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APIC Company Proprietary Ver 3.5
Introduction to APIC
September 2003
A P I C
APIC Company ProprietarySlide 2Ver 3.6 (Sept 2003)
Advanced Photonics Integrated Circuits CorporationAdvanced Photonics Integrated Circuits Corporation
•Founded in September 1999 Founded in September 1999 •Currently about 40 employees Currently about 40 employees •80% with advanced technical and 80% with advanced technical and
business degreesbusiness degrees•Two business locationsTwo business locations
• Honolulu (10,000 sq ft) - Headquarter & processing• Culver City (26,000 sq ft) - Design center & R&DCulver City (26,000 sq ft) - Design center & R&D
A P I C
APIC Company ProprietarySlide 3Ver 3.6 (Sept 2003)
APIC Culver City Building
A P I C
APIC Company ProprietarySlide 4Ver 3.6 (Sept 2003)
APIC Honolulu Building
A P I C
APIC Company ProprietarySlide 5Ver 3.6 (Sept 2003)
Technology and Product Areas
• HIP (Highly Integrated Phontonics) Chips
• “System-on-a-chip” - convergence of photonics and electronics on one chip
• Ultra-sensitive homeland defense sensors
• Multi-band translithic imager
A P I C
APIC Company ProprietarySlide 6Ver 3.6 (Sept 2003)
Value Proposition
• Reduce footprint
• Reduce customers’ parts count
• Reduce losses associated with pigtailing
• Reduce customers’ costs
Integrate active and passive photonic devices:
A P I C
APIC Company ProprietarySlide 7Ver 3.6 (Sept 2003)
BUSINESS AREASBUSINESS AREAS
• PIC components/optical modules for military and commercial markets
• Government Contracts
A P I C
APIC Company ProprietarySlide 8Ver 3.6 (Sept 2003)
Key Business Milestones
• Intel Capital Investment: May 2001
• ASML Development Agreement: July 2002
• Silicon Genesis Development Agreement: Sept 2002
• Intel Collaboration Agreement: October 2002
• Applied Material Etching Support Jan 2003
• 1st Military contract (Sub to Lockheed-Martin) March 2003
A P I C
APIC Company ProprietarySlide 9Ver 3.6 (Sept 2003)
Current Government Contracts
ID Award Date Customer
380575 3/13/2003 LMT
N00014-03-C-0342 4/11/2003 ONR
N00421-03-9-0002 7/11/2003 NAVAIR
Plus other smaller contracts for a total of $8.5M.
A P I C
APIC Company ProprietarySlide 10Ver 3.6 (Sept 2003)
SOI Fabricated Wafer
A P I C
APIC Company ProprietarySlide 11Ver 3.6 (Sept 2003)
EA-6B Jammer Application
A P I C
APIC Company ProprietarySlide 12Ver 3.6 (Sept 2003)
E-2C Radar Applications
APIC Company Proprietary Ver 3.5
1011000011101011110001
UAV Laser Communication
A P I C
APIC Company ProprietarySlide 14Ver 3.6 (Sept 2003)
Photoacoustic Effect
LaserIn
Pressure Wavesfrom laser absorption
Microphone PowerLaser S
A P I C
APIC Company ProprietarySlide 15Ver 3.6 (Sept 2003)
Photoacoustic System
LaserDetectionCell
PowerMeter
ComputerSignal Output
W0
Coated WindowLock-InAmplifier
Microphone
Gas SampleInlet
Gas Exit
r
Pump
ModulatedCurrent Driver
Modulated at natural resonant frequency of the cell =1
Sample is held for integration period 1 – 10 sec.
