and clinches component register allows work to belbd from front or rearparts from a miniature diode to a 1 MFD axial-lead for in-line operation with their "Thermo Jet Dryera.capacitor. Boards are run through the machinevertically, with the drining and insertion opera- Automatic Soldering Machinestions performed from opposite sides. Lead lengthsand angles are adjustable. The present design In addition to the fully automatic dip-solder.accepts printed wiring boards from 1" x 1" to 12" ing machines mentioned previously, several semi-x 17" and up to 1/h" thick. Required bench space automatic soldering machines are now available.is 22" deep x 30" wide by 36" high. One machinehas been delivered and six others will soon be Electronics Product's dip-soldering machine iscompleted in a pilot run. "Minn-A-Matic" is not capable of turning out 180 boards per hour even inclearly an in-line or a programmed device. Pre- the hands of an unskilled operator. The machine

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automatically dips the board and removes it afterthe elapsed preset dwell time.

General Mills "Autofab" soldering machineswill handle boards up to 10 x 10 inches at a nor-mal operating cycle of 7-1/2 seconds. The machineis automatic after manual feed. Using forced selec-tive soldering, dwell time is held to +1/5 second.

Convair-Pomona is reported to bu developing anautomatic dip-soldering machine built as a five-station in-line transfer unit.

Other Supporting. NIEchines

Weiderman is marketing turrent punch pressesfrom small1 hand operated types to the 150- tonmodel. RCA has announced a production-engineeredmodel (see Figure 10). Double size patterns aretransferred to the master tape (see Figure 11) froma photomaster of the printed wiring board. Strom-berg-Carlson has introduced a "Template-GuidedPunch" that punches holes in a printed wiring board Fig. 11 - RCAts punch, covers removed.at 120 per minute and with provision for Flexowriterautomatic control. Wales-Strippit, North Tonawandb,N. Y. is marketing a combination pantograph (the"Positive Duplicator") and punch (the "Fabricator").A locator carriage on ball bearings moves the workpiece under the punching mechanism as a template isfollowed by hand. An electrically operated air-cylinder is automatically actuated as the locatorpin is depressed into the templet aperture.

Hermes Engraving Machine, University Place,N. Y,is selling a pantograph with a pneumaticattachment. Over 100 drilled holes per minute ina printed wiring board can be attained. The com-plete boards can be drilled without changing tools.This is possible because a routing cutter drillsthe small holes and routes the larger holes bytracing various sized engraved circles on the tem-plate. DuMont has developed a template-guided"Pantodrill" that can drill 75 holes/min.(Figure 12).

th Fig. 12-eDuMont' s semi-automatic drillingmachine.

RCA has also designed an automatic shear forprinted wiring boards. Little squares etched onthe board are used as "tooling targets" to actuate"sensing fingers". The fingers actuate servo mo-tors to correct positioning errors. The machinewill handle 18-lA x 18-l/l inch multiple patternboards. A prototype is currently being used inRCA's own operation. By the first of the year, animproved model will be available, at which timeRCA will decide whether or not they will marketthe device.

IRC, Allen-Bradley and United Shoe each havetheir own version of a component-part beltingmachine.

Malco's "Automatic Pin and Contact InsertingMachine", Design Tool's automatic "Lead Bender",SFig. 10- RCA's programmed punching machine. Bruno-New York Industries' "Pig-Tailer" and"Snain

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Pin" tools. Rapistan's "Conveyorized Storage Sys- C. Current judgement is being passed upontern", and Federal's "Elevating Hopper Feed", all the various automation concepts, baseddeserve honorable mention. almost entirely upon development effortand similated pilot-run production, as

In the aircraft industry, Martin-Baltimore is the only available yardsticks. And, al-making strides in the application of automation to though not the final criteria for adop-military electronic equipment and guided missiles. ,tion at the fully mechanized phase, adap-Nearly aLl projects have used printed wiring in one tability to manual, semi-automaticphase or another. Several pieces of equipment such assembly, and short-run production is anas the DuMont "Pantodrill" have been purchased or important factor in determining early pop-are on order. Many stacked-wafer units are under ularity of a particular automation philos-development, and studies are being made of all types ophy. This may not be a healthy long-of automation- sytems. range condition,

Automatic Testing Equipment D. The completely automatic factory with aprogrammed inventory is slow in taking

Many companies have done considerable work on shape. This is probably because the elec-the automatic testing of completed assemblies. A tronics industry is not accustomed tofew will be mentioned. making large capital expenditures. Perhapi

our managers and planners should look toThe first that comes to our mind is the tester the automobile and prpcess industries. for

designed by Communications Measurements Laboratory assurance and information.for the original NBS "Tinkertoy" facility. ColorTelevision's Robotester" is a completely tape- Concluding Remarksprogrammed automatic tester, capable of making57,000 possible measurements at 240 test points, We have been discussing automation-for-elec.and at 120 measurements per minute. Originally tronics in terms of five basic types; which, asdesigned by Lavoie Laboratories, it promises to stated previously, are nicknamed te "Detroit methelp break a present serious bottleneck. General hod" the "Simultaneous method", the "ProcessElectric - Utica carried on an independent parallel method", the "Batch method", and the "Individualdevelopment, which has been shelved in favor of the method".Robotester. A Flexowriter programmed peformancetester is in use, which in S to 10 minutes records Now in conclusion, let me present the most-values on a Clary printer. Automatic Testers are needed immediate improvements as applied to auto-also in use at Westinghouse and RCA, matic insertion methods, as I see them:

