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Global 3D IC Market 2015-2019 -Market Study

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Scope of The Report

• Market landscape of global 3D IC market

• Market size and forecast of global 3D IC market

• Key market highlights of global 3D IC market

• Understanding the challenges faced by the market

• Enabling technologies and the roadmap

• Key focus areas for the vendors

• Major trends that will shape the future of this market

• Vendor landscape and trajectory of the market

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Key Segments

• Global 3D IC market segmentation by products

• Global 3D IC market segmentation by business

• Global 3D IC market segmentation by vendors

• Geographical segmentation of global 3D IC market

Global 3D IC Market 2015-2019 -Market Study

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Growth Rate

Technavio’s research analyst predicts the global 3D IC market to grow at a CAGR above 79% during the forecast period.

CAGR:

Key Vendors and Regions

Vendors Regions

• Advanced Semiconductor

Engineering (ASE)

• Samsung

• STMicroelectronics

• Taiwan Semiconductors

Manufacturing (TSMC)

• Toshiba

• APAC

• Americas

• EMEA

View Our Report:Global 3D IC Market 2015-2019 -

Market Study

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Key Questions Answered in Our Report

• What will the market size be in 2019 and what will thegrowth rate be?

• What are the key market trends?

• What is driving this market?

• What are the challenges to market growth?

• Who are the key vendors in this market space?

• What are the market opportunities and threats faced by thekey vendors?

• What are the strengths and weaknesses of the key vendors?

Have a question of your own about this report?

please drop us a mail atenquiry@technavio.com

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Global 3D IC Market 2015-2019 -Market Study

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