Anti-reflective coating
Each discrete wavelength is stepped through and any addition of spectrais done at each step before moving on. It takes 2-3 sec to scan laser rangedependent on actuator speed
l
A P I C
APIC Company ProprietarySlide 16Ver 3.6 (Sept 2003)
Chemical Agents--VX and GB
CO2 Range
A P I C
APIC Company ProprietarySlide 17Ver 3.6 (Sept 2003)
Carbon Nanotube Sensor
A P I C
APIC Company ProprietarySlide 18Ver 3.6 (Sept 2003)
TIVISIT : Multi-Band Imager
Back-side illuminated sensor(Thinned to 10-20 microns)
SLM (LC or MQW)SLM (LC or MQW)PitchPitch: : 10 um for vis/NIR10 um for vis/NIR
Output: coherent, Output: coherent, monochromatic,monochromatic,
grey-scale optical grey-scale optical imageimage
Smart Signal Processing Layer
• Pre-filtering (Difference of Gaussian for object of interest detection)
• Signal conditioning (gain ranging for SLM drive
• Sampling capacitors for SLM
IR Sensing Layer IR Sensing Layer Uncooled NIR: Uncooled NIR:
Ge, AlGaAs or Ge, AlGaAs or InGaAsInGaAs
Cooled LWIR:Cooled LWIR:AlGAAs QWIPs or AlGAAs QWIPs or InSbInSb
SOI CMOSSOI CMOSVisible/UV Sensing Visible/UV Sensing
LayerLayerHigh resolution, low-High resolution, low-
noisenoise visible IR
1
23
4
Input: wide Input: wide spectral band, spectral band, optical imageoptical image
laser
BOX
BOXGe
BOX
Metal1Metal2
Metal3
SLM input
A P I C
APIC Company ProprietarySlide 19Ver 3.6 (Sept 2003)
Our Product Categories
Optical-electrical conversion– Transmitters, detectors, transceivers
Amplification– EDWA, SOA
DWDM (mux/demux)– AWG, gratings, interlevers
Optical switching– MEMS, PZT fiber, thermo-optic & electro-optical
switches
Optical signal control and management– Dispersion, ICOM, VMUX
A P I C
APIC Company ProprietarySlide 20Ver 3.6 (Sept 2003)
Optical Networking Food Chain
Proposed positionfor APIC
Network Services
Photonic and ICComponents
Network Equipment
Modules / Subsystems
Network Software
A P I C
APIC Company ProprietarySlide 21Ver 3.6 (Sept 2003)
Technology: Materials
SOI Substrate
• Mature process; reliable substrate
• Capitalize on standard, high-volume semiconductor manufacturing processes
• Inherently low polarization sensitivity
• Potential for integration of active optoelectronic devices (including electronic control circuits)
Ge and InGaAsP
• High yields for simple devices
A P I C
APIC Company ProprietarySlide 22Ver 3.6 (Sept 2003)
PICPIC“foundation”“foundation”
2. Reconfigurable OADM; Integrated mux + VOA
4. Tunable WDMA Tx/Rx
1. Mux/demux (AWG)
3. Multi-channelreceivers
Common Platform for Products
A P I C
APIC Company ProprietarySlide 23Ver 3.6 (Sept 2003)
Fabricated SOI Chip
A P I C
APIC Company ProprietarySlide 24Ver 3.6 (Sept 2003)
SOI Chip OutputP (dB/nm)
-100
-90
-80
-70
-60
-50
-40
1.510 1.520 1.530 1.540 1.550 1.560 1.570 1.580 1.590
Wavelength (um)
P (
dB
/nm
)
A P I C
APIC Company ProprietarySlide 25Ver 3.6 (Sept 2003)
Fabricated Thermo-Optic Switch
• On/Off switch
• Mach Zender-based
• 1x2 and 2x2 in development
A P I C
APIC Company ProprietarySlide 26Ver 3.6 (Sept 2003)
Heater Bias
Optical output
Thermo-Optic Switch Response
30 µs cycle time(On -> Off -> On)
A P I C
APIC Company ProprietarySlide 27Ver 3.6 (Sept 2003)
Tunable Receiver/Channel Equalizer on one chip
A P I C
APIC Company ProprietarySlide 28Ver 3.6 (Sept 2003)
Integrated Ge detector with SOI waveguide
A P I C
APIC Company ProprietarySlide 29Ver 3.6 (Sept 2003)
Product:Multiple Channel Receiver
• SOI + Ge Photo Detector array + Circuit amplifiers +Clock Recovery• Patented Germanium integrated Array Photo Detectors• Prototype has been fabricated in the lab
DataTIAArray
CDR
AWG Demux
Input Aperture
PWR
Object Plane
Input Waveguide
Output Aperture
Image Plane
PWR
Array of Detectors
Geor
InGaAs
Clock Data Recovery (CDR); Trans-Impedance Amplifier(TIA)
A P I C
APIC Company ProprietarySlide 30Ver 3.6 (Sept 2003)
DropAdd
Elimination of 4 N interconnections (e.g. 160 for a 40-channel system)
Reconfigurable Optical ADM
ControlElectronics
AWG Mux
Output Waveguide
AWG Demux
Input Aperture
PWR
Object Plane
Input Waveguide
Output Aperture
Image Plane
PWR
Array of 2x2Switches
A P I C
APIC Company ProprietarySlide 31Ver 3.6 (Sept 2003)
Honolulu Cleanroom Facility
A P I C
APIC Company ProprietarySlide 32Ver 3.6 (Sept 2003)
Culver City Cleanroom
A P I C
APIC Company ProprietarySlide 33Ver 3.6 (Sept 2003)
Strategic Relationships
Waferfabricator
Semiconductorfabricator
Optical Commselectronics
manufacturer
EquipmentVendors
APIC
UniversityResearch
DefenseContractors
A P I C
APIC Company ProprietarySlide 34Ver 3.6 (Sept 2003)
Summary - Capitalize on Advantages• Skilled technical people
– Defense electronics
– University research
• Focus on materials handling and fabrication
• Benefits of SOI IC manufacturing technology
• Convergence of Photonics and Electronics on one chip
• “System-on-a chip” implementation
• Translithic and nano technolgy
• Ultra-sensitive chemical & biological sensors