Del-Mco has a Model 80 tester, replacing Model FIRST. Component-part "automation packages" are200, having a capacity of 80 circuits, which can in need of standardization. United Shoe andbe tested in 8 seconds. A matrix indicator ponel RCA presently favor lead-taped belting foriaxial-indicates faults. RCA is using an Automatic audicx lead component parts. Admiral is using a combina-pmplifier circuit tester of their own design. It tion of body taping and expendable tubular sleeves,has a programmed test cycle and will soon be ex- Allen-Brad:Ley and Sylvania prefer body-taped belt-panded in scope. IRC has developed an automatic ing. Erie (with their Pallet Pak),and one or twocomponent-parts tester for use on a large scale, others like component parts mounted on cardboardA transport mechanism is included. IBM, Endicott. strips with indexing holes. General Mills usesNew York, achieves a testing rate of 50 per minute random-packaged resistors, and runs them through aon printed wiring assembles, using a punched-card lead-preparation machine into a metal magazine,programming technious at 50 pairs of cards per IRC favors a standard cardboard carton type ofminute. Automation Pac. All such variationd cause a con-fusion which must be eliminated,Tn spite of all this, little has actuallybeen accomplished when the potentialities of auto-mation are considered from an industrial prepared- SECOND. Servo-positioning of multiple-head in.-iess8 point of view. There are four areas where sertion systems, and. ultimately complete programm-progress has been extremly sow: ing, is needed. This effort would combine the speedand.production capabilities of the in-line "Detroit

A. Everybody is talking "standardization" systems", with the flexibility of the "Batchpreferred circuits, modular hole dimen- systems".sions, modular ja ckaging dimensions (CMI,etc.) - but, like the weather, relative], THIRD. Development of automatic clamping andlittle is being done about it. Standardi- mounting techniques for large component parts issation is the heirt of automation, also needed. This point ws emphsized in Mach

1955, when it was stated that (in the aircraft in-B. It is the writer's belief that fre too dustry) "the automation engineer must concentratelittle effort and capital has been put his attention on heat and vibration--two majorbehind stacked-wafer modules. In my problems created by increasing speed."opinion, each large industrial area shouLdhave suchia ?acility. All electronic and On1ce these three improvemnents have been real-economic predictions point to such a need~ ized, I predict that the acceptance and application

37

of automation-for-electronics will mushroom beyond FINAL REPORT - PART 2, SIGNAL CORPS PROJECTthe wildest dreams of a modern Jules Verne NO. 32-2006C, (Indianapolis, P.t Mallor &

Company, June 1952 - September 1954).Bibliography

Autration-for-Nlectronics 82.# "Principles and Techniques of Integration andPackaging of Printed Circuit Assemblies for

1. "Guided Missile Reliability and Electronic Missile Applications". FIRST QUARTERLY PRO-Thru Production Techniques", delivered.at the 1955 GRESS REPORT, SIGNAL CORPS PROJECT-NO. 2006A73. IRE National Convention, New York, March 21- (Indianapolis, P-.R. Mallory & Companyr, July -

24, 1955; CoNv. RECoRD, I.R.E., PART 6, vol. September 1954).3, 1955, pp. 79-91 (This paper contains thefirst part of the present Biblography). 82.1 Ibid.,(SECOND QUARTERLY PROGRESS REPORT)

October - December 195474.# "A Study to Guide Ordnance Designs to Meet

New Horizons for Electronic Assembly," NAV 82.2 Ibid., (THIRD QUARTERLY PROGRESS REPORT)ORD REPORT 5143, (Stavid Engineering, Inc., January - March 1955Plainfields New Jersey)

83.# "Project Tinkertoy", NBS TECHNICAL NEWS75.# "Study to Guide Ordnance Designs to Meet New BULLETIN, Vol. 37, No. ll(U.S. Govt. Print-

Horizons for Electronic Assembly," P. B. ing Office, Washington, D.C., November111997 STAVID ENGINEERING, INC. Sept. 1955, 1953).54 pp. $1.50 (This is an Office of TechnicalServices, U.S. Dept of Com. reprint of the 84.# "Interim Report", Phase 1, STANFORD RESEARCHabove reference). INSTITUTE PROJECT NO. 413, AF Contract No.

AF33-(038)-18976, November 1951.76.J "Automatic Component Assembly System", CHOICE

OF AUTOPATIC SYSTEM FOR PLACING COFPONENTS 85.# "Final Report" STANFORD RESEARCH INSTITUTEON PRINTED WIRING BOARDS, SPECIAL REPORT, PROJECT NO. 413j, AF Contract No. AF33-(038)-SIGNAL CORPS CONTRACT NO. DA-36-039-SC-30250 18976 February 1956.(Ithaca, G.E. Advanced ElectronicsCenter). 86.# E. R. Gamson, F. M. Hom, R. F. Newtons "De-

velopment and Application of Automatic77.4 Automatic Component Assembly System", INTERIM Assembly Techniques for Miniturized Elec-

ENGINEERING REPORT NO. 1, PHASE 1, (Syracuses tronic Equipment", INTERIM. ENGINEERING REPORTSGeneral Electric, Electronics iv.ision July 1-9, PHAES II-V, SRl PROJECT 597, AIR FO1952 - January 1953) SIGNAL CORPS CONT1RACT CONTRACT NO. AF 18-(600)-141 (CaliforniaNO. DA-36-039-sc-30250 Stanford Research Institute, 1952 - 19545.

