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surfaces of the permanent magnet, and a magnetic fluid injected between one of the inner peripheral surface and outer periph- eral surface of the magnetic fluid holding means, and a magnetic body opposed to it, wherein the magnetic fluid holding means is electroplated with a metal having a con- siderably smaller ionization tendency to the magnetic body to form a ground work plated layer, and then the magnetic fluid holding means is nonelectrode plated to form a nonelectrode plated layer on the surface of the groundwork plated layer and the surface of the permanent magnet. Sand Blast Nozzle U.S. Patent 5,536,200. July 16, 1996 K.H. Kiess, Muelheim/Ruhr, Germany A nozzle for a sand blaster for a dust- free blasting of planar surfaces with a blast material. Alumina Abrasive Wheel U.S. Patent 5,536,283. July 16, 1996 D.A. Sheldon and R.S. Lundberg, assignors to Norton Co., Worcester, Mass. An abrasive grinding wheel comprising alumina abrasive and a vitreous bond wherein the vitreous bond after firing com- prises greater than 47% SiO2, less than 16% A1203, 0.05 to 2.5% K20, 7 to 11% Na20, 2.0 to 10.0% Li20 and 9 to 16% B203, and wherein the abrasive grinding wheel is substantially free of sol gel alu- mina abrasive. Method of Phosphating Mixed Metal Surfaces U.S. Patent 5,536,336. July 16, 1996 M. Nakatsukasa and L Kawasaki, assignors to Nippon Paint Co. Ltd., Osaka, Japan A phosphating method of conversion- treating metal surfaces of a combination of iron, steel, and/or galvanized steel and an aluminum alloy with a phosphate solution. Galvanizing Magazine U.S. Patent 5,536,377. July 16, 1996 II/I. Hiermaier et aL, assignors to MTU Motoren- und Turbinen-Union, Munich, and BL Produktions GmbH, Tittling, both of Germany A magazine having a longitudinal cen- tral axis for holding parts to be galvanized or plated, comprising a plurality of elec- trodes, each electrode comprising recepta- cles uniformly spaced from each other along the respective electrode for holding parts with an electrical contact between parts and the respective electrode, and at least one magnet for holding parts in the receptacles so that a part surface to be galvanized or coated faces outwardly from the respective receptacle. Sputtering Target Assembly U.S. Patent 5,536,380. July 16, 1996 B. Ocker and R. Hinterschuster, assignors to Leybold AG, Hanau, Germany A large area sputter cathode having floating target segments. Sputtering Device U.S, Patent 5,536,381. July 16, 1996 J-H. Lee, assignor to Samsung Electronics Co. Ltd., Suwon, Rep. of Korea A sputtering device comprising a sput- tering chamber; a first electrode, which supports a substrate and is used as an elec- trode within the sputtering chamber; a tar- get composed of a source material to be sputtered towards the first electrode; a sec- ond electrode attached to the target; a shield, which is insulated from the second electrode and attached beneath the target; Need to upgrade your waste treatment system? We offer: [] Widestvarie~ of ctoth types and tack formulations available. [] Syntheticand sealed cut POLYKNIT. tack cloths for lowestlint. B ~ Call for Samples & Information: (800) 253-2663 BOND CORP. USA 2100 W. Fulton St., Chicago, IL 60612-2314 o,-~'~1~'~ ~ . ~ y Te1:(312)226-5535 Fax:(312)226-80gg ~,v ..... Circle 014 on readerinformation card • ION EXCHANGE • ACID RECOVERY • CAUSTIC RECOVERY • METALS RECOVERY • CROSSFLOW MICROFILTRATION • WATER RECYCLE • REVERSE OSMOSIS We offer zero discharge closed loop design as the ultimate design. We will work cooperatively with your plating equipment supplier to assure you of a totally integrated facility. Water Treatment Technologies, Inc, 221 EastMain Street Milford, MA 01 757 TEL: 508-473-6800 FAX: 508-473-4030 Circle 087 on readerinformation card METAL FINISHING ° MARCH 1997 99

Alumina abrasive wheel

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surfaces of the permanent magnet, and a magnetic fluid injected between one of the inner peripheral surface and outer periph- eral surface of the magnetic fluid holding means, and a magnetic body opposed to it, wherein the magnetic fluid holding means is electroplated with a metal having a con- siderably smaller ionization tendency to the magnetic body to form a ground work plated layer, and then the magnetic fluid holding means is nonelectrode plated to form a nonelectrode plated layer on the surface of the groundwork plated layer and the surface of the permanent magnet.

