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Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada Chief Technology Officer DuPont Photonics Technologies [email protected] http://www.photonics.dupont.com

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Page 1: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

Advances in Optoelectronic Technologiesfor ROADM Subsystems

Louay EldadaChief Technology Officer

DuPont Photonics Technologies

[email protected]://www.photonics.dupont.com

Page 2: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

2

Use of ROADM in Optical Networks

OXC

ROADM

DEMUX

SPLITTER

METRO ACCESS

FTTP

Consumer

LONG HAUL

BackboneNetwork

Feeder RingNetwork

DistributionNetwork

Core

Metro

Long Haul

AccessAccess

AccessROADM Used for Add/Drop

(1x5, 1x9, 1x11)

ROADM Used for Connectivity(1x4, 1x8)

Optical Switch(OXC)

Page 3: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

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Migration Toward Agile Optical Networks

External-cavity laserDrop-in for fixed transponderInventory system simplification

Full-band tunable laser

λ blocker + fixed filters or Demux/ Switch/Mux PLC

Dual-use as DGEStranded capacity reduction, simple engineering rules

Type I ROADMLimited flexibility

Tunable filters/lasers or OXC or WSS

Retain blocker, add tunable laser, no impact to thru path; or all PLC solution, can be more cost-effective; or WSS

No manual intervention, monitor & control

Type II ROADMAny λ to any portDegree 2

WSSSelect locations only; interop with other nodes, same lasers

Ring-interconnect w/o OEO

Higher-Degree ROADMAny combination of λ’s to any port

Large WSS Select locations onlyMesh protection, etc.Optical Switch(aka OXC)

Integrated management

Same physical layer hardwareOptimum utilizationMinimum OpEx

Autonomous Agility

Thermal-tuned DFBDrop-in for fixed laserInventory reductionNarrow tunable laser

Fixed DWDM lasers, Fixed OADM

Fixed functions

New Components

CompatibilityJustificationNetwork Function

Optoelectronic functions needed in agile optical networks:• Tunable Lasers• ROADMs

RH

K (p

artia

l)

Page 4: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

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ROADM Use in Networks

Cisco, Tellabs, HitachiJDSU, DuPont, OpTun, Chromux, Neophotonics, NEL

Metro (Demux/Switch/Mux)

JDSU, DuPont, CoAdna, Engana, Metconnex, LichtConnect, Capella

Avanex, JDSU, DuPont, LightConnect, CoAdna, Polycromix, Xtellus

Avanex, JDSU, DuPont, LightConnect

Component Vendors

Fujitsu, MeritonMetro(WSS)

Verizon, MCI, SBC (Alcatel/Tropic), BellSouth (Tellabs), NTT

Comcast, Cox , Brighthouse(Fujitsu), Shaw

Alcatel/Tropic, LucentMetro (Wavelength Blocker)

Qwest (Lucent), Verizon (Lucent), GigBE project (Ciena), MCI (Ciena), BT (Marconi), MCI (Siemens), AT&T (Siemens), Broadwing (Corvis)

Lucent, Ciena, Marconi, Siemens

Long-Haul(Wavelength Blocker)

Carriers (System Suppliers)

System Vendors

Market (Technology)

About 700 ROADM nodes were deployed in 2004, mostly in the second half of the year. The majority of these nodes were 32-channel systems from Fujitsu and Cisco, with the largest deployments being in Japan and North America.

RH

K (p

artia

l)

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ROADM path lags tunable laser by 2 years

Blocker + Tunable

Filters/Lasers skipped?

Wavelength Selective

Switch expected

Fixed

Narrow(~8 ch)

Moderate(~20 ch)

Wide(~40 ch)

Source:RHK

laser

laser

2003 2004 2005Fixed

“Type I”

Higher degree

“Type II”

Laser ROADM

ROADM

ROADMIntegrated

Demux/ Switch/Mux

“over 1000 shipped”

-JDSU 12/01/04

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ROADM Types

Blocker as DGE

EDFA Blocker

TunableFilters/Rx

TunableLasers

Type II

Splitter Combiner

BlockerBlocker

Splitter Combiner

TunableFilters/Rx

TunableLasers

Blocker

Higher-Degree ROADMType I

Fixed Filters

Blocker

Splitter Combiner

λλ λ

λ

Fixed Lasers

λλ λ

λ

Type II

OXC OXC

Type I Higher-Degree ROADM

Wavelength-Blocker-Based Broadcast and Select

Integrated Demux/Switch/Mux

Type II orHigher-Degree ROADM

WavelengthSelectiveSwitch

Splitter

Tunable Filters/Rx

Combiner

Tunable Lasers

LC- or MEMS-Based WSS

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Wavelength-Blocker-Based Type I ROADM

Splitter

Transmitters

ADD

Splitter

1xN (or 1xM) Splitter

DROP

Receivers

OPM

Wavelength Blocker

...