77.1 Ibid., (INTERIM ENGINEERNG REPORT NO. 2 87. "Automatic Assemibly of Electronic Equipment",PHASE 1, January - July 1953) ELECTRICAL MANUFACTURING, July 1953, p. 97.

78.# "Automatic Component Assembly System"', 88. "Automatic Production of Modular ElectronicQUARTERLY ENGINEERING REPORT NO. 3, SIGNAL Subassemiblies", ELECTRICAL MANUFRACTURINGCORPS CONTRACT NO. DA- 039-sc-3o 250 (Ithaca, November 1953, p. 156.G.E. Advanced Electronics Center, January -April 1954).* 89. 5. J.* Begun, Felix Rosenthal, "Production of

Electronic Circuits , by Mechanized Wiring",78.1 Ibid., (QUARTERLY ENGINEERING REPORT NO. 6) P.R.S.A., *** pp. 75 - 85.

October 1954 - January 195590. Lyle J. Biskner, "Dip-Soldering by Machine"

78.2 Ibid., (QUARTERLY ENGINEERING REPORT NO. 7) ELECTRONIC EQUIPMENT, April 1956; 2 pages.January - April 1955

91. F. M. Booth, "Automatic Testing of Components"78.3 Ibid., (QUARTERLY ENG11EERING REPORT NO. 8) PROCEEDINGS, 1956 ELECTRONIC COMXPONENTS- April - July 1955 .SYMPOSIUM1, Washington, D,C., (Engineering

Publishers, New Tork, May 1956, pp. 106-113).79.# "Automation", INTERIM STATUS REPORT CONTRACT

