tures of any two or more of said phosphates, said phosphates in- cluding dispersed particles with a particle size that is not more than 5 km.

PUF##cIwBAllluvs U.S. Patent 6,214.180. Apr. 10, 2001 A.S. Lake et al., assignors to International Business Machines Corp., Armonk, N.Y.

A method for shorting pin grid array pins for plating.

ANoDlclucTllocoIT U.S. Patent 6,214,188. Apr. 10, 2001 T.S. December, assignor to BASF Corp., Southfield, Mich.

An anodic electrocoat having a carbamate-functional resin.

U.S. Patent 6,214,470. Apr. 10, 2001 C.L. Tazzia et al., assignors to BASF Corp., Southfield, Mich.

A method of coating a conductive substrate comprising providing an aqueous electrocoat coating

composition of an ionic resin func- tionality reactive with isocyanate and a compound comprising a plu- rality of allophanate groups.

PoLVEsnRcolllDIll connN6 U.S. Patent 6,214,898. Apr. 10, 2001 J.L.D. Barrio, assignor to Herberts GmbH, Wuppertal, Germany

A modified polyester resin/organic peroxide system for powder coat- ing, which is applicable to temper- ature-sensitive substrates and to metallic substrates.

EwlFmWrFonWwuHWWnW coAllN6 U.S. Patent 6,217,654. Apr. 17, 2001 F. Mauchle and H. Hiifler, assignors to ITW Gema AG, Schweiz, Switzerland

A spraying system including a de- vice to spray powder onto an ob- ject to be coated; an injector to pneumatically convey powder from a powder container to the spraying system; and a powder line connecting a powder outlet of

the injector to a powder intake of the spraying system.

AnAnMus~lwoolglw U.S. Patent 6,217,725. Apr. 17, 2001 E.S. Van Anglen et al., assignors to Electroplating Technologies Ltd., Northampton, Pa.

An improved arrangement for electrochemical processing of metal substrates comprising an electrolytic processing bath; means to support a plurality of electrodes of opposite polarity in the electrolytic processing bath, one being a workpiece for treat- ment and the other electrodes be- ing treatment electrodes; a resil- ient dielectric wiping means arranged for passage across the surface of at least one of the elec- trodes to remove gas bubbles as well as any thin face layer of elec- trolyte at the surface; the work- piece for treatment and the treat- ment electrodes being relative movable with respect to each oth- er; and wherein the workpiece for treatment is an elongated flexible

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April 2002 111

strip conducted past the remain- der of the electrodes and the resil- ient dielectric wiping means com- prises a portion of a laterally extended mesh of intersecting plastic wiper members.

_Mvlcl U.S. Patent 6,217,726. Apr. 17, 2001 TA. Lwincz and J.P. Parisi, assignors to Therm Corp. Inc., San Jose, Calif

An electropolisbing system for the interior surface of a tube compris- ing an electrolyte solution source; an adapter for coupling the elec- trolyte solution source to the tube; an electropolishing electrode; a cable coupled to the electropolish- ing electrode for drawing the elec- trode through the tube; and an electrolyte dam coupled to the electropolishing electrode for con- trolling the flow of electrolyte so- lution through the tube and to facilitate the escape of any evolved gases between the dam and interior surface of the tube.

-~ucMATus U.S. Patent 6,217,727. Apr. 17, 2001 S.E. Moore, assignor to Micron Technology Inc., Boise, Idaho

An apparatus for electroplating a semiconductor product compris- ing a device for supporting the semiconductor product in an elec- troplating solution; an electrical circuit for applying an electrical potential across the electroplating solution including an electrode; and a control device for changing the distance between the semi- conductor product and electrode after an initial amount of mate- rial is electroplated on the semi- conductor product.

BUCmWWllNeBuuwWAL CONTACTS U.S. Patent 6,217,734. Apr. 17, 2001 C.E. &oh, assignor to International Business Machines Corp., Armonk, N.Y.

An electrodeposition apparatus for depositing material on a sur- face of a substrate comprising at least one contact for laterally con-

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tatting the substrate and provid- ing electrical connection to the substrate, wherein the at least one contact does not obscure the surface of the substrate to be plated and wraps around at least a poition of the substrate; and a voltage source connected to the at least one contact.

~-eMY~?EnRous MATBmM.8 U.S. Patent 6,221&l. Apr. 24, 2001 F. Bisol et al., assigmrs to Soprin S.R.L., Treviso, Italy

A method of hot-galvanizing a fer- rous material comprising fluxing, drying, and galvanizing, wherein various metals are introduced in the form of their salts directly to the ferrous material during the fluxing step upstream of the gal- vanizing bath, wherein the metal salts are added in the following quantities: aluminum sulfate, 0.2 and 2 g/L; nickel sulfate, 0.2 and 2 g/L; and potassium chloride, 0.2 and 1 g/L.

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