Dem

ux M

ux

…… …… Nx1 (or Mx1) Combiner

… …Tunable Filters

1

N

2

...

Common Characteristics:● Free-space (MEMS, LC)● For full reconfigurability:

Tunable lasers at ADDNew Gen:● Splitters/Combiners

replaced with Demux/Mux● No tunable filters at DROP

Old Generation:Splitters at Drop,Combiners at Add

Add Channels

1

N

2

... Mu

x

Dem

ux

...Demux

Drop Channels

Mux

. . .OPM

Wavelength Blocker

in out

30%/70% Splitter30%/70% Splitter

New Generation:Demux at Drop,Mux at Add

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PLC-Based Type I ROADM

λ1λ2...λ32

IN OUT

λ1 λ32ADD

Control Electronics

Power, Data

MUX

DEMUX

5% Tap

......

...

λ1λ2...λ32

IN

DROPλ1

DEMUX

15%Tap

λ32

OUT

λ1

λ32

Note: Both express and “Add” channels are balanced with the built-in VOA array

Page 9: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

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Type II ROADM Configurations

• Free-space, MEMS, LC• Higher IL ▼• Difficult to upgrade ▼• Reliability issues ▼• Tunable filters at DROP ▼• For full reconfigurability:

Tunable lasers at ADD ▼• Large component count ▼• Expensive ▼

• Can be single PLC ▲• Lower IL ▲• Easy to upgrade ▲• NxM & MxN at A/D give

full reconfigurability ▲• Integration-friendly ▲• Small component count ▲• Low cost ▲

WB-BasedBroadcast and Select

Full N (or M of N) Reconfigurability

Splitter

TunableTransmitters

ADD

Splitter

1xN (or 1xM) Splitter

DROP

Receivers

OCM

Wavelength Blocker

...

Dem

ux M

ux

…… …… Nx1 (or Mx1) Combiner

… …Tunable Filters

PLC-Based Demux/Switch/Mux

Typical Today:N = 8, 16, 32, 40M = 4, 8

Dem

ux

ADDDROP

... ... ...... ... ...

TransmittersReceivers

Mu

x

OCMDCE DCE OCM1x2 2x1

MxN OXCNxM OXC

Page 10: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

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λ1λ2...λ32

IN OUT

λ1 λ32 ADDDROP λ1 λ32

Control Electronics

Power, Data

MUX

DEMUXDEMUX

15%Tap

5% Tap

......

...

TransmittersReceivers

8x32 OXC32x8 OXC

PLC-Based Type II ROADM

Page 11: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

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Each 8x8 Switch is112 1x2 Switches

→ 288 ElementaryFunctions

Polymer PLC includes

16 1x2 Switches16 VOA’s16 Taps16 Photodiodes2 8x8 Switches

66 Functions

Fiber 1In West

Fiber 2Out West

Dro

p 1

−8

Fro

m W

est1 8

1

8

WestChip

Fiber 2In East

Fiber 1Out East

MU

X

8

1

EastChip

Ad

d 1

−8

To

West

1 8

Ad

d 1

−8

To

East

Dro

p 1

−8

Fro

m E

ast

DEM

UX

8x8 OXC

81

8

1

MU

X

1

8

81

DEM

UX

1x2 SwitchPower TapPhotodiodeVOA

8x8 OXC

8x8 OXC

8x8 OXC

Demux/Switch/Mux Type II ROADMFully Reconfigurable East/West Separated Architecture

8 λ / FiberDrop any λ to any portAdd any λ from any port

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70/30 coupler

1 82

DMux

Mu

x

DM

ux

1

8

2

Switch/VOA

Control Electronics

8x8 Switch

8x8 Switch

Optional Tap/PD

In (East) Out (East) Out (West)In (West)