NOrd 14843, Stavid Engineering, Inc., 92. Cledo Brunetti, George Kwasniewski, "A Sys-Plainfield, New Jersey, November 19, 1954. tem for Automatic Production of Electronic

- ~~~~~~~~~~~Assemiblies", P.R.S.A., *"* pp. 2 - 7.8O.# "Development of Principles and Techniques of

Intergration and Packaging of Printed Circuit 93. Carl F. Carlzen, "Sylvrania Automatic Assemibl;yAssemblies", FINAL REPORT - PART 1, SIGNAL Equisment and Its Application tO a 5-TUbeCOR;PS PROJECT NO. 32-20060, (Indianapolis, AC/DC Radio Chassis",S PR-S-A- *"**P.R. Mallory & Company, JUne 1952 - Septemiber PP. 19-25.1954).

94. K;arl Clayton, "Prcision Camera Used in81.# "Design Guides for Circuit Packaging and Inoef Printed Circuit Production", ELECTRICAL MANU-

gration of Auto-SebNled ElectronisEquipment" FACTUiNG, July 1956, p. 136.

38

95. S. F. Danko, So J. Ianzalotti,"Auto-Sembly ments Publishing Company, 1955) (This is aof Miniature Military Equipment", ELECTRONICS, book reprint of reference 28)July 1951, pp. 94 - 98.

120, T. R. James, "Operator Convenience and Auto-96. M. L. Embree, D. E. Williams, "An Automatic matic Safeguards Applied to Automatic Elec-Card Punching Transistor Test Set", PROCEED- tronic Equipment", P.S.A.P.E.E.,* pp. 73-78.

ings, 1956 ELECTRONIC COMiPONENTS SYMPOSIUM,Washington, D.C*, (Engineering Publishers, 131. T. R. James, C. H. Bergsland, D. F. Melton,New York, May 1956; pp. 125 - 130). C. Brunetti, "A New Machine for AutomaticProduction of Electronic Assemblies",- CONV.

97. E. R. Gamson, F. M. Hom, L. K. Lee, RECORD, I.R.E., PART 9, pp. 29 - 32, 1955.R. F, Newton, "An Approach to Automatic Pro-duction of Electronic Equipmentl"SP.S.A.P.FE.*' 112. S. C. Kolanowski, S. W. Jucius, W. Flower,pp. 30 35. "Mechanical Assembly of Electronic Compon-

ents", P.S.A.P.E.E.,* pp. 41 49.98. J. J. Graham, "Problems of Mechanization of

Printed Circuits", P.SJ-.C. ** pp. 109-110. 113. A. A. Lawson, "Automatic Assembly of Elec-tronic Circuit Modules", RADIO AND TELE-

99. Alfred R. Gray, "Current Status of Electronic VISION TRENDS, vol. 2, no. 1, Jantary -Production Machines", A paper delivered at March 1956.the I.R.E., Automation Symposium, Washington,D.C. October 10, 1955. 14. A. Arnold Lawson, "Project Minn-Mechs,

P.S.A.P.E.E.*, pp. 79 - 87.100. Alfred At. Gray, "Guided Missile Reliability

and Electronic Production Techniques", CONV. 115. A. A, lawson, P. R* Ritts H. K. Hazel, "ARECORDP, I.R,E., PART 6, vol. 3, 1955, New Automation Technique for Solderingpp. 79 - 91. CbPnents to Foil-Wire Boards", CONV.

RECORD, I.R.E., PART 6, pp, 111-114;101. W. H. Hannahs, "Development of Systems of 1956.

Mechanized Assembly, "TRANS. I.R.E. PGPT-1,September 1956, pp. 23 - 33. 116. L. K. Lee, "Automatic Production of Elec-

tronic Equipment", CONV. RECORD, I.R.E.,102. Joseph Harrington Jr., "Obtaining Reliability PANT 4s. 1955; pp. 60 - 61.

and Versatility in High Production Mechan-ized Assembly Equipment", P.H.S.A.. *"* 117. Lawrence P. Lessing, "Automatic Manufacturepp. 11 -18. of Electronics Equipment", SCIENTIFIC

AMERICAN, vol. 193, no. 2, August 1955;103. Walter Hausz, "One More Step", TRANS. I.R.E. pp. 29 - 33*

PGPT-1, September 1956; pp. 8 - 10.3118. R. F. Mallina, "Solderless Wrapped Connec-104. R. L. Henry, "Project Tinkertoy", TRANS. tions, PART 1, Structure and Tools" BELL

I.R.E. PGPT-l, September 1956; pp. 11. SYSTEM TECHNICAL JOURNAL, vol. 32; May1953.

105. Freeman M. Hom, "Development and Applicationof Automatic Assembly Techniques for Minia- 119. R. F. Mallinas "Solderless Wrapped Connec_turized Electronic Equipment" (includes tions", TRANS. I.R.E. PGPT-l, Septemberabstract of "WADC Technical lieport 55-230"), 1956; pp. 12 - 22.TRANS. I.R.E. PGPT-1, September 1956;P. 7. 120. W. P. Mason, 0. L. Arierson, "Stress Sys-

tems in the Solderless Wrapped Connection106.# Freeman M. Hom, Low K. Lee, Edward R. Gamson, and Their PerforvAnce", BELL SYSTE TECH-Raymond F. Newton, "Development and Appli- NICAL J.OURNAL, vol. 33, September 1954.cation of Automatic Assembly Techniques forMiniaturized Electronic Equipment, "WADO 121. 'Mechanized Production of Electronic Equip-TECHNICAL REPORT 55-230, (Dayton, Wright Air ment" (24 Page Special Report on latestDevelopment Center, may 1955). Techniques), ELECTRONICS, pp. 138 - 160;

September 1955.107. James E. Huggins, Jr. "Mechanized Assemblyof Electronic Componentsl", P.S.A.I.E.E.,* 122. Ray E. Morriss "Roll and Dip Soldering forpp. 63 - 67* Printed Circuitry", AVIATION AGE, March

