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Almit T435 NoClean Flux
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Almit Technology Ltd Product Information Update July 2007
Almit Technology Ltd, Unit 7 Forest Row Business Park, Station Road, Forest Row, East Sussex, RH18 5DW, UK Tel: +44 (0)1342 822844, Fax: +44 (0)1342 824155, email: [email protected], www.almit.com
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Start T435 No Clean Wave Soldering Flux
Introduction Start T435 No Clean Wave Soldering Flux has been specifically formulated for the soldering of mixed technology and conventional through hole printed circuit board assemblies, using lead free alloys. The flux features an enhanced, thermally stable base which is essential when higher pre-heat and solder bath temperatures are used during the lead free soldering process. Start T435 No Clean Wave Soldering Flux features improved performance over other fluxes in all critical areas including solder balling, hole fill, solderability and freedom from icicles and bridges. The flux can be used with all commonly used lead free alloys including, the SAC family, Sn Cu and its modified derivatives. The flux will also work equally with Sn Pb alloys. Start T435 is compatible with all PCB finishes and solder resists, producing shiny joints, and solder ball free, minimal resi-dues. Features Benefits Sn/Pb and Pb Free Compatibility Single Product Sourcing High Thermal Stability Reduced Solder Balls Excellent Soldering Performance Increased Yields No Clean Technology Eliminates Washing Process Specification Colour Clear Acid Value 35±1 Specific Gravity 0.830 @ 21°C Solids Content 4.3% Flash Point 12°C J-STD-004 Classification 0RL0
Almit Technology Ltd, Unit 7 Forest Row Business Park, Station Road, Forest Row, East Sussex, RH18 5DW, UK Tel: +44 (0)1342 822844, Fax: +44 (0)1342 824155, email: [email protected], www.almit.com
Processing Guidelines Start T435 No Clean Wave Soldering Flux should be applied by spray fluxer, the flux is not designed for foam application. Deposition rates of between 100 and 200 µgm/cm2 should provide the correct coverage for most board types. During pre-heating, topside board temperatures in excess of 130°C are possible but particular attention should be paid to the board design and suitability. Conveyor speeds are likely to be in the range of 1-2 metres/min. Packaging Start T435 No Clean Wave Soldering Flux is supplied in 5 litre plastic containers. Health and Safety A MSDS is available for this product. Please contact Almit Technology Ltd. or your local distributor for details. Start T435 Surface Insulation Test Results
IPC SIR Test Test Pattern Boards 24 Hours 96 Hours 168 Hours IPC B24 Control 6.45 x 109 7.85 x 109 6.37 x 109
Pattern Up 2.10 x 1010 1.67 x 1010 1.43 x 1010
Pattern Down 2.25 x 1010 4.13 x 109 4.68 x 109 IPC ECM/Telcordia EM Resistance Test Test Pattern Boards 96 Hours 500 Hours IPC B25A Control 9.96 x 1010 9.03 x 1010
Pattern Up 6.22 x 1010 1.05 x 1011
Pattern Down 4.57 x 109 5.76 x 1010 Telcordia GR-78 SIR Test Test Pattern Boards 24 Hours 96 Hours IPC B25A Control 8.51 x 1012 8.73 x 1012
Pattern Up 2.44 x 1011 2.82 x 1011
0.0125” spacing Pattern Down 6.43 x 1012 6.71 x 1012