DROP (East) ADD (West)

Note: Mux and Demux are based on thin film filters

Fully Reconfigurable PLC-Based8-Channel Demux/Switch/Mux

Type II ROADM

Page 13: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

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Node Cascading Simulation LayoutCascade of 16 ROADM nodes (32 AWG’s)

16 iterationsSimulation tools and assumptions:

–Rsoft OPTSIM simulation tool is used

–Measured spectral IL and CD of Flat Top AWG filters are used

–Two optical amplifiers are used at each node

–Worst case narrowing of ROADM passbanddue to temperature variation and center frequency inaccuracy of AWG filters is used

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Bandwidth of Cascading AWG Filters

Concatenation of Flat-Top AWG Filters

y = 79.131x-0.252

y = 50.271x-0.2521

0

10

20

30

40

50

60

70

80

90

0 5 10 15 20 25 30 35

Number of Flat-Top AWG Filters

Ban

dwid

th (G

Hz)

3-dB BW (GHz)

0.5-dB BW(GHz)

Power (3-dB BW (GHz))

Power (0.5-dB BW(GHz))

Page 15: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

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Simulation Conditions (16 Nodes)

194.0050

194.0050

194.0000

194.0000

Demux filter 3-dB center (THz)

194.0111

194.0111

194.0111

194.0000

Laser center frequency(THz)

20.0193.9950Run4

10.0193.9950Run3

10.0194.0000Run2

10.0194.0000Run1

ROADM Total Loss (dB)

Mux filter 3-dB center (THz)

Run 1 Run 2 Run 3 Run 4

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• DuPont PLC ROADM meets bandwidth requirements for 16-node DWDM rings– Bandwidth at 0.5dB is over 40 GHz

for each ROADM– Bandwidth at 0.5dB is over 20 GHz

after 16 cascading nodes (32 AWG’s)

• DuPont PLC ROADM allows use of low cost, low accuracy lasers for 16-node rings– Bit error rate (BER) lower than 10-17

– Lasers with +/-10 shift of center frequency can be used without any system performance degradation after 16 cascading nodes

Cascading Simulation Conclusions

1.70E+011.75E+01

1.80E+011.85E+01

1.90E+011.95E+01

2.00E+012.05E+01

2.10E+01

193.980 193.990 194.000 194.010 194.020

Laser Center Frequency (THz)

Q V

alue

1.00E-25

1.00E-23

1.00E-21

1.00E-19

1.00E-17

1.00E-15

1.00E-13

193.980 193.990 194.000 194.010 194.020

Laser Center Frequency (THz)

BER

Page 17: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

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Comparison of PLC and λ Blocker Approaches for ROADM

$X$X/2Cost

Low – manual assemblyHigh – automated manufacturingPotential for Cost Reduction

Free space opticsSolid state optics (waveguides)Technology Platform

< 100 GHz≥ 100 GHzChannel Spacing

> 40≤ 40Number of Channels

< 0.3 dB< 0.3 dBPassband Ripple

< 0.5 dB< 0.5 dBPDL (in-out) at min attenuation

< 50 ms< 10 msAdd/Drop Time delay

Four slotsTwo slotsSize

AverageExcellentStability and Reliability

< 10 dB< 10 dBInsertion Loss (in-Drop)

< 13 dB< 10 dBInsertion Loss (Add-out)

< 11 dB< 12 dBInsertion Loss (in-out)

λ Blocker ROADMPLC ROADMParameter

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Any number of λ1-n

Any number of λ1-n

D8

DEM

UX

1

MU

X2

n

MU

XM

UX

MU

XM

UX M

UX

MU

XM

UX

In

MU

X

Out

D1

D2

D3

D4

D5

D6

D7

1xN

switches

λ1 ,λ2 ,…., λn-1, λn

Any number of λ1-n

Any number of λ1-n

Any number of λ1-n

Any number of λ1-n

Any number of λ1-n

Any number of λ1-n

Any number of λ1-n

Shared bulk grating for all Mux’s and Demux’s

Liquid Crystal & MEMS Based WSS

JDSU

Page 19: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

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Advantages of LC vs MEMS WSS

• Mature components and proven technology (same technology as wavelength blockers in commercial use)

• Lower cost (simpler alignment and calibration, high yield)