1956; 2 pages.108. Frank B. Iles, "Mechanization of ElectronicEquipment", COINV. RECORD, I.R.E., PANT 6, 123, "New Developments in Automatic Productionpp. 47 - 49; 1955* for Electronics", (A status report) EIEC-

TRICAL MANUFACTURING, pp. 126 - 131;109. S. A. June, J. D. Bardis, L. H. Lurio, April 1955.L. S. Polaner, 0. Sagedahl, H. A. Sklenar,*B. K. Yenkin, "The Automatic Factory a 124. H. B3. Parker, "Motion Picture Display ofcritical exaination", (Pittsburgh, Instra- Project Tirikertoy", P.S.A.P.E.E.*, p. 101.

39

125. D. F. Pennies "Minn.-4atic', A Machine For 143. E. Finley Carter, "Cost Considerations inShort Run Production, P.R.S.A.,s* Automatic Production", CONV. RECORD, I.R.E.,pp. 66 - 70. PART 6, pp. 92 - 95; 1956.

126. Robert J. Romans,"Automation and the Sub- 144. Charles D. Cox, "Control Planning andminiature System", P.R.S.A., *** pp. 86-92. Methods", P.S.A.P.E.E.,* pp. 88 - 91.

127. itobert J. Roman, "Paraplate Electronic 145- John Diebold, "The Impact of AutomaticAssembly System", EIECTRICAL MANUFACTURING, Control on Industry", P.S.A.P.E.E.,*April 1956, pp. 143 - 144. pp. 10 - 12.

128. J. A. Sargrove, "New Methods of Radio Pro- 146. "The Future of Automation", (Panel Dis-duction, JOURNAL OF THE BRITISH INSTITUTION cussion) W. R. G. Baker, Chaixnan; MajorOF RADIO ENGINEERS, 1, No. 1, 2-33, 1947. General James D. O'Connell, James Bright,

Seymour Shezmanj, and John Diebold.129. "Tape Controlled Conveyor", (A staff article),

EIECTRONIC EQUIPNENT, June 1956. 147 V. M. Graham,, "Design '56 -- AutomaticAssembly", (Guest Editorial) EIECTRONIC

130. H. H. VanHorn, "Solderless Wrapped Connec- DESIGN, p. 17; January 1, 1956.tions, Part 3, Evaluation and PerformanceTests", BELL SYSTEM TECHNICAL JOURNAL, 318. Joseph Harrington, Jr., "The Economics ofVol. 32, May 1953. Automatic Production Equipment From the

Miachine Designer's Point of View",131. D. I3. Ward, Jr., "Automatic Testing of Print- P.S.A.P.E.E.,* pp. 68 - 72.

ed Assemblies"s P.S.F.C., ** pp. l13 - 117.149. Dorman D. Israel, "Automation - Its Im-

132. Ben Warriner, George W. Gamble, "A Flexible pact Upon the Electronic Engineer", TRANS.Automatic Component Assembly System", CONV. I.R.E., vol. BTR-l, no. 4, October 1955.RECORD, I.R.E., PART 6, pp. 26 - 20; 1955.

150. M. R. Johnson, "Printed Wiring - A Chall-133. Charles Wellard, "Automatic testing of Elec- enge to Management", P.S.P.C.,4* pp. 57-61,

tronic Components", ELECTRICAL MANUFACTURING,February 1956, pp. 132 - 135 151. A. A. Lawson, "The Economics of Automation

_- Some Important Considerations", TRANS.134. Howard F. Wilson, "300 Million Connections I.R.E. PGPT-.l, September 1956; pp.; 3437.

Without a Reject", ELECTRONIC EQUIPMNT,January, 1956; 2 pages. 152. Seymour Melman, "Industrial Productivity,

"SCIENTIC AMRICAN, vol. 193,, no. 1, July135. Albert Zack, Theodore Wroblewski, Wilson H. 1955, pp. 33-35.Hanrahs, "Automatic Production of AudioTransformers",. P.S.A.P.E.E.,* pp. 56 - 62. 153. Richard L. Meier, "The Economic and Social

Consequences of the Growth in the Appli-Automation -- Economic and Social cation of Automatic Controls", CONV. RE-

CORDS, I . ,PART 4,p 1955,9 pp. 62-63.136. "Automation" (A Staff Report) CONSUMER RE-

PORTS, October 1955, pp. 481 - 485. 154. "Panel Discussion, "Discussion Leader, Cledo

Br4netti., Panel hembers, Doxman D. Israel,137. W. R. G. Baker, "Automation", CONV. RECORD, Brnti Panel Members,D . Israel,I.R.E.,ART4,155, pp. 4 - 57.G. H. Kenda1ll, N. L. Harvey., L. P. Tuckerman,F. E., Wenger, John Diebold, F.S.A.P.E.E.,*

138. W. R. G. Baker, "Automastion As the Engi- pp. 102 - l19.neer Sees It", TRANS. I.R.E., PGAC-1., MFay 155. General E. W. Rawlings "USAF Gears Global1956, pp. 84.-.9. Logistics to Jet Age"l' AVIATION WEEK,

Novrember 14, 1955, pp. 24 - 41.139. Charles Blahnar, "MTanagement In Production

Engineering, TRANS. I.R.E., vol. EM-3, 156. Tom C. Rives, "Automation for Survival",no. 2, April 1956, pp. 33 - 35. P.S.A.P.E.E.,* pp. 6 - 9.

140. R. W. Bolz, "AutomationW" CONV. RECORD, 157. Henry P. Steier, "AF Will Need $1 BillionI.R.E., PART 4, 1955,.pp. 58 - 59. for Electronics in '57", AMERICAN AVIATION,

May 21, 1956, pp. 52 - 53*141. Gordan S. Brown, "Trends in Automatizationof.Proceedures and Processes in Business 158. R. L. Swiggert, "Design '56 - Printed Cir-and Industry", CONV. RECORD, I.H.E., PART cuits", (Guest Editorial) ELECTRONIC DESIGN,4, 1955; pp. 52 - 53. p. 18; January 1, 1956.

