Англійсько-український словник з мікроелектроніки та мікросистемної техніки

  • Published on
    27-Dec-2016

  • View
    239

  • Download
    22

Transcript

  • -

    :

  • . ., . .-

    24 . , , , , , .

    , - ,, .

  • 3

    .

    . ,

    , () .

    , band edge edge.

    (~).

    (). chip ~-on-tape , .

    (|). check ,

    | , .

    . , floating gate (-).

    ,

    . , emitter-coupled (logic) gate .

    emitter-coupled logic gate; emitter-coupled gate constant

    (). , .

    , ,

    ([ ]). ion [ion-beam] milling

    . ion milling, ion-beam milling

    , multilayer metallization [] .

    ,

    .

    :

    , ,

    .

  • 4

    - 2 - . . - [] - III - . - - VMO V-

  • 5

    A

    abacus ( )ability:

    adhesive ~ ; resolving ~ , wetting ~ ,

    ablation:laser ~

    abradability abrasion:

    wafer ~

    abrasive , absorber (

    , )absorption ,

    band-to-band ~ characteristic ~ [] Compton ~ extrinsic ~ free-carrier ~ fundamental ~ []impurity ~ interband ~ intraband ~ intrinsic ~ []laser radiation ~ lattice ~ surface-state ~

    accelerator ( )floating-point ~ hardware ~

    acceptor , deep ~ shallow ~ ()

    accessibility and dissemination data

    ( )

    accessor/y:production ~ies vacuum ~ies []

    accumulation:charge ~

    accumulator ; product ~ ( )round-off ~ ( )

    accuracy alignment ~ instrument ~ positioning ~ repeatable ~ ; trimmed ~ () trimming ~ ()untrimmed ~ ()

    actigram ( )

    action 1. ; 2. () 3. ; avalanche ~ buffer ~ ( )compensating ~ continuous-wave ~ diode ~ parasitic ~ 1. 2. pulsed ~ punch-through ~ , pyrolytic ~ transistor ~ trigger ~

    activation , ; annealing ~ dopant [impurity] ~ [] light ~

    activity 1. ( ) 2.

    acuity:

    acu

  • 6

    edge ~ (. )adatom , additive 1. ; ; 2.

    dope ~

    add-on 1. pl () 2. adherence 1. ; 2.

    ( )die ~ ( )

    adhesion ; photoresist ~

    adhesive 1. , 2. electrically conductive ~

    emulsion ~ ~ filled ~ polymer ~ thixotropic ~ unfilled ~

    adhesiveness ; adion adjoint of a matrix ()

    adjustment ;

    functional ~ adlayer administration:

    ~ tests test pattern ~

    advice 1. 2. ()

    algorithm:A ~ A- ( , D-)aim ~ automatic placement and routing ~ backward error recovery ~ ( )best path ~ bit-map oriented spatial processing ~

    block-oriented ~ -branch and bound ~ ( )channel ~ D ~ D- ( )deductive ~ ( )discard ~ (. )exact embedding ~ ( )expansion ~ fast-Fourier-transform ~ graph-based ~ , , Gummels ~ hidden-line ~ ( )image processing ~ iterative ~ Lee ~ , min-cut ~ modified Lee ~ ( ), N-step ~ N- one-direction ~ pessimistic simulation ~ ( , ..)random-search ~ repair-most ~ Roths D ~ D- routing ~ Schonhage ~ ( )selective-trace ~ ( )

    alg

  • 7

    sequential ~ stable sorting ~ star ~ ( )table-driven ~ 9-value D- ~ D-wiring ~

    aliasing ( )

    aligner (); auto(mask)~ ( )contact ~ deep-UV projection ~ ALI [ -] diffusion tube ~ direct step-onto-wafer ~ ( )electron-beam ~ - full-field (mask) ~ () hard-contact ~ mask ~ (); projection ~ proximity ~ ()reduction projection ~ site ~ soft-contact ~ step-and-repeat [step-by-step, stepper] ~ shadow (projection) mask ~ ()

    submicron (mask) ~ ( ) wafer ~ wafer-stepping ~ X-ray ~

    alignment ; coarse ~ ; die-by-die ~ diffraction grating ~ double-diffraction ~ epitaxial ~ fine ~ ; Fresnel-zone ~ full-wafer [global wafer] ~ laser interferometric ~ laser scanning ~ level-to-level ~ , mask-to-wafer ~ multiple-mask ~ off-is ~ projection (mask) ~ proximity (mask) ~ () reticle ~ ; site-by-site ~ ( )spaced ~ ()target ~ theta ~

    allocation:connections ~ ()

    all

  • 8

    allocator:control ~ data/memory ~

    alloy | mercury-cadmium-telluride , III-V ~ V

    alloying:interface ~

    alpha 1. ( 2. -

    alumina , l23glazed ~

    aluminizing aluminum , l

    glass-coated ~

    ambient:annealing ~ dry oxygen ~ oxidizing ~ ; reducing ~ ;

    amorphization ( )

    amplification 1. 2. small-signal ~ 1. 2.