• No notches between channels (for higher cascadabilityand upgradability to smaller channel spacing)

• Higher reliability (no moving parts)

• No vibration sensitivity issues

• No sticking and static damage issues

• Telcordia qualified technology platform

• Lower design and supply risk

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20

Typical Interleaved Channel Spectra at Drop Port

Performance of 1x4 Liquid Crystal WSS

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Spectra at Different Attenuation Levels

Performance of 1x4 Liquid Crystal WSS

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22

Use in Mesh NetworksOptical Crossconnects

Networks today are not simple ring or mesh, they increasingly include:- Ring-mesh hybrids- Stacked rings

Reconfigurable mesh network made up of two interconnected sub-networks, each being an island of transparency

OEOSwitch

OEOSwitch

OXC atDegree 8

Node

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Use in Mesh NetworksOptical Crossconnects

OXC’s are particularly useful in reconfigurable mesh networks where nodes have to route traffic from different directions

Important criteria:• Non-blocking reconfigurable node• Reliable configuration (several medium size switch matrices)• Optical properties (IL, XT, etc.)• No regeneration, no wavelength conversion

For N fibers (degree N node) and M wavelengths per fiber, M NxN switches are needed

Degree 4 Node for Meshed Architecture

4 Fibers → 4x4 Switches4 λ / Fiber → 4 Switches

From Local Node To Local Node

Eur

esco

m P

615

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24

Enabling PLC Technologies

Planar"Free Space"Coupler

Waveguide Delay Lines

Dummy GuidesInputs Outputs

12

N 12

N.

.

..

.

.

..

.

∆L = constant

• Polymer Based Integrated Switch-VOA Arrays – Add Switch(2x1)/VOA & OXC(8x8, 32x8)– Low Loss, Low PDL– Low power consumption– Wavelength independence– Telcordia qualified

• Silica Based AWG (Mux/Demux)– Flat top– Low loss– Low CD– Low PDL– Tight center frequency accuracy ( 5 GHz)– Wide bandwidth ( 80 GHz at 3 dB)– Telcordia qualified

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40ch Fiber Array

SilicaAWG

Polymer PLCVOA Array

Chip-to-Chip IntegrationChip-to-Chip integration:• Eliminates fiber arrays, reducing cost• Eliminates space needed for fiber ribbons and splices• Eliminates excess loss due to pigtailing• Improves reliability due to reduced number of interfaces

Example: 40ch VMUX

Measured chip-to-chip excess loss: <0.1dB

Silica-on-SiAWG

PolymerArrays ofSwitches/

VOA’s/Power

Monitors

8x32OXC

32x8OXC

Silica-on-SiAWG

Silica-on-SiAWG

32x8OXC

8x32OXC

Silica-on-SiAWG

8ch fiber array

8ch fiber array

fiber

fiber

fiber

fiber

8ch fiber array

8ch fiber array

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Dynamic IC Fabrication

Blank Wafer to Diced Chips

in 6 Hours

ROAD™

Form 3:Black box with optical and electrical connectors

Form 2:Packaged chip on PCB with control electronics and firmware

Polymer Waveguide Fabrication

Metalization

Form 1:Packaged chip

Dicing, Packaging

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Cycle Time Minutes/wafer

Propagation Loss 0.11 dB/cm (sm wg)

Polarization Effects Birefringence = 10-6

PMD = 0.01 ps (1 cm sm wg) PDL = 0.01 dB (1 cm sm wg)

Dynamic Provisioning dn/dT = -3.2x10-4

Compactness, Density ∆n = 0-30%

Reliability Proven

Function Availability Static & Dynamic in Polymer Active by Hybrid Integration

Propagation Loss = 0.11 dB/cmPigtail Loss = 0.14 dB per side

Chip Length [mm]0 10 20 30

Inse

rtion

Los

s [d

B]

0.0

0.2

0.4

0.6

0.8

1.0

dn/dT = -3.2x10-4

Temperature [ C]20 30 40 50 60

Ref

ract

ive

Inde

x (n

)

1.345

1.350

1.355

°

DuPont Polymer Photonic IC’sKey Properties at 1550 nm

WDL < 0.05 dB

Wavelength (nm)1500 1520 1540 1560 1580

Inse

rtion

Los

s (d

B)