142. E. Finley Carter, "The Imxportance of Co-. 159. Douglas Watson, "Keys to Successful Manage-.ordination in a Co-operative Program", ment of the Automatic Factory", P.S.A.P.E.E.*,P.S.A.P.E.E., pp. 27 - 29. pp. 21-26.

40

160. "What Price Automaticity", ( an editorial) 176. "Glossary of Terms in the Fields of Com-EIECTRICAL MANUFACTURING, June 1955, p. 69. putors and Automation", COMPUTORS AND

AUTOMATION, Januar 1956, 17 pp.161. "Who Should Automate"', Discussions of Pre-

vious Topics, (7-letters), METAL - WORKING, 177. G. H. Goodman, "Component ConsiderationsAugust 1956, pp. 22-30. for Printed Wiring in Automation", P.S.P.C.

pp 8689162. '"Why Output Per Man Hour Must Go Up" ( a

staff feature) FACTORY MANAGEMENT AND MAIN- 178. -M. E. Goulder, "Results of E'nvironmentalTENANCE, ol. 104, no. 8 August 1946 and Operational Service Tests on MDE Equip-pp. 82-87. mentl, P.S.P.C. **, pp. 37-41.

Design for Automation and Printed Wiring 179. J. J. Graham, "Standards for Automation",CONV. RECORD, I.R.E., PART 6, pp. 45-46,

163. Sherman G. Bassler, Myron Hinebaugh, 1955*- 'Principles of Circuit Packaging for

Auto-Senbly," CONV. RECORD, I.R.E., 1804 Wilson H. Hannahs, J. A. Caffiaux, "Auto--PARTt6, pp. 31 - 44; 19%. matic Assembly Techniques for Miniaturized

Transformer Coupled Circuits"l, AF TECHNICAI164. Robert-vE. cBauer, "Modular Construction - EPORT No. 6628, (Sylvania Electric Pro-

Its Implications to the Design Engineer," ducts, Inc.CONV . -RSECORD, TI.R .E., PART 6, 104-31109 1956i

181. Harlan R. Hanson, "Applying Tape Resistors165. Harold J. Benzuly, "A Precision Deflection in Design", ELECTRONIC DESIGN, March 15,

Yoke," CONyV. RECORDI, I.R.E., PART 3i, 1956, pp. 40-43*pp,. 165-170; 1956. 182. J. D. Heibels James H. Foster, "Automation

166. Daniel Blitz, "Three Dimensional Printed from the Component Manufacturer's View-Circuits Constru,tion," P.S.P.C.**, point", P.R.S.A.***, pp. 106-109.pp. 106-1089

183. -Donald G. Heitert, "Low-Cost Process for167. Robert C. Calcut, Charles A. Artzs "Engi- Printed-Wiring Art Work", EIECTRICAL MANU-

neering of Printed Circuits to Facilitate FACTURING, February 1956, pp. 129-131.Production, " CONV. RECORD, I.R.E., PAN 6,

pp. 90_94;1956. 184. 1;.~~-S Hubelbarilc "Sources of Standards"l ICpTRONIC DESIGN, February 15, 1956, 3 pp.

168. Hamilton Chisholm, "A Transistorized Events-Per-Unit-Time Meter," CONV. E:CORD, I.R.E., 1$. A. R. Hughes, "Review of Products Incorpo-PANT 5, pp. 19-25; 1956. rating Printed Circuit Construction", P.S.

P.C.4'*, pp. 32-36.169. F. C. Collings, F. B. Iles, "A Look Into

the Futue of Automatic Production of Elec- 186. F. YB. Iles, "Standards Required for Auto-tronic Equipment," P.S.A.P.E.E.*, pp. 36-40. nation", P.S.P.C.'*, pp. 111-112.

170. F. C. Collig, -K. hesdoeffer, "A Function- l87. "IRE Standards on Terminology for Feedbackal ApproachttoAAutomatic Systems and Stan- Control "Systems",. PROC. IRE., Jan. 1956,dardization," PiR.S.A*** pp. 71-741. 3 PP.

171. Milton H. Crothers,l "Desiging a Self-biased 188. 14. H. Johnson, "Redesign.for Automatic Pro-Video Amplifier for Printed Circuit Techni- duction of Electronic Equipment", P.R.S.A.ques" EIECTRONIC DESIGNQY.Dec. 1955, i"* pp. 93-98.pp. 54-55.

189. Louis Kahn, "Design and Manufacture or.172. Renato DeCcJ.a, George Harrington, "An Engi- Autonation Components", P.R,S;.A.**,

neering Approach to Printed Circuitry and pp. 8-10.Automation" , CONV. RECORD, I.R.E., PANT 6,pp. 50-53; 1955. 190. W. H. Klippel, E. Jo Lorenz, "Artwork

Procedues in Printed Wiring", ELECTRICAL173. H. S. Dordicks "Principles of Circuit Design MANUFACTURING, January, 1956,

for Automation", CONV. RECORD, I.R.E., PANT pp. 96-101.6, pp. 94-103, 1956.

191. A. Linden, '7 Design Tips for Printed Cir-174. "Circuit Design for Automation", (an ab- cuit Layout", ELECTRONIC DESIGN, April 15,

stract of the above reference) ELECTRICAL 1956, 4 pp.DESIGN NEWS, July, 1956; pp. 100-101.

192. R. B. Lyn, "Philosophy of Component Design175. R. A. Gerhold, S. F. Danko, "Signal Corps and Packcaging for Mechanized Assemblyr of

Component Program for Automation", P.R.S.A. Printed Wiring Boards", P.R.S.A.***, pp. 130***, pp. 99-105. 11)4.

141

193. John 1. X. Mannixi, "Quality-Type Components 209. W. W. Snyder, "Subminiature Decade Counter"',for Frinted Wiring", ELECTRICAL MANUFACTU- RADIO T.V. NEWS (Electronics Edition)RING, October 1955; pp. 126-131. July 1949.