    amplifier antilog(arithmic) ~ bi-FET ~ bulk-effect ~ charge-transfer ~ Darlington ~ differential ~ drift-stabilized operational ~

    high-output current operational ~ high-stew rate operational ~ high-speed operational ~ high-voltage operational ~ hybrid ~ , IC ~ , logarithmic ~ low-drift operational ~ mixed-process ~ , monolithic ~ ; off-chip ~ [] one-chip ~ on-chip ~ operational ~ optical isolation ~ optically-coupled ~ sample-and-hold ~ semiconductor ~ S/H ~ . sample-and-hold amplifiersmall-signal ~ thick-film ~ thin-film ~

    analysis ~ synthesis ~ variance block-level ~ charged particle tivation ~ circuit ~ 1. 2. computer circuit ~

    ana

  • 9

    design ~ 1. 2. , EAPFS ~ effect-cause ~ -electron microprobe ~ failure (-mode) ~ ; gate-level ~ hazard ~ incremental circuit ~ liquid-crystal failure ~ means/ends ~ ( )mixed-level ~ mixed-mode ~ modified mesh ~ () modified nodal ~ multilevel ~ neutron tivation ~ nuclear reactions ~ on-line circuit ~ post-fault ~ race ~ ( )reject ~ residual gas ~ signature ~ sparse tableau ~ spike ~ ( )static timing ~ steady-state ~ surface elemental ~ ()

    thermogravimetric ~ (. )timing ~ ( )transient ~ what-if ~ -worst-case ~ X-photoemission spectroscopy ~

    analyzer (1. 2. )basic ~ logic ~ , multichannel ~ optical ~ path ~ , ( )semiconductor impurity ~ spreadsheet ~ ( )

    AND:dot [implied, wired] ~

    angle:sidewall ~ 1. () 2. () 3. (. )

    anhydride:boric ~ , , 23phosphoric ~ , , 25phosphorous ~ , , P2O3

    anisotropy etching ~

    anneal | high-temperature ~

    annealer electron-beam ~ -

    annealing bulk ~ capless ~ capping ~ contact ~ ( )

    ann

  • 10

    diffusion ~ hydrogen ~ implant(ation)~ ion-beam ~ - lamp ~ laser(-beam)~ light ~ microwave ~ -plasma ~ , pulse ~ rapid ~ superficial ~ thermal ~ [] ,

    anodization electrolytic ~ plasma ~

    antifuse (, )

    antimonide ( )aluminum ~ , AlSbgallium ~ , GaSbindium ~ , InSb

    antistat anodization (

    )

    apparatus ; cluster ion-beam ~ () double-crucible crystal-growing ~ float-zone ~ vapor-growth ~

    apparel:clean-room ~ ()

    applicator:glue ~ ()

    approach ; (. method,mode, technique)

    basic ~ - bipolar ~ () bottom-up ~ Bristle Blocks ~ building-block ~ cassette-to-cassette ~ cellular ~ cermet ~ chip-and-wire ~ circuit motivated ~ -custom [customized] ~ () divide and conquer ~ , ( )edge-based ~ ( )epic ~ -, -figure-based ~ ( )fixed-interconnection pattern ~ flat ~ () ( )flip-chip ~ gate-array ~ , hierarchical ~ hierarchical nesting ~ hundred r nt yield ~ 100%- hybrid ~ incremental ~ in-line ~ (. )

    app

  • 11

    iterative-ll ~ , Macrocell ~ master MOS ~ -master-slice ~ mesa-epitaxial fabrication ~ modular ~ monolithic ~ () path-oriented ~ , ( )planar (processing) ~ polycell (layout) ~ () (. )sea gates ~ () selective field-ide ~ shaped-beam ~ SOS ~ -standard ll(-based)~ structured ~ top-down ~ twin-tub ~ ( )two-polysilicon ~ waveform ~

    approval:design ~ specification ~

    approximation:FB [flat-band] ~ linear piecewise ~ - ( )

    architecture 1. ; ; 2. bit-slice ~

    channelless ~ ( )fault-tolerant ~

    area 1. , ; (. region, zone) 2. base ~ 1. , 2. bond (ing) ~ chip-mount(ing) ~ clean ~ , , collector ~ 1. , 2. connector ~ contact ~ 1. 2. diffused ~ drain ~ 1. , ( ) 2. dust-controlled ~ () edge-contact ~ emitter ~ 1. , 2. ion-damaged ~ , land ~ masked ~ ; metallized ~ ide-free ~ placement ~ , plate loading ~ possible trouble ~ raised-contact ~ , raised-metallized ~ ; , routable ~ , safe operating ~ ( )