0.0

0.2

0.4

0.6

0.8

1.0

Low Insertion Loss

Low Power Consumption

Low Wavelength Dependence

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Polymer 1x2 Digital Optical Switches

Transfer Curve

Heater Power (mW)0 10 20 30 40

Opt

ical

Out

put (

dB)

40-

30-

20-

10-

0

'ON' Arm Output

'OFF' Arm Output

Digital

Range

HeaterElectrode(ON)

HeaterElectrode

(OFF)

BondingPad

ChannelWaveguide

OpticalSignal

IN

Optical SignalOUT

~0.1°

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Attenuation: 30 dBSensitivity: 20 dB/mWMax. Power Consumption: 1.5 mWResponse Time: 3 ms

Low Power Polymer MZI VOA

Heater Power (mW)0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4

Opt

ical

Out

put (

dB)

30-

20-

10-

0

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Polymer-Based 8x8 Intelligent OXCIntelligent OXC

8x8 Switch (112 1x2 Switches) + 8 Taps + 8 VOAs

VariableOptical

Attenuator

OpticalPower

Tap

1x2DigitalOpticalSwitch

• Strictly non-blocking OXC• Power monitoring• Channel balancing

Performance Characteristics• Insertion Loss (fiber to fiber): 5 dB• PDL @ 0 / 15 dB Atten: 0.1 / 0.3 dB• WDL (1528 – 1610 nm): 0.1 dB• TDL (-5 – 70°C): 0.1 dB• ODL (-30 – +20 dBm): 0.1 dB• Extinction: 45 dB• Crosstalk (any port to any port): 50 dB• Return Loss: 50 dB• Power Consumption: 2.5 W• Response Time: 3 ms• CD: 0.1 ps/nm, PMD: 0.01 ps

Simple control of switching elements from common drive voltageTotal Footprint with PCB: 10 in2

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Telcordia Qualification

Passed GR-1209-CORE/GR-1221-CORE

PASSCable Retention(3.4 lb load, 1 minute)

PASSLifetest(70°C, 2000 hours, in-situ operation & test)

PASSFiber Side Pull(0.5 lb load, 90° angle)

PASSHigh Temperature Storage(85°C, 2000 hours)

PASSMechanical Shock(500 G, 6 directions, 5 times/direction)

PASSVibration(20-2000 Hz, 3 axes, 4 cycles/axis)

PASSThermal Shock(0°C to 100°C, 15 cycles)

PASSTemperature Cycling(-40°C to 85°C, 100 cycles)

PASSTemperature-Humidity Aging(85°C/85%RH, 336 hours)

Test ResultTelcordia TestsGR-1209-CORE/GR-1221-CORE

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32

Telcordia Qualification Results

0

1

2

3

4

5

6

7

8

9

10

-0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5

Change in Insertion Loss (dB)

Nu

mb

er

of

Ch

an

ne

ls

1528 nm1550 nm1565 nm

Passed Telcordia qualification with large marginNarrow data distribution around 0 dB IL change

Changes are on order of measurement error

Page 33: Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada.pdf · Advances in Optoelectronic Technologies for ROADM Subsystems Louay Eldada ... No manual intervention,

33

Reliability of Polymers and Devices

Highly Accelerated Stress Tests (HAST)

Lifetime > 20 years at maximumoperating temperature of 150°C

-0.5

-0.4

-0.3

-0.2

-0.1

0

0.1

0.2

0.3

0.4

0.5

0 1000 2000 3000 4000 5000 6000

Duration (hours)Tr

ansm

issi

on V

aria

tion

(dB

/cm

)

20-year degradation

<0.08dB/cm at 17 dBm input power

<0.02dB/cm at 10 dBm input power

0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000

Time (hours)

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

Inse

rtio

n Lo

ss V

aria

tion

(dB

)

5000 Hours, 175°C

Device 1Device 2Device 3Device 4

175°C, 5000 hours10-cm-long waveguides

(1550 nm)

32 dBm (1.5 W), 6000 hours(1550 nm)Stability with High Temperature

Stability with High Optical Power

Polymer lifetime well over lifetime of other components in system

Optical intensity in polymer waveguide = 2.5x1010 W/m2

→ 100x optical intensity on the surface of the Sun

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34

Thank You

[email protected]://www.photonics.dupont.com