L94. A. F. Maynards "Production Design of an 210. F. M. Staudaher, "Results of Military En-Airborne Indicator Unit Using Printed Wirirg, vironmental Tests of Equipment Using PrintedP.S.P.C."*, pp. .29-31. Wiring Assemblies"s, P.S.P.C.**, pp. 42444.

195. "Mviniaturized Amplifier Designed for Auto- 211. A. Steinkamp, NAccessible Modular Construc-matic Assembly", ELECTRICAL MANUFACTURING, tion"A, ELECTRDNIC DESIGN, April 1956, 2 pp.August 19510 p. 88.

212. Irving Strauss, "Speed Equipment Assemblyl,196. A. V. Nichol, "Consideration of Conversio'r EIECTRONIC EQUIPMENT, October 1955; 2 pp.

of AC-DC Receiver to Printed Circuit Design'sP.S.P.C.e* pp. 8-12. 213. Robert L. Swiggert, "Printed Circuit Switdm

and Commutators", P.S.P.C.**, pp. 79-83.197. A. M. Okun, "The User Looks at the Componert

Parts Problem", TRANS. I.R.E., PGCP-2, 214. S. K. Tally, H. W. Lalmond, "Resistors andpp. 58-71; September 1954. Mylar Capacitors for Printed Circuits",

P.S.P.C.**, pp. 74-78.198. Xichard Jo O'Neill, "Electronic Design for

a Digital Computer", CONV, RECORD, I.f.E. 215. Robert C. White, "Design for Automatlpn",PART 6, pp. 18-25; 1955. ELECTRONIC DESIGN, May 1955, pp. 24-27.

199. Robert N. Palmer, "A Receiving Tube Mount 216. D. E. Yost, "Silver Migration in PrintedDesigned for Automatic Asseibly", P.S.A.P. Circuits", P.S.P.C.**, pp. 53-56.E.E.*, pp. 50-55.

217. Frank Zagar, "Drilling Printed Wiring Boarcg200. Donald F. Pennie, "Components for Printed ELECTRICAL MANUFACTURING, April 1956,

Wiring and Component Fackaging for Auto- p.144.mated Assembly", P.S.P.C.*N, pp. 84-85.

PrintedWin.01. "Preferred Circuits Manual", NBS REPORT 3498

National Bureau of Standards, Washington, 218. D. W. Cottle, "Statup of Printed CircuitD. C., Aug. 1, 1954. Standardization", P.S.P.C.**, pp. 62-64.

201.1 "Application Notes", Ibid 219. S. F. Danko, R. A. Gerhold, "Printed Cifcub.ry for Transistors", PROC. I.H.E, TRANSISTOR

202. "Preferred Circuits Manual, Navy Aeronauti- ISSUE, Vol. 40 No. U, November 1952.cal Electronic Equipment", GOVERNMENTPRINTING OFF?ICE, Washington, D. C. 220. E. R. Gamsons A. Henesian, "Preparation of1956. Standards and Test Procedures for Printed

Circuits", CONV. RECORD, I.R.E., PARZ> 6,203. "Preferred Circuits", (an abstract from the pp. 172-193; 1956.

above reference) ELECTRONIC DESIGN, Febru-ary 1, 1556; pp. 20-23. 221. R. A. Gerhold, "Techniques of Producing

Printed Wiring Boards" (Panel Discussion)t?04. J. F. Reeves, R. S. Shultz, "Recent Progreas R. L. Swiggert, "Etched Wiring"; N. Codas

in the Development of Standard Functional "Embossed Wiring"; A. Lederman, "StampedDivisio-ns for Electronic Equipment", PRO- Wiring"; L. Kahn, !'Pressed Powder Wiring";CEEDING, 1956 EIECTRONIC COMPONENT SYMPOSIUI, A. S. Khouri, "Painted Wiring"; R. A. CurranWashington, D. C., (Engineering Publishers, PlatedWiring"; P.S.P.C.**, pp. 65-73.N. Y., May, 1956; pp. 227-232.)

222. W. H. Hannahs, "Review of Special Clad-205. R. J. Roman, "A Subminiature Printed Circuit Naterials for Printed Circuits't, P.S.P.C.O*

System", (Production Phase) P.S.P.C.41*, pp. 94-98.pp. 99-105.

223. W. Hannahs, "Special Clad Laminates for206. R. J. Roman, "A Subminature Printed Cir- Printed Circuits", TELE-T7ECH, 3pp; Decembr

cuit System", (Design Phase) P.S.P.C.**, 1955.pp. 23-28.

224¢. J. P. Heywood, "Quality Control of Printed207. Linus Ruth, "A Printed Circuit IF Amplifier Circuit Manufacturing", P.S.P.C.**,

for Color TV", TRANS. I.R.E., Vol. BTX-2, pp. 118-122.No. 2, pp. 50-52; July 1956.

225. Ineulation for Flexible, Space-Saving Print-208. H. L. Shortt, "Printed Wiring Techniques ed Circuit Gable Designed to Resist Abuse",

-Increase Product Reliability", ELECTRONIC ( a staff article) INSULATION, January 1956,EQUIPMNT, January 1956, 3 pp. pp. 16-17.

42

e26. W. H. Klippel, E. J. Lorenz, "Materials and 240. Special Issue of 22 papers, delivered atDesign Factors in Printed Wiring Application- the 1954 Symposium on Microwave Strip Techni-Part I", EIECTRICAL MANUFACTURING, July 1956, ques, TRANS. I.R.E., Vol. lT-3, No. 2,pp. 62-69. March 1955.

226.1 Ibid. Part II, August 1956. Printed Circuits and Pro6ess Technology-

227. L. J. Martin, C. W. Meli, M. J. Vavza, 241. C. Brunetti, R. W. Curtis, "Printed Circuit"Factors Deteining the Reliability pf Techniques", PROC. I.R.E. 36, No. 1, 1948.Electrical Wiring", P.S.P.C.**, pp. 45-52.

242. H. Bzyan, "Printed Inductors and Capacitors",228. L. W. McGinnis, G. H. Mains, J. S. Tatnall, TEIE-TECH, 3 pp; December 1955.