    are

  • 12

    shaded ~ mask source ~ 1. () 2. stage working ~ terminal ~ wiring ~ ,

    arm:SMIF ~ ( ) transfer ~ ,

    arrangement 1. ; 2. 3. basic-circuit ~ diode ~ 1. 2. ; gate ~ 1. 2. ()heat-sinking ~ matrix ~ mounting ~ -ordered ~ stacked ~

    array 1. ; 2. 3. 4. 5. bipolar ~ bulk CMOS ~ 1. 2. - cell ~ 1. (. ) 2. , [] channel-free [channelless] gate ~ charge-coupled(-device)~ circuit ~ 1. 2. coupled quantum box ~ customizable ~ data ~ diode ~ with self-scanning

    drop-in test ~ FET ~ 1. 2. field-programmable gate ~ , fuse-link [fuse-programmable] gate ~ , [] C ~ ; image ~ 1. () 2. large-scale ~ ; laser-scanning ~ , lateral ~ linear ~ ( ); logic ~ [] , ; Macrocell ~ ( )mask-programmable ~ 1. , 2. , master slice ~ 1. 2. , master-slice gate [master-slice logic] ~ , [] memory ~ 1. 2. mesa p-n diode ~ microcell ~ monolithic ~ ; multichip ~ multistrip ~ n-channel [negative] MOS ~ 1. n--; n- 2. n- -

    arr

  • 13

    nonoverlapping redundant ~ , original image data ~ original subimage data ~ pattern ~ ()p-channel MOS ~ 1. - -; - 2. --pin-grid ~ 1. 2. polycell ~ , (. - -)processing ~ programmable gate ~ , [] programmable logic ~ , register ~ semiconductor ~ semicustom ~ Schottky(-cell)~ Schottky TTL gate ~ , -single-layer metal ~ ; SOS ~ --; -standardized ~ ; storage logic ~ , structured ~ ( )systolic ~ ()tile(d)~ ( )uncommitted logic ~ universal ~ ( )

    wafer-scale ~ ; x-y ~ 2D quantum box ~

    arsenide ( () )aluminum ~ , AlAscadmium ~ , CdAsgallium ~ , GaAsindium ~ , InAs

    arsine , , AsH3artwork ();

    ; ( )computer-generated ~ , mask ~ ; negative ~ []photo ~ positive ~ []rubylith ~

    asher:plasma ~ ()

    ashing:plasma ~ (. )

    ASIC array-based ~ (. )standard-ll based ~

    asperity (); aspirator:

    chip ~ assay:

    gravimetric ~ potentiometric ~

    assemblage 1. ; 2. ; assembler 1. -

    2. ; chip ~ 1. () ( ); ( ) 2.

    ass

  • 14

    []flat- ~ 1. () 2. ( )hybrid ~ ()] software ~ , surface-mount ~

    assembly 1. ; 2. ; beam-lead ~ beam tape-automated ~ charge-shift ~ , chip ~ 1. ( ); ( ) 2. ()chip-and-substrate ~ chip-carrier ~ chip-on-board ~ () cut and paste ~ ( )flip-chip ~ header ~ hybrid ~ 1. 2. microelectronic modular ~ molded ~ , ( )multichip ~ 1. 2. operating ~ semiconductor ~ 1. 2. step-by-step ~ surface-mounted ~ 1. 2.

    assertion:

    timing ~ ( , )

    assignment:column ~ ()gate ~ ( )pin ~ row ~ ()

    Association:Electronic Industries ~ ()Semiconductor Industry ~ ()

    assumption:single-stuck fault [SSF] ~

    assurance:CAD system sofware quality ~ [] neutron-hardness ~

    atmosphere:humid-hydrogen ~ inert ~ oxidation [oxidizing] ~ ; reducing ~ ;

    atom:acceptor ~ diffusing ~ donor ~ dopant ~ foreign ~ ()impurity ~ interstitial ~ , n-type dopant ~ photo-generated ~s , p-type dopant ~ substitution ~

    attachability:

    att

  • 15

    die ~ ( )

    attacher:frame ~ (. )

    attachment 1. () ; () 2. ; die ~ [, ] (. ) die ~ eutectic die ~ flip-chip ~ flywire ~ lead-frame ~ (. )reflow ~ (. ) solder die ~

    audit:conformance ~ (. )quality ~ spec. ~

    autodope ,

    automation:design ~ flexible ~ front-end ~ layout ~

    autoregistration avalanche ,

    electron ~ electron-hole ~ -

    axis:crystal ~ twin(ning)~

    B

    backfill:V-groove isolation polycrystal ~ V-

    backing ; backlap

    ()backscattering

    Rutherford ~

    backstreaming:oil ~ ( )ultra-low ~ ( )

    backplane ; ;

    backup 1. 2.