Sand Blast Nozzle U.S. Patent 5,536,200. July 16, 1996 K.H. Kiess, Muelheim/Ruhr, Germany

A nozzle for a sand blaster for a dust- free blasting of planar surfaces with a blast material.

Alumina Abrasive Wheel U.S. Patent 5,536,283. July 16, 1996 D.A. Sheldon and R.S. Lundberg, assignors to Norton Co., Worcester, Mass.

An abrasive grinding wheel comprising alumina abrasive and a vitreous bond

wherein the vitreous bond after firing com- prises greater than 47% SiO2, less than 16% A1203, 0.05 to 2.5% K20, 7 to 11% Na20, 2.0 to 10.0% Li20 and 9 to 16% B203, and wherein the abrasive grinding wheel is substantially free of sol gel alu- mina abrasive.

Method of Phosphating Mixed Metal Surfaces U.S. Patent 5,536,336. July 16, 1996 M. Nakatsukasa and L Kawasaki, assignors to Nippon Paint Co. Ltd., Osaka, Japan

A phosphating method of conversion- treating metal surfaces of a combination of iron, steel, and/or galvanized steel and an aluminum alloy with a phosphate solution.

Galvanizing Magazine U.S. Patent 5,536,377. July 16, 1996 II/I. Hiermaier et aL, assignors to MTU Motoren- und Turbinen-Union, Munich, and BL Produktions GmbH, Tittling, both of Germany

A magazine having a longitudinal cen- tral axis for holding parts to be galvanized or plated, comprising a plurality of elec- trodes, each electrode comprising recepta- cles uniformly spaced from each other

along the respective electrode for holding parts with an electrical contact between parts and the respective electrode, and at least one magnet for holding parts in the receptacles so that a part surface to be galvanized or coated faces outwardly from the respective receptacle.

Sputtering Target Assembly U.S. Patent 5,536,380. July 16, 1996 B. Ocker and R. Hinterschuster, assignors to Leybold AG, Hanau, Germany

A large area sputter cathode having floating target segments.

Sputtering Device U.S, Patent 5,536,381. July 16, 1996 J-H. Lee, assignor to Samsung Electronics Co. Ltd., Suwon, Rep. of Korea

A sputtering device comprising a sput- tering chamber; a first electrode, which supports a substrate and is used as an elec- trode within the sputtering chamber; a tar- get composed of a source material to be sputtered towards the first electrode; a sec- ond electrode attached to the target; a shield, which is insulated from the second electrode and attached beneath the target;

Need to u p g r a d e y o u r waste t r e a t m e n t system?

We offer:

[ ] Widest varie~ of ctoth types and tack formulations available.

[] Synthetic and sealed cut POLYKNIT. tack cloths for lowest lint.

B ~ Call for Samples & Information:

(800) 253-2663 BOND CORP. USA 2100 W. Fulton St., Chicago, IL 60612-2314 o,-~'~1~'~ ~ . ~ y Te1:(312)226-5535 • Fax:(312)226-80gg ~,v . . . . .

Circle 014 on reader information card

• ION EXCHANGE • ACID RECOVERY • CAUSTIC RECOVERY • METALS RECOVERY • CROSSFLOW MICROFILTRATION • WATER RECYCLE • REVERSE OSMOSIS

We offer zero discharge closed loop design as the ultimate design. We will work cooperatively with your plating equipment supplier to assure you of a totally integrated facility.

W a t e r T r e a t m e n t Technologies, Inc,

221 East Main Street Milford, MA 01 757

TEL: 508-473-6800 FAX: 508-473-4030

Circle 087 on reader information card

METAL F INISHING ° M A R C H 1997 99