"Cupric Oxidized Foil for Printed CircuitLaminates", CONV. RECORD I.R.E., PART 6, 243. P. Eisler, "Current Status and Recent Pro-pp. 121-125; 1956. gress of Printed Circuits in England", P.S.

P.C.**, pp. 13-22.229. A. E. MKiddleton, "Fiaterials in Advanced

Electronic Design", EIECTRICAL MANUFACTURING, 244. A. S. Khouri,'"Ceramic Based Printed CircuitdMay 1956; pp. 100-106. P.S.P.C.**, pp. 90-93.

230. S. W. Place, "An Up-to-Date Appraisal of 245. A. Khourip U. S. Patent No. 2, 493, 199,Iaminated Plastics for Printed Wiring" January 1950.INSULATION, April 1956, pp. 8-12.

246. "New Advances in Printed Circuits",* Mis-231. "Printed Circuits", (A Reprint of 14 articm) cellandous Pub. 192, National Bureau of

EIECTRICAL MANUFACTULING3, April 1946 to Standards, November 22, 1948.February 1954 (already referenced), (New 2York, GAGE PUBLISHING COMPANY, 1954.) 247. "Methods of Printing Electronic Circuits"

(An abstract of the above reference)232. F. A. Schwertz, E. 14. Van Wagner, "Printed PRODUCT ENGINEERING, August 1949, p. 140.

Circuits Via Xerography", CONV. RECORD, I.R.E., PART 6, pp. 115-120; 1956. 248. "Recent Advances in Electronic Process

Technology", NBS, TECHNICAL NEWS BULlETIN,Design for Mlicrostrip Vol. 39, No. 1, January 1955; pp. 8-10.

233.# M. Arditti, "Characteristics and Applicatioms 249. "A Self-Adhesive High Temperature Tapeof Microstrip for Microwave Wiring", a paper Riesistor", TECH. NEWS BULL, 3, 100, Julydelivered at the Symposium on Microwave 1951.Strip Circuits, Sponsored by A.F. CambridgeResearch Center, Air Research & Development 250.' "Precured NBS Tape Resistor,"TECH. NEWSCommand and Research Laboratory of Physical BULL., 36, 110, July 1952.Electronics, Oct. 11-12, 1954.

251. "An Adhesive Tape-Resistor Systeu",NBS Cir-234. Maurice Arditti, "Experimental Determinatian cular 503, Gov't. Printing Office,

of the Properties of Miicrostrip Components", 30 cents.EIECTRICAL COMMUNICATION, December 1953,pp. 283-293. 252. Alan Smith, Glenn Cooper, "Distributed Com-

ponents in Printed Circuits", PROCEEDINGS,235. Maurice Arditti, Jack Elefant, "Microstrip 1952 EIECTR0NIC COMPONENTS SYMPOSIUM, Wash-

Applied to Band-Pass Microwave Filters", ington, D. C., (Engineering Publishers, N.Y.,EIECTRICAL COMMUNICATIONS, March 1955, May 1956; pp. 212-218.)pp 52-61.

Design for Mtiniaturization236. S. B. Cohen, "Shielded Coupled-Strip Trans-mission Line", TRANS. I.R.E., Vol. MTT-3, 253. F. J. Davidson, "Applications and TechniquesNo. 5, pp. 29-38; October 1955. for Encapsulation with Epoxy Insulating

Resins"t, INSUlATION, January 1956, 1 p.237. B. A. Dahlman, "A Double-Ground-Plane Strip-Line System for Microwavest' TRANS. I.R.E., 254. R. H. Flack, J. 0. Mobley, "Potting GivesVol. MTT-3, No. 5, pp. 52-57; October Maximum Reliability", ELECTRONIC EQUIPMENT,1955. January 1956, 3 pp.

238. Oliver W. Fix, "A Balanced-Stripline Isola- 255. E. R. Gamson, A. Henesian, "Reliable Elec-tor", CONV. RECORD, I.R.E., PART 5, pp. 99- tronics Through Protective Coating Techni-105; 1956. ques", TRANS. I.R.E., PGCP-2, pp. 104 - 118;

September 1954.239. D. V. Geppert, R. H. Koontz, "TEN Mode Micro-

wave Filters", TELE-TECH & ELECTRONIC INI)US- 256. J. Hiensch, U.S. Patent No. 2, 244, 009TRIE;S, November 1955, pp. 72 June 1941.

43

257. Joseph C. Myrick,,"Sixteen Channel Time 261. Le U. C. Kelling, "Numerical Control ofDivision Multiplex System Employing Trans- Machine Tools", TRAINS. I.R.Eb, PGLE-2,istors and Magnetic Core Memory Circuits", March 1955; pp. 3 - 8.CONV. RECORDs I.R.E., PAEC 8, pp. 36 - 40;1956. 262. Gifford Kittredge, "Automatic Warehousing",

P.R.S.A., *** pp. 37 - 43.258. Edwin M. Stryker, Jr., "Miniaturization

Teehniques Utilized in a Multichannel Czy- 263. E. W. Leaver, "The Anatonmr of- Productionstal Controlled VHF Oscillatort' CONV. Automata", P.S.A.P.E.E.,* pp. 13 - 20.RECORDs, I.R.E., PART 8, pp. 3 - 7;1956. 264. J. A. Potter, "Factory Automation by Digita

Control"s P.R.S.A., *** pp. 28 - 31.Automation in Other Industries

p65. Alan H. Stillman, F. W. Cunningham, "Auto-259. Craig Andrewss "An Automated Ticket Reser- mation of Non-Circular Gear Cutting by

vation System",s P.R.S.A.,s.* pp. 32 - 36. Univac - 120, P.X.S.A., *"* ps 44 - 51.

260. Julius Y. Kaplans "Techniques For Adapting 266. "Trends in Machinery Electrification",Present Machine Tools For Automation", (Staff Report), ELECT:RICAL ?ANUFACTURING,P.S.A.P.E.E. * pp. 92 -100. November 1955, pp. ll3 - 124.

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