    bag:antistatic ~

    bake 1. , , 2. (. )hard ~ 1. 2. ()post ~ 1. 2. postdevelopment [postexposure] ~ soft ~ 1. 2. ()

    bakeout ; , (. - bake)

    ball , tinned ~ solder ~

    ballast:resist ~

    band 1. () 2. (); ()allowed ~ empty ~ energy ~ filled ~ flat ~ forbidden ~ impurity ~ cupied ~ rmitted ~ speed-power ~ ( )unoccupied ~ valence ~

    ban

  • 16

    bandgap () ; () (. - gap)

    banding ( )impurity ~ ( )

    bandwidth 1. () 2. ()forbidden ~

    bank ; ; | ;

    bar () ; heating ~ ()n-type ~ ( ) n-zone-levelled ~ ,

    barrier 1. 2. (.- junction) 3. ( )diffusion ~ , isolation ~ Josephson ~ , metal-semiconductor ~ ; organic-on-organic contact ~ oxidation ~ , (. )p-n ~ pn-potential ~ quasi-Schottky ~ resonant tunneling ~ ()Schottky ~ short period superlattice [sps] ~ unmasked ~

    base 1. , 2. ;boron ~ , diffused ~ extrinsic ~ insulating ~ [] intrinsic ~

    metal ~ 1. ( ) 2. ()oxide-walled ~ , package ~ permeable ~ [] ( )

    base-insert ()

    basis:link-by-link ~ ( )

    basket:wafer ~

    batch ; , batch-fabricated, batch-produced

    bath

    electrolythic [electroplating] ~ , etch ~ plating ~ ,

    bay:diffusion ~

    bead:photoresist edge ~

    beak:birds ~ 1. ( ) 2. ( ) 3. ( )

    beam ; electron-compensated ~ ion () excimer ~ Gaussian ~ , impurity-ion ~ Kauffman ion ~ microfocused ion ~ , molecular ~ ygen plasma ~

    bea

  • 17

    plasma ~ reactive-ion ~ shaped ~

    beam-leaded beamwriter bed nails

    ( )

    behavior 1. () 2. ( ) 3. () 4., ~ circuit design external ~ , -functional ~ , output ~ semiconductor ~ 1. 2. []steady-state ~ timewise ~ transient ~ worst-case timing ~ ,

    bench 1. 2. clean ~ () clean air ~ ( )laminar flow ~ () test ~

    bender lead ~ ()

    bending:band ~ [] ()

    beryllia , glazed ~

    beta 1. , ( ) 2. -

    direct-current ~ inverse ~

    bewildering 1. 2. ( )

    bias 1. ; | ; 2. ,() | , automatic ~ back ~ , cutoff ~ etching ~ forward ~ , gate ~ 1. 2. reverse ~ ,

    billet ; () semiconductor ~

    bin , ( )binder ()

    glass [vitreous] ~ binding:

    immutable ~ ; module ~ signal ~

    biochip , ( , )

    bipolar 1. ; , 2.TTL-compatible ~ ,

    bite:mouse ~s ( )

    bit-slice blade 1. ; (

    ) 2. annular ~

    bla

  • 18

    diamond (impregnated) ~ doctor ~ , electrodeposited diamond ~ , multiple ~s ( )peripheral ~ saw ~ ; sintered-diamond ~ ,

    blank 1. ; 2. (. , )antistatic mask ~ screened ramic ~ ULA ~

    blanket:inert-gas ~

    bleeding (. )bleed-out (. )blemish ; (.

    )blister ; (.

    )bloating ; (.

    )block ; ;

    ~ with repetitive structure , (. ,, , )basic ~ building ~ ; contact ~ 1. ( ) 2. contact leakage ~ ( )diffused-resistor ~ ( ) fault-tolerant building ~

    fine dimensional ~ functional ~ large dimensional ~ logic ~ ( )metal quality ~ () pad ~ parametrizable ~ regular ~ test ~ ,

    blockage ( )blower:

    destaticizing ~

    blurring:image ~ pattern ~ penumbral ~

    board ; (. - card)bare ~ ceramic tape multilayer ~ chip ~ composite ~ daughter ~ DIP ~ DIP-edge ~ fine-like ~ (. )high-density ~ hybrid-circuit ~ () known-good ~ loaded ~ mother ~ , ; multiwire ~ populated ~ printed circuit ~ programmable silicon circuit ~ surface-mounted ~ unloaded [unpopulated] ~...

Recommended

View more >